Malcolm Grief

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing (CMP) of cobalt-containing substrate
- Patent number 10,745,589
- Issue date Aug 18, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite abrasive particles for chemical mechanical planarization...
- Patent number 10,669,449
- Issue date Jun 2, 2020
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite abrasive particles for chemical mechanical planarization...
- Patent number 10,109,493
- Issue date Oct 23, 2018
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low dishing copper chemical mechanical planarization
- Patent number 9,978,609
- Issue date May 22, 2018
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer-scale package including power source
- Patent number 9,431,312
- Issue date Aug 30, 2016
- Medtronic, Inc.
- Richard J O'Brien
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wafer-scale package including power source
- Patent number 9,318,400
- Issue date Apr 19, 2016
- Medtronic, Inc.
- Richard J. O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-scale package including power source
- Patent number 8,666,505
- Issue date Mar 4, 2014
- Medtronic, Inc.
- Richard J. O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Engagement Probes
- Patent number 7,330,036
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing semiconductor circuitry for operab...
- Patent number 7,116,118
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses configured to engage a conductive pad
- Patent number 7,098,475
- Issue date Aug 29, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Engagement probe having a grouping of projecting apexes for engagin...
- Patent number 7,026,835
- Issue date Apr 11, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Multiprobe detection system for chemical-mechanical planarization tool
- Patent number 6,960,115
- Issue date Nov 1, 2005
- SpeedFam-IPEC Corporation
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for testing semiconductor circuitry for operab...
- Patent number 6,833,727
- Issue date Dec 21, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Multiprobe detection system for chemical-mechanical planarization tool
- Patent number 6,805,613
- Issue date Oct 19, 2004
- SpeedFam-IPEC Corporation
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Grant
Engagement probe and apparatuses configured to engage a conductive pad
- Patent number 6,686,758
- Issue date Feb 3, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Methods of engaging electrically conductive pads on a semiconductor...
- Patent number 6,670,819
- Issue date Dec 30, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Methods of engaging electrically conductive test pads on a semicond...
- Patent number 6,657,450
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming apparatuses and a method of engaging electricall...
- Patent number 6,614,249
- Issue date Sep 2, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming an apparatus configured to engage an electrically...
- Patent number 6,573,740
- Issue date Jun 3, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Two-step chemical-mechanical planarization for damascene structures...
- Patent number 6,555,466
- Issue date Apr 29, 2003
- Speedfam Corporation
- Thomas Laursen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engagement probes
- Patent number 6,462,571
- Issue date Oct 8, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming apparatuses and a method of engaging electricall...
- Patent number 6,392,426
- Issue date May 21, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Pad conditioning for copper-based semiconductor wafers
- Patent number 6,387,188
- Issue date May 14, 2002
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Removable electrical interconnect apparatuses including an engageme...
- Patent number 6,380,754
- Issue date Apr 30, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming an apparatus for engaging electrically conductiv...
- Patent number 6,127,195
- Issue date Oct 3, 2000
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Method of engaging electrically conductive test pads on a semicondu...
- Patent number 6,124,721
- Issue date Sep 26, 2000
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for planar end-point detection during chemical...
- Patent number 5,738,562
- Issue date Apr 14, 1998
- Micron Technology, Inc.
- Trung Tri Doan
- B24 - GRINDING POLISHING
Information Patent Grant
Testing apparatus for engaging electrically conductive test pads on...
- Patent number 5,523,697
- Issue date Jun 4, 1996
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Method for chemical planarization (CMP) of a semiconductor wafer to...
- Patent number 5,514,245
- Issue date May 7, 1996
- Micron Technology, Inc.
- Trung T. Doan
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for testing semiconductor circuitry for operability and meth...
- Patent number 5,326,428
- Issue date Jul 5, 1994
- Micron Semiconductor, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Composite Abrasive Particles for Chemical Mechanical Planarization...
- Publication number 20200115590
- Publication date Apr 16, 2020
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate
- Publication number 20170362466
- Publication date Dec 21, 2017
- Versum Materials US, LLC
- Xiaobo Shi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DISHING COPPER CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20160314989
- Publication date Oct 27, 2016
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composite Abrasive Particles For Chemical Mechanical Planarization...
- Publication number 20160200944
- Publication date Jul 14, 2016
- Air Products and Chemicals, Inc.
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER-SCALE PACKAGE INCLUDING POWER SOURCE
- Publication number 20160204004
- Publication date Jul 14, 2016
- Medtronic, Inc.
- Richard J. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Polishing Slurry for Reducing Corrosion and Met...
- Publication number 20160122590
- Publication date May 5, 2016
- Air Products and Chemicals, Inc.
- Blake J. Lew
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER-SCALE PACKAGE INCLUDING POWER SOURCE
- Publication number 20140171822
- Publication date Jun 19, 2014
- Medtronic, Inc.
- Richard J. O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-SCALE PACKAGE INCLUDING POWER SOURCE
- Publication number 20120101540
- Publication date Apr 26, 2012
- Medtronic, Inc.
- Richard J. O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and apparatus for testing semiconductor circuitry for operab...
- Publication number 20040207421
- Publication date Oct 21, 2004
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for testing semiconductor circuitry for operab...
- Publication number 20040174178
- Publication date Sep 9, 2004
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Apparatuses configured to engage a conductive pad
- Publication number 20040095158
- Publication date May 20, 2004
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Multiprobe detection system for chemical-mechanical planarization tool
- Publication number 20040038624
- Publication date Feb 26, 2004
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for testing semiconductor circuitry for operab...
- Publication number 20040021476
- Publication date Feb 5, 2004
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Engagement probes
- Publication number 20030006798
- Publication date Jan 9, 2003
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF ENGAGING ELECTRICALLY CONDUCTIVE TEST PADS ON A SEMICOND...
- Publication number 20020140450
- Publication date Oct 3, 2002
- WARREN M. FARNWORTH
- G01 - MEASURING TESTING
Information Patent Application
Engagement probes
- Publication number 20020093361
- Publication date Jul 18, 2002
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Methods of engaging electrically conductive pads on a semiconductor...
- Publication number 20020067183
- Publication date Jun 6, 2002
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Method of forming an apparatus configured to engage an electrically...
- Publication number 20010050570
- Publication date Dec 13, 2001
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Methods of forming apparatuses and a method of engaging electricall...
- Publication number 20010030550
- Publication date Oct 18, 2001
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Application
Removable electrical interconnect apparatuses and removable engagem...
- Publication number 20010015655
- Publication date Aug 23, 2001
- Warren M. Farnworth
- G01 - MEASURING TESTING

