Masashi Sahara

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a back electrode including Au-Sb alloy...
- Patent number 11,217,670
- Issue date Jan 4, 2022
- Renesas Electronics Corporation
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,669,659
- Issue date Mar 11, 2014
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pads overlapping wiring layers including...
- Patent number 8,183,691
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,759,804
- Issue date Jul 20, 2010
- Renesas Technology Corp.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,750,427
- Issue date Jul 6, 2010
- Renesas Technology Corp.
- Kozo Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,705,462
- Issue date Apr 27, 2010
- Renesas Technology Corp.
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,615,848
- Issue date Nov 10, 2009
- Renesas Technology Corp.
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,504,297
- Issue date Mar 17, 2009
- Renesas Technology Corp.
- Kozo Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with guard rings that are formed in each of th...
- Patent number 7,400,046
- Issue date Jul 15, 2008
- Renesas Technology Corp.
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,342,302
- Issue date Mar 11, 2008
- Renesas Technology Corp.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,303,986
- Issue date Dec 4, 2007
- Renesas Technology Corp.
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,241,685
- Issue date Jul 10, 2007
- Renesas Technology Corp.
- Hiroshi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a multi-layer...
- Patent number 7,189,637
- Issue date Mar 13, 2007
- Renesas Technology Corp.
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and the process of the same
- Patent number 7,132,341
- Issue date Nov 7, 2006
- Renesas Technology Corp.
- Masashi Sahara
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,102,223
- Issue date Sep 5, 2006
- Renesas Technology Corp.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having aluminum conductors
- Patent number 7,064,437
- Issue date Jun 20, 2006
- Hitachi, Ltd.
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,897,570
- Issue date May 24, 2005
- Renesas Technology, Corporation
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having aluminum alloy conductors
- Patent number 6,856,021
- Issue date Feb 15, 2005
- Renesas Technology Corp.
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a capacitor and a metal interconnect la...
- Patent number 6,784,549
- Issue date Aug 31, 2004
- Renesas Technology Corp.
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,780,757
- Issue date Aug 24, 2004
- Renesas Technology Corp.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,617,691
- Issue date Sep 9, 2003
- Hitachi, Ltd.
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,583,049
- Issue date Jun 24, 2003
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a capacitor and a metal interconnect la...
- Patent number 6,548,904
- Issue date Apr 15, 2003
- Hitachi, Ltd.
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,545,362
- Issue date Apr 8, 2003
- Hitachi, Ltd.
- Hiroshi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method for making the same
- Patent number 6,538,329
- Issue date Mar 25, 2003
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor integrated circuit device for...
- Patent number 6,503,803
- Issue date Jan 7, 2003
- Hitachi, Ltd.
- Hiromi Todorobaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a capacitor and an interconnect layer w...
- Patent number 6,476,492
- Issue date Nov 5, 2002
- Hitachi, Ltd.
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved arrangements to avoid breakage o...
- Patent number 6,472,754
- Issue date Oct 29, 2002
- Hitachi, Ltd.
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 6,429,476
- Issue date Aug 6, 2002
- Hitachi, Ltd.
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200203491
- Publication date Jun 25, 2020
- RENESAS ELECTRONICS CORPORATION
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160284652
- Publication date Sep 29, 2016
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140159245
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20120205788
- Publication date Aug 16, 2012
- RENESAS ELECTRONICS CORPORATION HITACHI ULSI SYSTEMS CO., LTD.
- TAKU KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20100252924
- Publication date Oct 7, 2010
- RENESAS TECHNOLOGY CORP.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090152644
- Publication date Jun 18, 2009
- RENESAS TECHNOLOGY CORP.
- Kozo Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20080277794
- Publication date Nov 13, 2008
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20080122085
- Publication date May 29, 2008
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070246780
- Publication date Oct 25, 2007
- RENESAS TECHNOLOGY CORP.
- Kozo Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070228574
- Publication date Oct 4, 2007
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070066050
- Publication date Mar 22, 2007
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and a Method of Manufacturing the Same
- Publication number 20060289998
- Publication date Dec 28, 2006
- RENESAS TECHNOLOGY CORP.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20040235289
- Publication date Nov 25, 2004
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040121571
- Publication date Jun 24, 2004
- Ken Uchikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20030230809
- Publication date Dec 18, 2003
- Hitachi, Ltd
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20030199161
- Publication date Oct 23, 2003
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030170980
- Publication date Sep 11, 2003
- Hiroshi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a capacitor and a metal interconnect la...
- Publication number 20030160267
- Publication date Aug 28, 2003
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a capacitor and a metal interconnect la...
- Publication number 20030020167
- Publication date Jan 30, 2003
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030015801
- Publication date Jan 23, 2003
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and the process of manufact...
- Publication number 20020190295
- Publication date Dec 19, 2002
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having aluminum conductors
- Publication number 20020167091
- Publication date Nov 14, 2002
- Tomio Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20020115281
- Publication date Aug 22, 2002
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and the process of the same
- Publication number 20020048947
- Publication date Apr 25, 2002
- Masashi Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020036350
- Publication date Mar 28, 2002
- Hiroshi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020024140
- Publication date Feb 28, 2002
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method for making the same
- Publication number 20020019124
- Publication date Feb 14, 2002
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and the process of manufact...
- Publication number 20010050386
- Publication date Dec 13, 2001
- Masayuki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device for connecting semiconducto...
- Publication number 20010023958
- Publication date Sep 27, 2001
- Hiromi Todorobaru
- H01 - BASIC ELECTRIC ELEMENTS

Masashi Sahara

Person

Patents Grantslast 30 patents

Semiconductor device having a back electrode including Au-Sb alloy...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device with pads overlapping wiring layers including...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device with guard rings that are formed in each of th...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device having a multi-layer...

Semiconductor integrated circuit device and the process of the same

Semiconductor device and a method of manufacturing the same

Semiconductor device having aluminum conductors

Semiconductor device and method of manufacturing same

Semiconductor device having aluminum alloy conductors

Semiconductor device having a capacitor and a metal interconnect la...

Semiconductor integrated circuit device and method for making the same

Semiconductor device

Semiconductor integrated circuit device and method for making the same

Semiconductor device having a capacitor and a metal interconnect la...

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device and method for making the same

Method of fabricating a semiconductor integrated circuit device for...

Semiconductor device having a capacitor and an interconnect layer w...

Semiconductor device with improved arrangements to avoid breakage o...

Semiconductor integrated circuit device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor Device and a Method of Manufacturing the Same

Semiconductor integrated circuit device and method for making the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of manufacturing same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device having a capacitor and a metal interconnect la...

Semiconductor device having a capacitor and a metal interconnect la...

Semiconductor device

Semiconductor integrated circuit device and the process of manufact...

Semiconductor device having aluminum conductors

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device and the process of the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor integrated circuit device and method for making the same

Semiconductor integrated circuit device and the process of manufact...

Semiconductor integrated circuit device for connecting semiconducto...