Mark Pavier

Person

Felbridge, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of environmental protection for silicon MEMS structures in...
- Patent number 12,063,474
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Paul Westmarland
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Emitter package for a photoacoustic sensor
- Patent number 11,609,180
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor assembly with conductive frame for I/O standoff and t...
- Patent number 11,393,743
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Stuart Cardwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,283,432
- Issue date May 7, 2019
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,074,590
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 9,633,951
- Issue date Apr 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive carrier coupled power sw...
- Patent number 9,576,887
- Issue date Feb 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having vertically stacked driver IC
- Patent number 9,502,395
- Issue date Nov 22, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including top-drain configured power FET
- Patent number 9,397,212
- Issue date Jul 19, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable power components
- Patent number 9,362,221
- Issue date Jun 7, 2016
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a power semiconductor package including vert...
- Patent number 9,299,690
- Issue date Mar 29, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including vertically stacked driver IC
- Patent number 9,159,703
- Issue date Oct 13, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive carrier integrated heat spreader
- Patent number 9,111,921
- Issue date Aug 18, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable power components
- Patent number 9,012,990
- Issue date Apr 21, 2015
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with reduced contact resistance
- Patent number 8,836,145
- Issue date Sep 16, 2014
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,552,543
- Issue date Oct 8, 2013
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 8,466,546
- Issue date Jun 18, 2013
- International Rectifier Corporation
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance
- Patent number 8,390,131
- Issue date Mar 5, 2013
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autoclave capable chip-scale package
- Patent number 8,143,729
- Issue date Mar 27, 2012
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IMS formed as can for semiconductor housing
- Patent number 8,089,147
- Issue date Jan 3, 2012
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with integrated heat spreader
- Patent number 8,026,580
- Issue date Sep 27, 2011
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a semiconductor package
- Patent number 7,923,289
- Issue date Apr 12, 2011
- International Rectifier Corporation
- Mark Pavier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power MOSFET with integrated drivers in a common package
- Patent number RE41719
- Issue date Sep 21, 2010
- International Rectifier Corporation
- Daniel Kinzer
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device packages with substrates for redistributing se...
- Patent number 7,745,930
- Issue date Jun 29, 2010
- International Rectifier Corporation
- Norman Glyn Connah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance
- Patent number 7,678,680
- Issue date Mar 16, 2010
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistributed pads
- Patent number 7,678,609
- Issue date Mar 16, 2010
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with integrated heat spreader
- Patent number 7,671,455
- Issue date Mar 2, 2010
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR DIE AN...
- Publication number 20240203836
- Publication date Jun 20, 2024
- Hugh Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE SENSOR DEVICE
- Publication number 20240202485
- Publication date Jun 20, 2024
- INFINEON TECHNOLOGIES AG
- Frank Püschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240145402
- Publication date May 2, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Mark PAVIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ENVIRONMENTAL PROTECTION FOR SILICON MEMS STRUCTURES IN...
- Publication number 20220369042
- Publication date Nov 17, 2022
- INFINEON TECHNOLOGIES AG
- Paul Westmarland
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Three Level Interconnect Clip
- Publication number 20220139811
- Publication date May 5, 2022
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly with Conductive Frame for I/O Standoff and T...
- Publication number 20210193560
- Publication date Jun 24, 2021
- INFINEON TECHNOLOGIES AG
- Stuart Cardwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Emitter Package for a Photoacoustic Sensor
- Publication number 20210172862
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Die being Connected with a Clip and a Wire which is P...
- Publication number 20210175200
- Publication date Jun 10, 2021
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package with chip carrier comprising brazed electrically con...
- Publication number 20190006260
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Mark PAVIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Semiconductor Package with Conductive Carrier
- Publication number 20160155674
- Publication date Jun 2, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Having Vertically Stacked Driver IC
- Publication number 20160035699
- Publication date Feb 4, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...
- Publication number 20160027767
- Publication date Jan 28, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mountable Power Components
- Publication number 20150221588
- Publication date Aug 6, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Reduced Contact Resistance
- Publication number 20150001722
- Publication date Jan 1, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Top-Drain Configured Power FET
- Publication number 20140110788
- Publication date Apr 24, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Vertically Stacked Driver IC
- Publication number 20140110863
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Conductive Carrier Coupled Power Sw...
- Publication number 20140110776
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mountable Power Components
- Publication number 20140103393
- Publication date Apr 17, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Reduced Contact Resistance
- Publication number 20130175690
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE
- Publication number 20090218684
- Publication date Sep 3, 2009
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20080111232
- Publication date May 15, 2008
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with reduced contact resistance
- Publication number 20080017987
- Publication date Jan 24, 2008
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating a semiconductor package
- Publication number 20070231960
- Publication date Oct 4, 2007
- International Rectifier Corporation
- Mark Pavier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Redistributed solder pads using etched lead frame
- Publication number 20070194441
- Publication date Aug 23, 2007
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package including a semiconductor die having redistri...
- Publication number 20070108585
- Publication date May 17, 2007
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS

Mark Pavier

Person

Patents Grantslast 30 patents

Methods of environmental protection for silicon MEMS structures in...

Emitter package for a photoacoustic sensor

Semiconductor assembly with conductive frame for I/O standoff and t...

Molded package with chip carrier comprising brazed electrically con...

Semiconductor package including a semiconductor die having redistri...

Molded package with chip carrier comprising brazed electrically con...

Method for fabricating a semiconductor package with conductive carr...

Semiconductor package including a semiconductor die having redistri...

Semiconductor package including conductive carrier coupled power sw...

Power semiconductor package having vertically stacked driver IC

Power converter package including top-drain configured power FET

Surface mountable power components

Method for fabricating a power semiconductor package including vert...

Method for fabricating a semiconductor package with conductive carr...

Power converter package including vertically stacked driver IC

Semiconductor package with conductive carrier integrated heat spreader

Surface mountable power components

Power semiconductor device with reduced contact resistance

Semiconductor package

Chip-scale package

Semiconductor device with reduced contact resistance

Autoclave capable chip-scale package

IMS formed as can for semiconductor housing

Semiconductor device package with integrated heat spreader

Process for fabricating a semiconductor package

Power MOSFET with integrated drivers in a common package

Semiconductor device packages with substrates for redistributing se...

Semiconductor device with reduced contact resistance

Semiconductor package with redistributed pads

Semiconductor device package with integrated heat spreader

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR DIE AN...

WAFER-LEVEL PACKAGE SENSOR DEVICE

SEMICONDUCTOR DIE SHIELDING STRUCTURE

METHODS OF ENVIRONMENTAL PROTECTION FOR SILICON MEMS STRUCTURES IN...

Three Level Interconnect Clip

Semiconductor Assembly with Conductive Frame for I/O Standoff and T...

Emitter Package for a Photoacoustic Sensor

Semiconductor Die being Connected with a Clip and a Wire which is P...

Molded package with chip carrier comprising brazed electrically con...

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

Fabricating a Semiconductor Package with Conductive Carrier

Power Semiconductor Package Having Vertically Stacked Driver IC

METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

Surface Mountable Power Components

Semiconductor Device with Reduced Contact Resistance

Power Converter Package Including Top-Drain Configured Power FET

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

Power Converter Package Including Vertically Stacked Driver IC

Semiconductor Package Including Conductive Carrier Coupled Power Sw...

Surface Mountable Power Components

Power Semiconductor Device with Reduced Contact Resistance

AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE

Semiconductor package

Semiconductor device with reduced contact resistance

Process for fabricating a semiconductor package

Redistributed solder pads using etched lead frame

Semiconductor package including a semiconductor die having redistri...