Matthew Michael Nowak

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,903,240
- Issue date Jan 26, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of through glass via (TGV) filter and acoustic filter
- Patent number 10,582,609
- Issue date Mar 3, 2020
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated semiconductor devices and method of fabricating the same
- Patent number 10,546,852
- Issue date Jan 28, 2020
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,332,911
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic integrated emitter-detector array in a flexible substrat...
- Patent number 10,271,745
- Issue date Apr 30, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Compartment shielding in flip-chip (FC) module
- Patent number 10,242,957
- Issue date Mar 26, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS and bipolar device integration including a tunable capacitor
- Patent number 10,158,030
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Nanowire device with reduced parasitics
- Patent number 10,157,992
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Mustafa Badaroglu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Vertically stacked nanowire field effect transistors
- Patent number 10,043,796
- Issue date Aug 7, 2018
- QUALCOMM Incorporated
- Vladimir Machkaoutsan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage power delivery architecture
- Patent number 10,039,188
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency multiplexer
- Patent number 9,906,318
- Issue date Feb 27, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,813,043
- Issue date Nov 7, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Self-aligned metal cut and via for back-end-of-line (BEOL) processe...
- Patent number 9,793,164
- Issue date Oct 17, 2017
- QUALCOMM Incorporated
- Vladimir Machkaoutsan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuits (ICS) on a glass substrate
- Patent number 9,768,109
- Issue date Sep 19, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated complementary metal-oxide semiconductor (CMOS) devices for...
- Patent number 9,673,275
- Issue date Jun 6, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM word line power control scheme
- Patent number 9,672,885
- Issue date Jun 6, 2017
- QUALCOMM Incorporated
- Sungryul Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Varactor device with backside contact
- Patent number 9,660,110
- Issue date May 23, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,634,640
- Issue date Apr 25, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
- Patent number 9,620,463
- Issue date Apr 11, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Button sensor
- Patent number 9,572,532
- Issue date Feb 21, 2017
- QUALCOMM Incorporated
- Barry Alan Matsumori
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Non-volatile multiple time programmable memory device
- Patent number 9,508,439
- Issue date Nov 29, 2016
- QUALCOMM Incorporated
- Xia Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Half node scaling for vertical structures
- Patent number 9,478,541
- Issue date Oct 25, 2016
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Devices, systems and methods using through silicon optical intercon...
- Patent number 9,478,528
- Issue date Oct 25, 2016
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Air gap between tungsten metal lines for interconnects with reduced...
- Patent number 9,425,096
- Issue date Aug 23, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pass filters and low pass filters using through glass via tech...
- Patent number 9,425,761
- Issue date Aug 23, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,401,689
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MTJ structure and integration scheme
- Patent number 9,373,782
- Issue date Jun 21, 2016
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physically unclonable function based on programming voltage of magn...
- Patent number 9,343,135
- Issue date May 17, 2016
- QUALCOMM Incorporated
- Xiaochun Zhu
- G11 - INFORMATION STORAGE
Information Patent Grant
Tunable diplexers in three-dimensional (3D) integrated circuits (IC...
- Patent number 9,331,665
- Issue date May 3, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite dilation mode resonators
- Patent number 9,331,666
- Issue date May 3, 2016
- QUALCOMM MEMS Technologies, Inc.
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME
- Publication number 20190341381
- Publication date Nov 7, 2019
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20190259780
- Publication date Aug 22, 2019
- Qualcomm Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER
- Publication number 20190132942
- Publication date May 2, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
NANOWIRE DEVICE WITH REDUCED PARASITICS
- Publication number 20190067435
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- Mustafa Badaroglu
- B82 - NANO-TECHNOLOGY
Information Patent Application
CMOS AND BIPOLAR DEVICE INTEGRATION INCLUDING A TUNABLE CAPACITOR
- Publication number 20180233604
- Publication date Aug 16, 2018
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...
- Publication number 20170373175
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC INTEGRATED EMITTER-DETECTOR ARRAY IN A FLEXIBLE SUBSTRAT...
- Publication number 20170360316
- Publication date Dec 21, 2017
- QUALCOMM Incorporated
- Shiqun GU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
VERTICALLY STACKED NANOWIRE FIELD EFFECT TRANSISTORS
- Publication number 20170221884
- Publication date Aug 3, 2017
- QUALCOMM Incorporated
- Vladimir Machkaoutsan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE DEVICE WITH REDUCED PARASITICS
- Publication number 20170186846
- Publication date Jun 29, 2017
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED METAL CUT AND VIA FOR BACK-END-OF-LINE (BEOL) PROCESSE...
- Publication number 20170140986
- Publication date May 18, 2017
- QUALCOMM Incorporated
- Vladimir Machkaoutsan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ISOLATED COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) DEVICES FOR...
- Publication number 20170117358
- Publication date Apr 27, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20170098663
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-TRANSFERRED, DEEP TRENCH ISOLATION SILICON-ON-INSULATOR (...
- Publication number 20170084628
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20170084531
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) WAFERS EMPLOYING MOLDED SUBSTRATES TO IM...
- Publication number 20160293477
- Publication date Oct 6, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPARTMENT SHIELDING IN FLIP-CHIP (FC) MODULE
- Publication number 20160254236
- Publication date Sep 1, 2016
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY (RF) SHIELDING IN FAN-OUT WAFER LEVEL PACKAGE (FOWLP)
- Publication number 20160254237
- Publication date Sep 1, 2016
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20160204758
- Publication date Jul 14, 2016
- QUALCOMM Incorporated
- Chengjie Zuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VARACTOR DEVICE WITH BACKSIDE CONTACT
- Publication number 20160093750
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF NODE SCALING FOR VERTICAL STRUCTURES
- Publication number 20160071847
- Publication date Mar 10, 2016
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-VOLATILE MULTIPLE TIME PROGRAMMABLE MEMORY DEVICE
- Publication number 20160012896
- Publication date Jan 14, 2016
- QUALCOMM Incorporated
- Xia Li
- G11 - INFORMATION STORAGE
Information Patent Application
AIR GAP BETWEEN TUNGSTEN METAL LINES FOR INTERCONNECTS WITH REDUCED...
- Publication number 20160013133
- Publication date Jan 14, 2016
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STAGE POWER DELIVERY ARCHITECTURE
- Publication number 20150334847
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Changhan Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FREQUENCY MULTIPLEXER
- Publication number 20150304059
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Chengjie Zuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONN...
- Publication number 20150303148
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CONDUCTIVE INTERCONNECT INDUCTOR
- Publication number 20150201495
- Publication date Jul 16, 2015
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...
- Publication number 20150092314
- Publication date Apr 2, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICALLY UNCLONABLE FUNCTION BASED ON PROGRAMMING VOLTAGE OF MAGN...
- Publication number 20150070979
- Publication date Mar 12, 2015
- QUALCOMM Incorporated
- Xiaochun Zhu
- G11 - INFORMATION STORAGE
Information Patent Application
PHYSICALLY UNCLONABLE FUNCTION BASED ON BREAKDOWN VOLTAGE OF METAL-...
- Publication number 20150074433
- Publication date Mar 12, 2015
- QUALCOMM Incorporated
- Xiaochun Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHYSICALLY UNCLONABLE FUNCTION BASED ON THE RANDOM LOGICAL STATE OF...
- Publication number 20150071431
- Publication date Mar 12, 2015
- QUALCOMM Incorporated
- Xiaochun Zhu
- G11 - INFORMATION STORAGE

