Claims
- 1. An integrated circuit package comprising:
a semiconductor die; a plurality of conductors, at least some of which are coupled to the semiconductor die; and at least one alignment feature separate from the plurality of conductors.
- 2. The integrated circuit package of claim 1, wherein the at least one alignment feature includes at least one aperture.
- 3. The integrated circuit package of claim 1, wherein the at least one alignment feature is semi-circular shaped.
- 4. The integrated circuit package of claim 1, further comprising an insulating material encompassing the semiconductor die and a portion of each of the plurality of conductors, the insulating material comprising a first end and a second end, wherein the at least one alignment feature comprises an alignment feature disposed on both the first end and the second end of the insulating material.
- 5. The integrated circuit package of claim 1, wherein the at least one alignment feature comprises a protuberance.
- 6. An integrated circuit package comprising:
a semiconductor die; a plurality of conductors, at least some of which are coupled to the semiconductor die; at least one alignment feature; and insulating material encompassing the at least one alignment feature.
- 7. The integrated circuit package of claim 6, wherein the at least one alignment feature is an alignment cut-out.
- 8. The integrated circuit package of claim 6, wherein the at least one alignment feature includes at least one aperture.
- 9. The integrated circuit package of claim 6, wherein the at least one alignment feature is semi-circular shaped.
- 10. The integrated circuit package of claim 6, wherein the at least one alignment feature comprises a tie bar.
- 11. The integrated circuit package of claim 6 further comprising a lead frame having a first end and a second end, wherein the at least one alignment feature comprises an alignment feature disposed on both the first end and the second end of the lead frame.
- 12. The integrated circuit package of claim 6, wherein the at least one alignment feature comprises a protuberance.
- 13. A lead frame strip ready for cutting, the lead frame strip comprising a plurality of integrated circuit packages, each integrated circuit package comprising:
a semiconductor die; a plurality of conductors, at least some of which are coupled to the semiconductor die; insulating material encompassing the semiconductor die and portions of the plurality of conductors; and at least one alignment feature electrically isolated from the plurality of conductors.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 09/416,368, filed Oct. 12, 1999, which is a continuation of application Ser. No. 08/929,843, filed Sep. 15, 1997, now U.S. Pat. No. 6,048,744, issued Apr. 11, 2000.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09416368 |
Oct 1999 |
US |
Child |
09819874 |
Mar 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
08929843 |
Sep 1997 |
US |
Child |
09416368 |
Oct 1999 |
US |