Merrill Albert Hatcher JR.

Person

Greensboro, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,046,483
- Issue date Jul 23, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,955,348
- Issue date Apr 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,869,776
- Issue date Jan 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,664,241
- Issue date May 30, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,387,157
- Issue date Jul 12, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,355,405
- Issue date Jun 7, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,322,420
- Issue date May 3, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,289,392
- Issue date Mar 29, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,257,731
- Issue date Feb 22, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 11,063,021
- Issue date Jul 13, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 11,011,498
- Issue date May 18, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,964,672
- Issue date Mar 30, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance and manufacturing met...
- Patent number 10,882,740
- Issue date Jan 5, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,804,179
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,804,246
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,773,952
- Issue date Sep 15, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,755,992
- Issue date Aug 25, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,679,918
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,676,348
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,658,259
- Issue date May 19, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,636,720
- Issue date Apr 28, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,622,271
- Issue date Apr 14, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,615,147
- Issue date Apr 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,600,711
- Issue date Mar 24, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,589,993
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,586,747
- Issue date Mar 10, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,549,988
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,553,564
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,529,639
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,490,471
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20230089645
- Publication date Mar 23, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20200234978
- Publication date Jul 23, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20200235024
- Publication date Jul 23, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200102217
- Publication date Apr 2, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES
- Publication number 20190378819
- Publication date Dec 12, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES
- Publication number 20190378821
- Publication date Dec 12, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20190057922
- Publication date Feb 21, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013254
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013255
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH THERMAL ADDITIVE AND...
- Publication number 20180197803
- Publication date Jul 12, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180047653
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044169
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH THERMAL ADDITIVE AND...
- Publication number 20170358511
- Publication date Dec 14, 2017
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20170334710
- Publication date Nov 23, 2017
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATOMIC LAYER DEPOSITION ENCAPSULATION FOR ACOUSTIC WAVE DEVICES
- Publication number 20130230643
- Publication date Sep 5, 2013
- RF Micro Devices, Inc.
- Merrill Albert Hatcher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION ENCAPSULATION FOR ACOUSTIC WAVE DEVICES
- Publication number 20130221800
- Publication date Aug 29, 2013
- RF Micro Devices, Inc.
- Merrill Albert Hatcher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION ENCAPSULATION FOR POWER AMPLIFIERS IN RF CI...
- Publication number 20130038390
- Publication date Feb 14, 2013
- RF Micro Devices, Inc.
- John R. Siomkos
- H01 - BASIC ELECTRIC ELEMENTS

Merrill Albert Hatcher JR.

Person

Patents Grantslast 30 patents

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Microelectronics package with vertically stacked dies

Microelectronics package with vertically stacked dies

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance and manufacturing met...

Wafer-level package with enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Patents Applicationslast 30 patents

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH THERMAL ADDITIVE AND...

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH THERMAL ADDITIVE AND...

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

ATOMIC LAYER DEPOSITION ENCAPSULATION FOR ACOUSTIC WAVE DEVICES

ATOMIC LAYER DEPOSITION ENCAPSULATION FOR ACOUSTIC WAVE DEVICES

ATOMIC LAYER DEPOSITION ENCAPSULATION FOR POWER AMPLIFIERS IN RF CI...