Makoto Iijima

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 7,813,133
- Issue date Oct 12, 2010
- Fujitsu Semiconductor Limited
- Makoto Iijima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming an insulative substrate having conductive filled...
- Patent number 6,693,029
- Issue date Feb 17, 2004
- Fujitsu Limited
- Makoto Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate having differential signal wires and a...
- Patent number 6,573,600
- Issue date Jun 3, 2003
- Fujitsu Limited
- Atsushi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,396,155
- Issue date May 28, 2002
- Fujitsu Limited
- Masaru Nukiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing substrate of the...
- Patent number 6,351,031
- Issue date Feb 26, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 6,347,037
- Issue date Feb 12, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly board with insulator filled through h...
- Patent number 6,184,133
- Issue date Feb 6, 2001
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 6,088,233
- Issue date Jul 11, 2000
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,978,222
- Issue date Nov 2, 1999
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GMR magnetic sensor having an improved sensitivity of magnetic dete...
- Patent number 5,966,275
- Issue date Oct 12, 1999
- Fujitsu Limited
- Makoto Iijima
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Biodegradable resin molded article
- Patent number 5,744,516
- Issue date Apr 28, 1998
- Fujitsu Limited
- Takafumi Hashitani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,729,435
- Issue date Mar 17, 1998
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biodegradable resin molded article
- Patent number 5,545,485
- Issue date Aug 13, 1996
- Fujitsu Limited
- Takafumi Hashitani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electric power plug
- Patent number 4,790,776
- Issue date Dec 13, 1988
- Kawasaki Electric Wire Co., Ltd.
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20070139892
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing substrate of the...
- Publication number 20030087483
- Publication date May 8, 2003
- FUJITSU LIMITED
- Makoto Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate having differential signal wires and a...
- Publication number 20020060366
- Publication date May 23, 2002
- Atsushi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
- Publication number 20020001178
- Publication date Jan 3, 2002
- MAKOTO IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Iijima

Person

Patents Grantslast 30 patents

Semiconductor device

Method of forming an insulative substrate having conductive filled...

Multilayer wiring substrate having differential signal wires and a...

Semiconductor device and method of producing the same

Semiconductor device and method for manufacturing substrate of the...

Semiconductor device and method of forming the same

Method of forming an assembly board with insulator filled through h...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and assembly board having through-holes filled...

GMR magnetic sensor having an improved sensitivity of magnetic dete...

Biodegradable resin molded article

Semiconductor device and assembly board having through-holes filled...

Biodegradable resin molded article

Electric power plug

Patents Applicationslast 30 patents

Semiconductor device

Semiconductor device and method for manufacturing substrate of the...

Multilayer wiring substrate having differential signal wires and a...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.