Markus Leitgeb

Person

Trofaiach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z-axis interconnection with protruding component
- Patent number 11,864,319
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mario Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-type component carrier and method of manufacturing the same
- Patent number 11,784,132
- Issue date Oct 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating misalignment of component carrier feature by modifying...
- Patent number 11,778,751
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protection layer for panel handling systems
- Patent number 11,682,600
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal mechanism for stack-based electronic device with proce...
- Patent number 11,450,587
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component carrier with exposed layer
- Patent number 11,277,907
- Issue date Mar 15, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with integrated antenna structure
- Patent number 11,264,708
- Issue date Mar 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF functionality and electromagnetic radiation shielding in a compo...
- Patent number 11,201,119
- Issue date Dec 14, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-type component carrier and method of manufacturing the same
- Patent number 11,069,622
- Issue date Jul 20, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with two component carrier portions and a compone...
- Patent number 11,058,007
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with face-up and face-down embedded components
- Patent number 11,037,881
- Issue date Jun 15, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flame retardant structure for component carrier
- Patent number 10,939,563
- Issue date Mar 2, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB-based connector device
- Patent number 10,886,670
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Fischeneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,887,977
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly thermally conductive dielectric structure for heat spreading...
- Patent number 10,880,988
- Issue date Dec 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding known-good component in known-good cavity of known-good c...
- Patent number 10,790,234
- Issue date Sep 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling component carrier material by carbon structure within diele...
- Patent number 10,736,222
- Issue date Aug 4, 2020
- AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with embedded electronic component
- Patent number 10,568,210
- Issue date Feb 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Galler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising a deformation counteracting structure
- Patent number 10,420,206
- Issue date Sep 17, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,383,208
- Issue date Aug 13, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor track with enlargement-free transition between conductor...
- Patent number 10,356,904
- Issue date Jul 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellshaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,321,558
- Issue date Jun 11, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Nikolai Haslebner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,165,685
- Issue date Dec 25, 2018
- Markus Leitgeb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for the production of a circuit board involving the removal...
- Patent number 10,051,747
- Issue date Aug 14, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Matching inclination of cavity sidewall and medium supply device fo...
- Patent number 10,045,443
- Issue date Aug 7, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-finished product for the production of a printed circuit board...
- Patent number 9,763,337
- Issue date Sep 12, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Stefan Jäger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier with Stack-Stack Connection for Connecting Compon...
- Publication number 20240429175
- Publication date Dec 26, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20230413421
- Publication date Dec 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier with Surface Mounted Components Connected By High...
- Publication number 20230298987
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier with Stack-Stack Connection for Connecting Compon...
- Publication number 20230300982
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20230135105
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Bettina Schuster
- G02 - OPTICS
Information Patent Application
Electronic Package with Components Mounted at Two Sides of a Layer...
- Publication number 20230092954
- Publication date Mar 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus LEITGEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20220190464
- Publication date Jun 16, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer-Type Component Carrier and Method of Manufacturing the Same
- Publication number 20210320068
- Publication date Oct 14, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Removal Mechanism for Stack-based Electronic Device With Proce...
- Publication number 20210280490
- Publication date Sep 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compensating Misalignment of Component Carrier Feature by Modifying...
- Publication number 20210174494
- Publication date Jun 10, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With Exposed Layer
- Publication number 20210144849
- Publication date May 13, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module With Single or Multiple Components Partially Surr...
- Publication number 20210084747
- Publication date Mar 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protection Layer for Panel Handling Systems
- Publication number 20210043529
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer-Type Component Carrier and Method of Manufacturing the Same
- Publication number 20200303313
- Publication date Sep 24, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Z-Axis Interconnection With Protruding Component
- Publication number 20200128669
- Publication date Apr 23, 2020
- AT&S Austria Technologies & Systemtechnik Aktiengeschaft
- Mario Schober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mounted Device in Cavity
- Publication number 20200126879
- Publication date Apr 23, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengeschaft
- Mario Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Face-Up and Face-Down Embedded Components
- Publication number 20200111748
- Publication date Apr 9, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF Functionality and Electromagnetic Radiation Shielding in a Compo...
- Publication number 20190378801
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Track With Enlargement-Free Transition Between Conductor...
- Publication number 20190306983
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Component Carrier and Method for Manufacturing the Same
- Publication number 20190297719
- Publication date Sep 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly Thermally Conductive Dielectric Structure for Heat Spreading...
- Publication number 20190223285
- Publication date Jul 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Sivano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flame Retardant Structure For Component Carrier
- Publication number 20190223298
- Publication date Jul 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Component Carrier Material by Carbon Structure Within Diele...
- Publication number 20190174638
- Publication date Jun 6, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Known-Good Component in Known-Good Cavity of Known-Good C...
- Publication number 20190148304
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Two Component Carrier Portions and a Compone...
- Publication number 20190141836
- Publication date May 9, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20190110366
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having a Three Dimensionally Printed Wiring Struc...
- Publication number 20190110367
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Markus Leitgeb

