Michael R. SLAUGHTER

Person

Boiser, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices and method for handling microelectronics assemblies
- Patent number 9,048,272
- Issue date Jun 2, 2015
- Illinois Tool Works Inc.
- Valoris L. Forsyth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pusher assemblies for use in microfeature device testing, systems w...
- Patent number 7,863,924
- Issue date Jan 4, 2011
- Micron Technology, Inc.
- Michael Slaughter
- G01 - MEASURING TESTING
Information Patent Grant
Pusher assemblies for use in microfeature device testing, systems w...
- Patent number 7,652,495
- Issue date Jan 26, 2010
- Micron Technology, Inc.
- Michael Slaughter
- G01 - MEASURING TESTING
Information Patent Grant
Test sockets, test systems, and methods for testing microfeature de...
- Patent number 7,256,595
- Issue date Aug 14, 2007
- Micron Technology, Inc.
- John L. Caldwell
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for retaining a tray stack having a plurality...
- Patent number 7,086,562
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for retaining a tray stack having a plurality...
- Patent number 7,066,708
- Issue date Jun 27, 2006
- Micron Technology, Inc.
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for retaining a tray stack having a plurality...
- Patent number 6,866,470
- Issue date Mar 15, 2005
- Micron Technology, Inc.
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,858,453
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,836,003
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package including lead frame with electrically i...
- Patent number 6,246,108
- Issue date Jun 12, 2001
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,048,744
- Issue date Apr 11, 2000
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES
- Publication number 20150235882
- Publication date Aug 20, 2015
- Illinois Tool Works Inc.
- Valoris L. FORSYTH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DEVICES AND METHOD FOR HANDLING MICROELECTRONICS ASSEMBLIES
- Publication number 20110259772
- Publication date Oct 27, 2011
- Illinois Tool Works Inc.
- Valoris L. Forsyth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PUSHER ASSEMBLIES FOR USE IN MICROFEATURE DEVICE TESTING, SYSTEMS W...
- Publication number 20100097090
- Publication date Apr 22, 2010
- Micron Technology, Inc.
- Michael Slaughter
- G01 - MEASURING TESTING
Information Patent Application
DEVICES AND METHODS FOR HANDLING MICROELECTRONIC ASSEMBLIES
- Publication number 20100089851
- Publication date Apr 15, 2010
- Micron Technology, Inc.
- Michael R. Slaughter
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Pusher assemblies for use in microfeature device testing, systems w...
- Publication number 20070216437
- Publication date Sep 20, 2007
- Micron Technology, Inc.
- Michael Slaughter
- G01 - MEASURING TESTING
Information Patent Application
Stress and force management techniques for a semiconductor die
- Publication number 20070018336
- Publication date Jan 25, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test sockets, test systems, and methods for testing microfeature de...
- Publication number 20060197544
- Publication date Sep 7, 2006
- Micron Technology, Inc.
- John L. Caldwell
- G01 - MEASURING TESTING
Information Patent Application
Test sockets, test systems, and methods for testing microfeature de...
- Publication number 20060197545
- Publication date Sep 7, 2006
- Micron Technology, Inc.
- John L. Caldwell
- G01 - MEASURING TESTING
Information Patent Application
Stress and force management techniques for a semiconductor die
- Publication number 20050206012
- Publication date Sep 22, 2005
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test sockets, test systems, and methods for testing microfeature de...
- Publication number 20050206401
- Publication date Sep 22, 2005
- John L. Caldwell
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for retaining a tray stack having a plurality...
- Publication number 20040179931
- Publication date Sep 16, 2004
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for retaining a tray stack having a plurality...
- Publication number 20020159878
- Publication date Oct 31, 2002
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for retaining a tray stack having a plurality...
- Publication number 20020057963
- Publication date May 16, 2002
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for retaining a tray stack having a plurality...
- Publication number 20020034436
- Publication date Mar 21, 2002
- Darin L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package alignment feature
- Publication number 20010011762
- Publication date Aug 9, 2001
- David J. Corisis
- G01 - MEASURING TESTING

Michael R. SLAUGHTER

Person

Patents Grantslast 30 patents

Devices and method for handling microelectronics assemblies

Pusher assemblies for use in microfeature device testing, systems w...

Pusher assemblies for use in microfeature device testing, systems w...

Test sockets, test systems, and methods for testing microfeature de...

Methods and apparatus for retaining a tray stack having a plurality...

Methods and apparatus for retaining a tray stack having a plurality...

Methods and apparatus for retaining a tray stack having a plurality...

Integrated circuit package alignment feature

Integrated circuit package alignment feature

Integrated circuit package including lead frame with electrically i...

Integrated circuit package alignment feature

Patents Applicationslast 30 patents

DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES

DEVICES AND METHOD FOR HANDLING MICROELECTRONICS ASSEMBLIES

PUSHER ASSEMBLIES FOR USE IN MICROFEATURE DEVICE TESTING, SYSTEMS W...

DEVICES AND METHODS FOR HANDLING MICROELECTRONIC ASSEMBLIES

Pusher assemblies for use in microfeature device testing, systems w...

Stress and force management techniques for a semiconductor die

Test sockets, test systems, and methods for testing microfeature de...

Test sockets, test systems, and methods for testing microfeature de...

Stress and force management techniques for a semiconductor die

Test sockets, test systems, and methods for testing microfeature de...

Methods and apparatus for retaining a tray stack having a plurality...

Methods and apparatus for retaining a tray stack having a plurality...

Methods and apparatus for retaining a tray stack having a plurality...

Methods and apparatus for retaining a tray stack having a plurality...

Integrated circuit package alignment feature