Masud Beroz

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield substrate assembly
- Patent number 10,748,858
- Issue date Aug 18, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield substrate assembly
- Patent number 10,396,041
- Issue date Aug 27, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid pressure activated electrical contact devices and methods
- Patent number 10,128,601
- Issue date Nov 13, 2018
- Componentzee, LLC
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid pressure activated electrical contact devices and methods
- Patent number 10,003,149
- Issue date Jun 19, 2018
- Componentzee, LLC
- Masud Beroz
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Inverted optical device
- Patent number 9,947,643
- Issue date Apr 17, 2018
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading substrate with embedded interconnects
- Patent number 9,842,745
- Issue date Dec 12, 2017
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiplexing, switching and testing devices and methods using fluid...
- Patent number 9,805,891
- Issue date Oct 31, 2017
- Componentzee, LLC
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum efficiency of multiple quantum wells
- Patent number 9,583,671
- Issue date Feb 28, 2017
- Invensas Corporation
- Liang Wang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fluid pressure activated electrical contact devices and methods
- Patent number 9,577,358
- Issue date Feb 21, 2017
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 9,570,416
- Issue date Feb 14, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted optical device
- Patent number 9,293,641
- Issue date Mar 22, 2016
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 9,153,562
- Issue date Oct 6, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum efficiency of multiple quantum wells
- Patent number 8,975,616
- Issue date Mar 10, 2015
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional interposer device
- Patent number 8,963,013
- Issue date Feb 24, 2015
- Masud Beroz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreading substrate with embedded interconnects
- Patent number 8,946,757
- Issue date Feb 3, 2015
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 8,927,337
- Issue date Jan 6, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front facing piggyback wafer assembly
- Patent number 8,912,024
- Issue date Dec 16, 2014
- Invensas Corporation
- Ilyas Mohammed
- F21 - LIGHTING
Information Patent Grant
High yield substrate assembly
- Patent number 8,900,974
- Issue date Dec 2, 2014
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield substrate assembly
- Patent number 8,841,204
- Issue date Sep 23, 2014
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 8,531,020
- Issue date Sep 10, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 8,525,314
- Issue date Sep 3, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,329,581
- Issue date Dec 11, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package comprising offset conductive posts on compl...
- Patent number 8,207,604
- Issue date Jun 26, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small chips with fan-out leads
- Patent number 8,039,363
- Issue date Oct 18, 2011
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic connection component
- Patent number 8,039,959
- Issue date Oct 18, 2011
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,999,397
- Issue date Aug 16, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for increasing the number of IO-s on a ball grid...
- Patent number 7,989,940
- Issue date Aug 2, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of circuitry with modification of feature height
- Patent number 7,816,251
- Issue date Oct 19, 2010
- Tessera, Inc.
- Belgacem Haba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for forming connection structures for microelectronic devices
- Patent number 7,793,414
- Issue date Sep 14, 2010
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH YIELD SUBSTRATE ASSEMBLY
- Publication number 20190341361
- Publication date Nov 7, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid Pressure Activated Electrical Contact Devices and Methods
- Publication number 20180048084
- Publication date Feb 15, 2018
- ComponentZee, LLC
- Masud Beroz
- G01 - MEASURING TESTING
Information Patent Application
CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMB...
- Publication number 20170330836
- Publication date Nov 16, 2017
- Nuvotronics, INC
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SUBSTRATE ASSEMBLY
- Publication number 20170179046
- Publication date Jun 22, 2017
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED OPTICAL DEVICE
- Publication number 20160204091
- Publication date Jul 14, 2016
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid Pressure Activated Electrical Contact Devices and Methods
- Publication number 20160118737
- Publication date Apr 28, 2016
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLEXING, SWITCHING AND TESTING DEVICES AND METHODS USING FLUID...
- Publication number 20160118210
- Publication date Apr 28, 2016
- Masud Beroz
- G01 - MEASURING TESTING
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20160035692
- Publication date Feb 4, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES
- Publication number 20150263252
- Publication date Sep 17, 2015
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT FACING PIGGYBACK WAFER ASSEMBLY
- Publication number 20150228633
- Publication date Aug 13, 2015
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SUBSTRATE ASSEMBLY
- Publication number 20150171027
- Publication date Jun 18, 2015
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS
- Publication number 20150171265
- Publication date Jun 18, 2015
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreading substrate with embedded interconnects
- Publication number 20150132894
- Publication date May 14, 2015
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20150102508
- Publication date Apr 16, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES
- Publication number 20140008676
- Publication date Jan 9, 2014
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS
- Publication number 20140008607
- Publication date Jan 9, 2014
- Invensas Corporation
- Liang Wang
- B82 - NANO-TECHNOLOGY
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20130344682
- Publication date Dec 26, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SUBSTRATE ASSEMBLY
- Publication number 20130288412
- Publication date Oct 31, 2013
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS
- Publication number 20130214296
- Publication date Aug 22, 2013
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SUBSTRATE ASSEMBLY
- Publication number 20130126867
- Publication date May 23, 2013
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED OPTICAL DEVICE
- Publication number 20130126921
- Publication date May 23, 2013
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT FACING PIGGYBACK WAFER ASSEMBLY
- Publication number 20130127364
- Publication date May 23, 2013
- Invensas Corporation
- Ilyas Mohammed
- F21 - LIGHTING
Information Patent Application
THREE DIMENSIONAL INTERPOSER DEVICE, CHIP PACKAGE AND PROBE CARD CO...
- Publication number 20120138343
- Publication date Jun 7, 2012
- Masud Beroz
- Masud Beroz
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20110269272
- Publication date Nov 3, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20110042810
- Publication date Feb 24, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20100258956
- Publication date Oct 14, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Packaging Improvements
- Publication number 20090104736
- Publication date Apr 23, 2009
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of circuitry with modification of feature height
- Publication number 20090071000
- Publication date Mar 19, 2009
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission line stacking
- Publication number 20080296748
- Publication date Dec 4, 2008
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and assemblies including lidded chips
- Publication number 20080296717
- Publication date Dec 4, 2008
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS

