Mitul Dalal

Person

South Grafton, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having antenna
- Patent number D825537
- Issue date Aug 14, 2018
- MC10, Inc.
- Xia Li
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Embedding thin chips in polymer
- Patent number 10,032,709
- Issue date Jul 24, 2018
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic circuits with embedded integrated circuit die
- Patent number 9,899,330
- Issue date Feb 20, 2018
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having antenna
- Patent number D781270
- Issue date Mar 14, 2017
- MC10, Inc.
- Xia Li
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,583,428
- Issue date Feb 28, 2017
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,171,794
- Issue date Oct 27, 2015
- MC10, Inc.
- Conor Rafferty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of etching a wafer
- Patent number 9,150,408
- Issue date Oct 6, 2015
- Analog Devices, Inc.
- Li Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching and singulating a cap wafer
- Patent number 8,815,624
- Issue date Aug 26, 2014
- Analog Devices, Inc.
- Mitul Dalal
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE ELECTRONIC CIRCUITS WITH EMBEDDED INTEGRATED CIRCUIT DIE A...
- Publication number 20180308799
- Publication date Oct 25, 2018
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING THIN CHIPS IN POLYMER
- Publication number 20170200670
- Publication date Jul 13, 2017
- MC10, Inc.
- Conor RAFFERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE FLEXIBLE INTERCONNECTS FOR MODULES OF INTEGRATED CIRCUITS
- Publication number 20170186727
- Publication date Jun 29, 2017
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING THIN CHIPS IN POLYMER
- Publication number 20160111353
- Publication date Apr 21, 2016
- MC10, Inc.
- Conor RAFFERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC CIRCUITS WITH EMBEDDED INTEGRATED CIRCUIT DIE A...
- Publication number 20160099214
- Publication date Apr 7, 2016
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECTS FOR MODULES OF INTEGRATED CIRCUITS AND METHO...
- Publication number 20160099227
- Publication date Apr 7, 2016
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...
- Publication number 20160086909
- Publication date Mar 24, 2016
- MC10, Inc.
- David G. Garlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL ELECTRONIC DEVICES
- Publication number 20160006123
- Publication date Jan 7, 2016
- MC10, Inc.
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Etching a Wafer
- Publication number 20140332945
- Publication date Nov 13, 2014
- Li Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDING THIN CHIPS IN POLYMER
- Publication number 20140110859
- Publication date Apr 24, 2014
- MC10, Inc.
- Conor RAFFERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Etching and Singulating a Cap Wafer
- Publication number 20110309486
- Publication date Dec 22, 2011
- Analog Devices, Inc.
- Mitul Dalal
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Mitul Dalal

Person

Patents Grantslast 30 patents

Discrete flexible interconnects for modules of integrated circuits

Electronic device having antenna

Embedding thin chips in polymer

Flexible electronic circuits with embedded integrated circuit die

Electronic device having antenna

Embedding thin chips in polymer

Embedding thin chips in polymer

Method of etching a wafer

Method of etching and singulating a cap wafer

Patents Applicationslast 30 patents

FLEXIBLE ELECTRONIC CIRCUITS WITH EMBEDDED INTEGRATED CIRCUIT DIE A...

EMBEDDING THIN CHIPS IN POLYMER

DISCRETE FLEXIBLE INTERCONNECTS FOR MODULES OF INTEGRATED CIRCUITS

EMBEDDING THIN CHIPS IN POLYMER

FLEXIBLE ELECTRONIC CIRCUITS WITH EMBEDDED INTEGRATED CIRCUIT DIE A...

FLEXIBLE INTERCONNECTS FOR MODULES OF INTEGRATED CIRCUITS AND METHO...

METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...

CONFORMAL ELECTRONIC DEVICES

Method of Etching a Wafer

EMBEDDING THIN CHIPS IN POLYMER

Method of Etching and Singulating a Cap Wafer