Michael F. McAllister

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 8,929,086
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid conductor through-silicon-via for power distribution and sig...
- Patent number 8,796,140
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductor through-silicon-via for power distribution and sig...
- Patent number 8,791,550
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitor employing conductive through-substr...
- Patent number 8,785,289
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitor employing conductive through-substr...
- Patent number 8,558,345
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solid vias in a printed circuit board
- Patent number 7,987,587
- Issue date Aug 2, 2011
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for structural enhancement of compression system board conne...
- Patent number 7,930,820
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 7,543,373
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array structures and methods for engineering change
- Patent number 7,363,688
- Issue date Apr 29, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for using gel package structure enhancing thermal dissipatio...
- Patent number 7,344,919
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package structures using land grid array interposers for...
- Patent number 7,284,992
- Issue date Oct 23, 2007
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array structures and methods for engineering change
- Patent number 7,077,660
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array structure
- Patent number 6,954,984
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,605,953
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method of interconnecting with a system board
- Patent number 6,549,024
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for enhancing a system board
- Patent number 6,538,460
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Application and test methodology for use with compression land grid...
- Patent number 6,529,023
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Wiren D. Becker
- G01 - MEASURING TESTING
Information Patent Grant
System interface assembly and method
- Patent number 6,462,573
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Thin film wiring scheme utilizing inter-chip site surface wiring
- Patent number 6,444,919
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,433,562
- Issue date Aug 13, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,429,644
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Probing systems for chilled environment
- Patent number 6,342,788
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Michael Ford McAllister
- G01 - MEASURING TESTING
Information Patent Grant
High frequency probe
- Patent number 6,252,391
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method of constructing an integrated circuit memory
- Patent number 5,817,543
- Issue date Oct 6, 1998
- International Business Machines Corporation
- Michael Ford McAllister
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,757,079
- Issue date May 26, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,747,095
- Issue date May 5, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density memory structure
- Patent number 5,523,619
- Issue date Jun 4, 1996
- International Business Machines Corporation
- Michael F. McAllister
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin-film wiring layout for a non-planar thin-film structure
- Patent number 5,378,927
- Issue date Jan 3, 1995
- International Business Machines Corporation
- Michael F. McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct jump engineering change system
- Patent number 5,354,955
- Issue date Oct 11, 1994
- International Business Machines Corporation
- Lawrence V. Gregor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable chip to circuit board connection
- Patent number 5,264,664
- Issue date Nov 23, 1993
- International Business Machines Corporation
- Michael F. McAllister
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...
- Publication number 20140199834
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...
- Publication number 20140197522
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...
- Publication number 20130344675
- Publication date Dec 26, 2013
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...
- Publication number 20110108948
- Publication date May 12, 2011
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Solid Vias in a Printed Circuit Board
- Publication number 20090223710
- Publication date Sep 10, 2009
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Chip Module (MCM) of a Computer System
- Publication number 20080089024
- Publication date Apr 17, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR...
- Publication number 20070224845
- Publication date Sep 27, 2007
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069358
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072450
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069754
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072344
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069753
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array structures and methods for engineering change
- Publication number 20060260123
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array structures and methods for engineering change
- Publication number 20040159915
- Publication date Aug 19, 2004
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array structures and methods for engineering change
- Publication number 20040016114
- Publication date Jan 29, 2004
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus of interconnecting with a system board
- Publication number 20020186002
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus of interconnecting with a system board
- Publication number 20020180422
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Application
APPLICATION AND TEST METHODOLOGY FOR USE WITH COMPRESSION LAND GRID...
- Publication number 20020171442
- Publication date Nov 21, 2002
- Wiren D. Becker
- G01 - MEASURING TESTING

Michael F. McAllister

Person

Patents Grantslast 30 patents

Gel package structural enhancement of compression system board conn...

Hybrid conductor through-silicon-via for power distribution and sig...

Hybrid conductor through-silicon-via for power distribution and sig...

Integrated decoupling capacitor employing conductive through-substr...

Integrated decoupling capacitor employing conductive through-substr...

Method of forming solid vias in a printed circuit board

Method for structural enhancement of compression system board conne...

Gel package structural enhancement of compression system board conn...

Land grid array structures and methods for engineering change

Method for using gel package structure enhancing thermal dissipatio...

Electronic package structures using land grid array interposers for...

Land grid array structures and methods for engineering change

Land grid array structure

Method and apparatus of interconnecting with a system board

Method of interconnecting with a system board

Method and apparatus for enhancing a system board

Application and test methodology for use with compression land grid...

System interface assembly and method

Thin film wiring scheme utilizing inter-chip site surface wiring

Method and apparatus of interconnecting with a system board

Method and apparatus of interconnecting with a system board

Probing systems for chilled environment

High frequency probe

Method of constructing an integrated circuit memory

Method for repairing defective electrical connections on multi-laye...

Method for repairing defective electrical connections on multi-laye...

High density memory structure

Thin-film wiring layout for a non-planar thin-film structure

Direct jump engineering change system

Programmable chip to circuit board connection

Patents Applicationslast 30 patents

HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...

HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...

INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...

INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...

Method of Forming Solid Vias in a Printed Circuit Board

Multi-Chip Module (MCM) of a Computer System

ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Land grid array structures and methods for engineering change

Land grid array structures and methods for engineering change

Land grid array structures and methods for engineering change

Method and apparatus of interconnecting with a system board

Method and apparatus of interconnecting with a system board

APPLICATION AND TEST METHODOLOGY FOR USE WITH COMPRESSION LAND GRID...