Person

Patents Grantslast 30 patents

Component carrier with stack-stack connection for connecting compon...

Z-axis interconnection with protruding component

Interposer-type component carrier and method of manufacturing the same

Compensating misalignment of component carrier feature by modifying...

Protection layer for panel handling systems

Component embedded in component carrier and having an exposed side...

Electronic module with single or multiple components partially surr...

Heat removal mechanism for stack-based electronic device with proce...

Component carrier having a three dimensionally printed wiring struc...

Component carrier with exposed layer

Component carrier with integrated antenna structure

RF functionality and electromagnetic radiation shielding in a compo...

Interposer-type component carrier and method of manufacturing the same

Component carrier with two component carrier portions and a compone...

Component carrier with face-up and face-down embedded components

Flame retardant structure for component carrier

PCB-based connector device

Hybrid component carrier and method for manufacturing the same

Highly thermally conductive dielectric structure for heat spreading...

Embedding known-good component in known-good cavity of known-good c...

Cooling component carrier material by carbon structure within diele...

Electronic device with embedded electronic component

Component carrier comprising a deformation counteracting structure

Hybrid component carrier and method for manufacturing the same

Conductor track with enlargement-free transition between conductor...

Printed circuit board

Printed circuit board

Method for the production of a circuit board involving the removal...

Matching inclination of cavity sidewall and medium supply device fo...

Semi-finished product for the production of a printed circuit board...

Patents Applicationslast 30 patents

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

Component Carrier with Stack-Stack Connection for Connecting Compon...

Component Carrier With Continuously Extending Vertical Connection S...

Component Carrier For Waveguide Applications

Component Carrier For Waveguide Applications

Component Carrier with Surface Mounted Components Connected By High...

Component Carrier with Stack-Stack Connection for Connecting Compon...

Component Embedded in Component Carrier and Having an Exposed Side...

Electronic Package with Components Mounted at Two Sides of a Layer...

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Interposer-Type Component Carrier and Method of Manufacturing the Same

Heat Removal Mechanism for Stack-based Electronic Device With Proce...

Compensating Misalignment of Component Carrier Feature by Modifying...

Component Carrier With Exposed Layer

Electronic Module With Single or Multiple Components Partially Surr...

Protection Layer for Panel Handling Systems

Interposer-Type Component Carrier and Method of Manufacturing the Same

Z-Axis Interconnection With Protruding Component

Surface Mounted Device in Cavity

Component Carrier With Face-Up and Face-Down Embedded Components

RF Functionality and Electromagnetic Radiation Shielding in a Compo...

Conductor Track With Enlargement-Free Transition Between Conductor...

Hybrid Component Carrier and Method for Manufacturing the Same

Highly Thermally Conductive Dielectric Structure for Heat Spreading...

Flame Retardant Structure For Component Carrier

Cooling Component Carrier Material by Carbon Structure Within Diele...

Embedding Known-Good Component in Known-Good Cavity of Known-Good C...

Component Carrier With Two Component Carrier Portions and a Compone...

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Component Carrier Having a Three Dimensionally Printed Wiring Struc...