Masahide Okamoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Junction material, manufacturing method thereof, and manufacturing...
- Patent number 9,393,645
- Issue date Jul 19, 2016
- Hitachi Metals, Ltd.
- Takuto Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting member for connecting a semiconductor element and a fram...
- Patent number 8,525,330
- Issue date Sep 3, 2013
- Hitachi, Ltd.
- Masahide Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal strip, connector, and method of manufacturing metal strip
- Patent number 8,389,854
- Issue date Mar 5, 2013
- Hitachi, Ltd.
- Masahide Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing a semiconductor device using an Al-Zn conn...
- Patent number 8,356,742
- Issue date Jan 22, 2013
- Hitachi, Ltd.
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder foil, semiconductor device and electronic device
- Patent number 7,722,962
- Issue date May 25, 2010
- Renesas Technology Corp.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 7,579,677
- Issue date Aug 25, 2009
- Renesas Technology Corp.
- Osamu Ikeda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,274,103
- Issue date Sep 25, 2007
- Renesas Technology Corp.
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,256,501
- Issue date Aug 14, 2007
- Renesas Technology Corp.
- Masahide Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method using lead-free solder
- Patent number 7,131,566
- Issue date Nov 7, 2006
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave soldering method using lead-free solder, apparatus therefor, a...
- Patent number 7,048,173
- Issue date May 23, 2006
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,774,490
- Issue date Aug 10, 2004
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing via interconnection of glass-ceramic wiring...
- Patent number 6,658,733
- Issue date Dec 9, 2003
- Hitachi, Ltd.
- Norihiro Ami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method using lead-free solder
- Patent number 6,585,149
- Issue date Jul 1, 2003
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Product using Zn-Al alloy solder
- Patent number 6,563,225
- Issue date May 13, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electron device and semiconductor device
- Patent number 6,555,052
- Issue date Apr 29, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-ceramic wiring board
- Patent number 6,384,347
- Issue date May 7, 2002
- Hitachi, Ltd.
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramics substrate with electronic circuit and its manufacturing me...
- Patent number 6,248,960
- Issue date Jun 19, 2001
- Hitachi, Ltd.
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and manufacture thereof, ceramic composition for...
- Patent number 6,118,671
- Issue date Sep 12, 2000
- Hitachi, Ltd.
- Hirayoshi Tanei
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit substrate and electronics computer, using sintered glass ce...
- Patent number 5,825,632
- Issue date Oct 20, 1998
- Hitachi, Ltd.
- Hirayoshi Tanei
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Electronic circuit device
- Patent number 5,731,066
- Issue date Mar 24, 1998
- Hitachi, Ltd.
- Akihiro Ando
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer ceramic body with convex side faces
- Patent number 5,277,723
- Issue date Jan 11, 1994
- Hitachi, Ltd.
- Hironori Kodama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor package and computer using it
- Patent number 5,097,318
- Issue date Mar 17, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Assembly for Prognostics of Solder Joint
- Publication number 20160146878
- Publication date May 26, 2016
- Hitachi, Ltd
- Lina Jaya DIGUNA
- G01 - MEASURING TESTING
Information Patent Application
LEACHING SOLUTION AND METAL RECOVERY METHOD
- Publication number 20130287654
- Publication date Oct 31, 2013
- Yasuko Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...
- Publication number 20130256390
- Publication date Oct 3, 2013
- Hitachi Cable, Ltd.
- Takuto Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Lithium Extraction Method, and Metal Recovery Method
- Publication number 20130206607
- Publication date Aug 15, 2013
- Hitachi, Ltd
- Yasuko Kojima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...
- Publication number 20130127026
- Publication date May 23, 2013
- Osamu Ikeda
- B32 - LAYERED PRODUCTS
Information Patent Application
CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20120098134
- Publication date Apr 26, 2012
- Masahide Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...
- Publication number 20120000965
- Publication date Jan 5, 2012
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Strip, Connector, and Method of Manufacturing Metal Strip
- Publication number 20100175908
- Publication date Jul 15, 2010
- Hitachi, Ltd
- Masahide Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL,...
- Publication number 20080206590
- Publication date Aug 28, 2008
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device And Production Method For Semiconductor Device
- Publication number 20080122050
- Publication date May 29, 2008
- Osamu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing thereof
- Publication number 20070089811
- Publication date Apr 26, 2007
- Osamu Ikeda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060186550
- Publication date Aug 24, 2006
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20060138532
- Publication date Jun 29, 2006
- Masahide Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder foil semiconductor device and electronic device
- Publication number 20060061974
- Publication date Mar 23, 2006
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging method using lead-free solder
- Publication number 20030201310
- Publication date Oct 30, 2003
- Hitachi, Ltd
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and electronic device, and method of manufacturing same
- Publication number 20030184986
- Publication date Oct 2, 2003
- Hitachi, Ltd
- Tasao Soga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electron device and semiconductor device
- Publication number 20030186072
- Publication date Oct 2, 2003
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wave soldering method using lead-free solder, apparatus therefor, a...
- Publication number 20030116352
- Publication date Jun 26, 2003
- Hitachi, Ltd
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging method using lead-free solder
- Publication number 20030034381
- Publication date Feb 20, 2003
- Tetsuya Nakatsuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Product using Zn-Al alloy solder
- Publication number 20020149114
- Publication date Oct 17, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electron device and semiconductor device
- Publication number 20020066583
- Publication date Jun 6, 2002
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing via interconnnection of glass-ceramic wirin...
- Publication number 20010033891
- Publication date Oct 25, 2001
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass-ceramic wiring board
- Publication number 20010025722
- Publication date Oct 4, 2001
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS

Masahide Okamoto

Person

Patents Grantslast 30 patents

Junction material, manufacturing method thereof, and manufacturing...

Connecting member for connecting a semiconductor element and a fram...

Metal strip, connector, and method of manufacturing metal strip

Method for manufacturing a semiconductor device using an Al-Zn conn...

Solder foil, semiconductor device and electronic device

Semiconductor device and method for manufacturing thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Packaging method using lead-free solder

Wave soldering method using lead-free solder, apparatus therefor, a...

Electronic device

Method of manufacturing via interconnection of glass-ceramic wiring...

Packaging method using lead-free solder

Product using Zn-Al alloy solder

Electron device and semiconductor device

Glass-ceramic wiring board

Ceramics substrate with electronic circuit and its manufacturing me...

Circuit substrate and manufacture thereof, ceramic composition for...

Circuit substrate and electronics computer, using sintered glass ce...

Electronic circuit device

Method for producing multilayer ceramic body with convex side faces

Semiconductor package and computer using it

Patents Applicationslast 30 patents

Electronic Assembly for Prognostics of Solder Joint

LEACHING SOLUTION AND METAL RECOVERY METHOD

JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...

Lithium Extraction Method, and Metal Recovery Method

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...

CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...

Metal Strip, Connector, and Method of Manufacturing Metal Strip

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL,...

Semiconductor Device And Production Method For Semiconductor Device

Semiconductor device and method for manufacturing thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Solder foil semiconductor device and electronic device

Packaging method using lead-free solder

Circuit board and electronic device, and method of manufacturing same

Electron device and semiconductor device

Wave soldering method using lead-free solder, apparatus therefor, a...

Packaging method using lead-free solder

Product using Zn-Al alloy solder

Electron device and semiconductor device

Method of manufacturing via interconnnection of glass-ceramic wirin...

Glass-ceramic wiring board