Masud Beroz

Person

Patents Grantslast 30 patents

CTE compensation for wafer-level and chip-scale packages and assemb...

High yield substrate assembly

High yield substrate assembly

Fluid pressure activated electrical contact devices and methods

Fluid pressure activated electrical contact devices and methods

Inverted optical device

Heat spreading substrate with embedded interconnects

Multiplexing, switching and testing devices and methods using fluid...

Quantum efficiency of multiple quantum wells

Fluid pressure activated electrical contact devices and methods

Stacked packaging improvements

Inverted optical device

Stacked packaging improvements

Quantum efficiency of multiple quantum wells

Three dimensional interposer device

Heat spreading substrate with embedded interconnects

Stacked packaging improvements

Front facing piggyback wafer assembly

High yield substrate assembly

High yield substrate assembly

Stacked packaging improvements

Stacked packaging improvements

Microelectronic packages and methods therefor

Microelectronic package comprising offset conductive posts on compl...

Small chips with fan-out leads

Microelectronic connection component

Microelectronic packages and methods therefor

System and method for increasing the number of IO-s on a ball grid...

Formation of circuitry with modification of feature height

Methods for forming connection structures for microelectronic devices

Patents Applicationslast 30 patents

HIGH YIELD SUBSTRATE ASSEMBLY

Fluid Pressure Activated Electrical Contact Devices and Methods

CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMB...

HIGH YIELD SUBSTRATE ASSEMBLY

INVERTED OPTICAL DEVICE

Fluid Pressure Activated Electrical Contact Devices and Methods

MULTIPLEXING, SWITCHING AND TESTING DEVICES AND METHODS USING FLUID...

STACKED PACKAGING IMPROVEMENTS

OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES

FRONT FACING PIGGYBACK WAFER ASSEMBLY

HIGH YIELD SUBSTRATE ASSEMBLY

QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS

Heat spreading substrate with embedded interconnects

STACKED PACKAGING IMPROVEMENTS

OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES

QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS

STACKED PACKAGING IMPROVEMENTS

HIGH YIELD SUBSTRATE ASSEMBLY

HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS

HIGH YIELD SUBSTRATE ASSEMBLY

INVERTED OPTICAL DEVICE

FRONT FACING PIGGYBACK WAFER ASSEMBLY

THREE DIMENSIONAL INTERPOSER DEVICE, CHIP PACKAGE AND PROBE CARD CO...

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

STACKED PACKAGING IMPROVEMENTS

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

Stacked Packaging Improvements

Formation of circuitry with modification of feature height

Transmission line stacking

Packages and assemblies including lidded chips