Matthew Michael Nowak

Person

Patents Grantslast 30 patents

Integrated circuits (ICs) on a glass substrate

Integration of through glass via (TGV) filter and acoustic filter

Integrated semiconductor devices and method of fabricating the same

Integrated circuits (ICs) on a glass substrate

Monolithic integrated emitter-detector array in a flexible substrat...

Compartment shielding in flip-chip (FC) module

CMOS and bipolar device integration including a tunable capacitor

Nanowire device with reduced parasitics

Vertically stacked nanowire field effect transistors

Two-stage power delivery architecture

Frequency multiplexer

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Self-aligned metal cut and via for back-end-of-line (BEOL) processe...

Integrated circuits (ICS) on a glass substrate

Isolated complementary metal-oxide semiconductor (CMOS) devices for...

MRAM word line power control scheme

Varactor device with backside contact

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Button sensor

Non-volatile multiple time programmable memory device

Half node scaling for vertical structures

Devices, systems and methods using through silicon optical intercon...

Air gap between tungsten metal lines for interconnects with reduced...

High pass filters and low pass filters using through glass via tech...

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

MTJ structure and integration scheme

Physically unclonable function based on programming voltage of magn...

Tunable diplexers in three-dimensional (3D) integrated circuits (IC...

Composite dilation mode resonators

Patents Applicationslast 30 patents

INTEGRATED SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER

NANOWIRE DEVICE WITH REDUCED PARASITICS

CMOS AND BIPOLAR DEVICE INTEGRATION INCLUDING A TUNABLE CAPACITOR

SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...

MONOLITHIC INTEGRATED EMITTER-DETECTOR ARRAY IN A FLEXIBLE SUBSTRAT...

VERTICALLY STACKED NANOWIRE FIELD EFFECT TRANSISTORS

NANOWIRE DEVICE WITH REDUCED PARASITICS

SELF-ALIGNED METAL CUT AND VIA FOR BACK-END-OF-LINE (BEOL) PROCESSE...

ISOLATED COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) DEVICES FOR...

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

SUBSTRATE-TRANSFERRED, DEEP TRENCH ISOLATION SILICON-ON-INSULATOR (...

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

SILICON-ON-INSULATOR (SOI) WAFERS EMPLOYING MOLDED SUBSTRATES TO IM...

COMPARTMENT SHIELDING IN FLIP-CHIP (FC) MODULE

RADIO-FREQUENCY (RF) SHIELDING IN FAN-OUT WAFER LEVEL PACKAGE (FOWLP)

TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

VARACTOR DEVICE WITH BACKSIDE CONTACT

HALF NODE SCALING FOR VERTICAL STRUCTURES

NON-VOLATILE MULTIPLE TIME PROGRAMMABLE MEMORY DEVICE

AIR GAP BETWEEN TUNGSTEN METAL LINES FOR INTERCONNECTS WITH REDUCED...

TWO-STAGE POWER DELIVERY ARCHITECTURE

FREQUENCY MULTIPLEXER

DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONN...

STACKED CONDUCTIVE INTERCONNECT INDUCTOR

CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...

PHYSICALLY UNCLONABLE FUNCTION BASED ON PROGRAMMING VOLTAGE OF MAGN...

PHYSICALLY UNCLONABLE FUNCTION BASED ON BREAKDOWN VOLTAGE OF METAL-...

PHYSICALLY UNCLONABLE FUNCTION BASED ON THE RANDOM LOGICAL STATE OF...