Masahiro Ichitani

Person

Kodaira, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 7,615,872
- Issue date Nov 10, 2009
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,479,705
- Issue date Jan 20, 2009
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,286,386
- Issue date Oct 23, 2007
- Renesas Technology Corp.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked large-scale integrated circuit (LSI) semiconductor device w...
- Patent number 7,061,785
- Issue date Jun 13, 2006
- Renesas Technology Corp.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 7,015,069
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package including forming a r...
- Patent number 6,887,739
- Issue date May 3, 2005
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 6,872,597
- Issue date Mar 29, 2005
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a resin encapsulated semiconductor device t...
- Patent number 6,764,878
- Issue date Jul 20, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having resin sealing body
- Patent number 6,759,279
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a mold
- Patent number 6,723,583
- Issue date Apr 20, 2004
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and mounting board
- Patent number 6,621,160
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using reinforcing pa...
- Patent number 6,596,561
- Issue date Jul 22, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,590,275
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,563,212
- Issue date May 13, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,512,176
- Issue date Jan 28, 2003
- Hitachi, Ltd.
- Akihiro Yaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,476,466
- Issue date Nov 5, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,448,111
- Issue date Sep 10, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,437,428
- Issue date Aug 20, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof and mounting board
- Patent number 6,404,049
- Issue date Jun 11, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,340,793
- Issue date Jan 22, 2002
- Hitachi, Ltd.
- Akihiro Yaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,326,681
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,303,982
- Issue date Oct 16, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounted on a flexible substrate...
- Patent number 6,232,650
- Issue date May 15, 2001
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,204,552
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,130,114
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a resin sealing member which exposes...
- Patent number 6,124,629
- Issue date Sep 26, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,120,301
- Issue date Sep 19, 2000
- Hitachi, Ltd.
- Masahiro Ichitani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20090091031
- Publication date Apr 9, 2009
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060180943
- Publication date Aug 17, 2006
- RENESAS TECHNOLOGY CORP.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20050127535
- Publication date Jun 16, 2005
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050046023
- Publication date Mar 3, 2005
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20040164428
- Publication date Aug 26, 2004
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040027869
- Publication date Feb 12, 2004
- Hitachi, Ltd.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040005733
- Publication date Jan 8, 2004
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20030205797
- Publication date Nov 6, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020192872
- Publication date Dec 19, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a resin encapsulated semiconductor device t...
- Publication number 20020182776
- Publication date Dec 5, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020105070
- Publication date Aug 8, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020079579
- Publication date Jun 27, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20020074650
- Publication date Jun 20, 2002
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020070462
- Publication date Jun 13, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020066955
- Publication date Jun 6, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020056561
- Publication date May 16, 2002
- Akihiro Yaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20010015489
- Publication date Aug 23, 2001
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20010008302
- Publication date Jul 19, 2001
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro Ichitani

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Semiconductor device

Stacked large-scale integrated circuit (LSI) semiconductor device w...

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Method of manufacturing semiconductor package including forming a r...

Method of manufacturing a semiconductor device and a semiconductor...

Method of manufacturing a resin encapsulated semiconductor device t...

Method of manufacturing semiconductor device having resin sealing body

Method of manufacturing a semiconductor device using a mold

Semiconductor device

Semiconductor device and mounting board

Method of manufacturing a semiconductor device using reinforcing pa...

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device

Semiconductor device

Semiconductor device

Ball grid array type semiconductor package having a flexible substrate

Method of manufacturing a semiconductor device

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device having a chip mounted on a flexible substrate...

Semiconductor device

Semiconductor device

Semiconductor device including a resin sealing member which exposes...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

Semiconductor device

Semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing a resin encapsulated semiconductor device t...

Semiconductor device, manufacturing method thereof and mounting board

Ball grid array type semiconductor package having a flexible substrate

Method of manufacturing a semiconductor device and a semiconductor...

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device