Malcolm Grief

Person

Patents Grantslast 30 patents

Chemical mechanical polishing (CMP) of cobalt-containing substrate

Composite abrasive particles for chemical mechanical planarization...

Composite abrasive particles for chemical mechanical planarization...

Low dishing copper chemical mechanical planarization

Wafer-scale package including power source

Wafer-scale package including power source

Wafer-scale package including power source

Engagement Probes

Method and apparatus for testing semiconductor circuitry for operab...

Apparatuses configured to engage a conductive pad

Engagement probe having a grouping of projecting apexes for engagin...

Multiprobe detection system for chemical-mechanical planarization tool

Method and apparatus for testing semiconductor circuitry for operab...

Multiprobe detection system for chemical-mechanical planarization tool

Engagement probe and apparatuses configured to engage a conductive pad

Methods of engaging electrically conductive pads on a semiconductor...

Methods of engaging electrically conductive test pads on a semicond...

Methods of forming apparatuses and a method of engaging electricall...

Method of forming an apparatus configured to engage an electrically...

Two-step chemical-mechanical planarization for damascene structures...

Engagement probes

Methods of forming apparatuses and a method of engaging electricall...

Pad conditioning for copper-based semiconductor wafers

Removable electrical interconnect apparatuses including an engageme...

Methods of forming an apparatus for engaging electrically conductiv...

Method of engaging electrically conductive test pads on a semicondu...

Apparatus and method for planar end-point detection during chemical...

Testing apparatus for engaging electrically conductive test pads on...

Method for chemical planarization (CMP) of a semiconductor wafer to...

Method for testing semiconductor circuitry for operability and meth...

Patents Applicationslast 30 patents

Composite Abrasive Particles for Chemical Mechanical Planarization...

Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate

LOW DISHING COPPER CHEMICAL MECHANICAL PLANARIZATION

Composite Abrasive Particles For Chemical Mechanical Planarization...

WAFER-SCALE PACKAGE INCLUDING POWER SOURCE

Chemical Mechanical Polishing Slurry for Reducing Corrosion and Met...

WAFER-SCALE PACKAGE INCLUDING POWER SOURCE

WAFER-SCALE PACKAGE INCLUDING POWER SOURCE

Method and apparatus for testing semiconductor circuitry for operab...

Method and apparatus for testing semiconductor circuitry for operab...

Apparatuses configured to engage a conductive pad

Multiprobe detection system for chemical-mechanical planarization tool

Method and apparatus for testing semiconductor circuitry for operab...

Engagement probes

METHODS OF ENGAGING ELECTRICALLY CONDUCTIVE TEST PADS ON A SEMICOND...

Engagement probes

Methods of engaging electrically conductive pads on a semiconductor...

Method of forming an apparatus configured to engage an electrically...

Methods of forming apparatuses and a method of engaging electricall...

Removable electrical interconnect apparatuses and removable engagem...