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Matt E. Schwab
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
10,763,185
Issue date
Sep 1, 2020
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
10,692,827
Issue date
Jun 23, 2020
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
10,312,173
Issue date
Jun 4, 2019
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System in package (SIP) with dual laminate interposers
Patent number
10,297,574
Issue date
May 21, 2019
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
10,163,826
Issue date
Dec 25, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
9,960,094
Issue date
May 1, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
9,812,415
Issue date
Nov 7, 2017
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
9,362,208
Issue date
Jun 7, 2016
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
8,987,885
Issue date
Mar 24, 2015
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,866,272
Issue date
Oct 21, 2014
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System in package (SIP) with dual laminate interposers
Patent number
8,735,183
Issue date
May 27, 2014
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
8,354,301
Issue date
Jan 15, 2013
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module and methods
Patent number
8,048,715
Issue date
Nov 1, 2011
Round Rock Research, LLC
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
7,955,898
Issue date
Jun 7, 2011
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,944,057
Issue date
May 17, 2011
Round Rock Research, LLC
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
7,868,440
Issue date
Jan 11, 2011
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,851,922
Issue date
Dec 14, 2010
Round Rock Research, LLC
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor components having substantially rigid suppor...
Patent number
7,750,449
Issue date
Jul 6, 2010
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module and methods
Patent number
7,619,313
Issue date
Nov 17, 2009
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,423,336
Issue date
Sep 9, 2008
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Routing element for use in semiconductor device assemblies
Patent number
7,372,131
Issue date
May 13, 2008
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Routing element for use in multi-chip modules, multi-chip modules i...
Patent number
7,372,138
Issue date
May 13, 2008
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit device having reduced bow and method for making...
Patent number
7,344,921
Issue date
Mar 18, 2008
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor device having an opening in a sold...
Patent number
7,335,571
Issue date
Feb 26, 2008
Micron Technology, Inc.
Brad D. Rumsey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
Patent number
7,282,397
Issue date
Oct 16, 2007
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element and stacked semiconductor device assembl...
Patent number
7,282,805
Issue date
Oct 16, 2007
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor device having an opening in a sold...
Patent number
7,263,768
Issue date
Sep 4, 2007
Micron Technology, Inc.
Brad D. Rumsey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabricating a carrier substrate by using a solder resist opening as...
Patent number
7,146,720
Issue date
Dec 12, 2006
Micron Technology, Inc.
Brad D. Rumsey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit device having reduced bow and method for making...
Patent number
7,095,097
Issue date
Aug 22, 2006
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
Patent number
7,094,631
Issue date
Aug 22, 2006
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20190252281
Publication date
Aug 15, 2019
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
Publication number
20190237436
Publication date
Aug 1, 2019
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20190081015
Publication date
Mar 14, 2019
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20180211896
Publication date
Jul 26, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20180040582
Publication date
Feb 8, 2018
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20160254204
Publication date
Sep 1, 2016
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20150364403
Publication date
Dec 17, 2015
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20150021769
Publication date
Jan 22, 2015
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
Publication number
20140225282
Publication date
Aug 14, 2014
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
Publication number
20130193581
Publication date
Aug 1, 2013
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20110233740
Publication date
Sep 29, 2011
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
Publication number
20110104857
Publication date
May 5, 2011
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20100255636
Publication date
Oct 7, 2010
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
Publication number
20100078792
Publication date
Apr 1, 2010
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULE AND METHODS
Publication number
20100055837
Publication date
Mar 4, 2010
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
Publication number
20090008797
Publication date
Jan 8, 2009
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System in package (SIP) with dual laminate interposers
Publication number
20080254571
Publication date
Oct 16, 2008
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
Publication number
20080224291
Publication date
Sep 18, 2008
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20080224329
Publication date
Sep 18, 2008
Micron Technology, Inc.
Matt E. Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged microdevices and methods for manufacturing packaged microd...
Publication number
20080048316
Publication date
Feb 28, 2008
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip module and methods
Publication number
20060261492
Publication date
Nov 23, 2006
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for designing bond pad rerouting elements for use in stacke...
Publication number
20060166404
Publication date
Jul 27, 2006
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having reduced bow and method for making...
Publication number
20060141673
Publication date
Jun 29, 2006
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bond pad rerouting element and stacked semiconductor device assembl...
Publication number
20060113650
Publication date
Jun 1, 2006
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Routing element for use in semiconductor device assemblies
Publication number
20050156295
Publication date
Jul 21, 2005
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Routing element for use in multi-chip modules, multi-chip modules i...
Publication number
20050156293
Publication date
Jul 21, 2005
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-chip module and methods
Publication number
20050146009
Publication date
Jul 7, 2005
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having reduced bow and method for making...
Publication number
20050023653
Publication date
Feb 3, 2005
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a semiconductor device having an opening in a sold...
Publication number
20050022379
Publication date
Feb 3, 2005
Brad D. Rumsey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making a semiconductor device having an opening in a sold...
Publication number
20050014348
Publication date
Jan 20, 2005
Brad D. Rumsey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR