Mohammad Akhavain

Person

Escondido, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a fluid ejection head for a fluid ejection device
- Patent number 7,480,994
- Issue date Jan 27, 2009
- Hewlett-Packard Development Company, L.P.
- Benjamin H. Wood, III
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for forming and protecting electrical interconnects and res...
- Patent number 7,338,149
- Issue date Mar 4, 2008
- Hewlett-Packard Development Company, L.P.
- Mohammad Akhavain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection pad layouts
- Patent number 7,211,736
- Issue date May 1, 2007
- Hewlett-Packard Development Company, L.P.
- Noah Lassar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid ejection head assembly
- Patent number 7,188,925
- Issue date Mar 13, 2007
- Hewlett-Packard Development Company, L.P.
- Benjamin H. Wood, III
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and systems for forming a die package
- Patent number 7,103,969
- Issue date Sep 12, 2006
- Hewlett-Packard Development Company, L.P.
- Frank J. Bretl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrical connection between electrical leads...
- Patent number 6,983,539
- Issue date Jan 10, 2006
- Hewlett-Packard Development Company, L.P.
- Mohammad Akhavain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge-sealed substrates and methods for effecting the same
- Patent number 6,951,778
- Issue date Oct 4, 2005
- Hewlett-Packard Development Company, L.P.
- Mohammad Akhavain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming and protecting electrical interconnects and res...
- Patent number 6,913,343
- Issue date Jul 5, 2005
- Hewlett-Packard Development Company, L.P.
- Mohammad Akhavain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit for printhead assembly
- Patent number 6,843,552
- Issue date Jan 18, 2005
- Hewlett-Packard Development Company, L.P.
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Substrate for fluid ejection devices
- Patent number 6,705,705
- Issue date Mar 16, 2004
- Hewlett-Packard Development Company, L.P.
- Janis Horvath
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Methods and systems for forming a die package
- Patent number 6,698,092
- Issue date Mar 2, 2004
- Hewlett-Packard Development Company, L.P.
- Frank J. Bretl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining of different materials of carrier for fluid ejection devices
- Patent number 6,575,559
- Issue date Jun 10, 2003
- Hewlett-Packard Development Company, L.P.
- David K McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electrical circuit for wide-array inkjet printhead assembly
- Patent number 6,557,976
- Issue date May 6, 2003
- Hewlett-Packard Development Company, L.P.
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet printhead assembly having planarized mounting layer for prin...
- Patent number 6,543,880
- Issue date Apr 8, 2003
- Hewlett-Packard Company
- Mohammad Akhavain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for predicting and avoiding a bad bond when utilizing fiber...
- Patent number 6,476,346
- Issue date Nov 5, 2002
- Hewlett-Packard Company
- Mohammad Akhavain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printhead die alignment for wide-array inkjet printhead assembly
- Patent number 6,450,614
- Issue date Sep 17, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Hybrid carrier for wide-array inkjet printhead assembly
- Patent number 6,431,683
- Issue date Aug 13, 2002
- Hewlett-Packard Company
- May Fong Ho
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Reference datums for inkjet printhead assembly
- Patent number 6,428,141
- Issue date Aug 6, 2002
- Hewlett-Packard Company
- David K. Mc Elfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Coplanar mounting of printhead dies for wide-array inkjet printhead...
- Patent number 6,409,307
- Issue date Jun 25, 2002
- Hewlett-Packard Company
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Connection of electrical contacts utilizing a combination laser and...
- Patent number 6,397,465
- Issue date Jun 4, 2002
- Hewlett-Packard Company
- Mohammad Akhavain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier positioning for wide-array inkjet printhead assembly
- Patent number 6,350,013
- Issue date Feb 26, 2002
- Hewlett-Packard Company
- Joseph E. Scheffelin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for predicting and avoiding a bad bond when utilizing fiber...
- Patent number 6,236,015
- Issue date May 22, 2001
- Hewlett-Packard Company
- Mohammad Akhavain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION PAD LAYOUTS
- Publication number 20070169342
- Publication date Jul 26, 2007
- Noah Lassar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fluid ejection head assembly
- Publication number 20070153048
- Publication date Jul 5, 2007
- Benjamin H. Wood
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods for forming and protecting electrical interconnects and res...
- Publication number 20050248617
- Publication date Nov 10, 2005
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Fluid ejection head assembly
- Publication number 20050168513
- Publication date Aug 4, 2005
- Benjamin H. Wood
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Connection pad layouts
- Publication number 20050094382
- Publication date May 5, 2005
- Noah Lassar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for forming and protecting electrical interconnects and res...
- Publication number 20040218009
- Publication date Nov 4, 2004
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods and systems for forming a die package
- Publication number 20040128831
- Publication date Jul 8, 2004
- Frank J. Bretl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electrical circuit for printhead assembly
- Publication number 20030202047
- Publication date Oct 30, 2003
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods and systems for forming a die package
- Publication number 20030081647
- Publication date May 1, 2003
- Frank J. Bretl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Joining of different materials of carrier for printhead dies
- Publication number 20030081058
- Publication date May 1, 2003
- David K. McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Connection of electrical contacts utilizing a combination laser and...
- Publication number 20030041455
- Publication date Mar 6, 2003
- HEWLETT-PACKARD COMPANY
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRICAL CIRCUIT FOR WIDE-ARRAY INKJET PRINTHEAD ASSEMBLY
- Publication number 20020109751
- Publication date Aug 15, 2002
- David McElfresh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for predicting and avoiding a bad bond when utilizing fiber...
- Publication number 20020000427
- Publication date Jan 3, 2002
- Mohammad Akhavain
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Mohammad Akhavain

Person

Patents Grantslast 30 patents

Method of making a fluid ejection head for a fluid ejection device

Methods for forming and protecting electrical interconnects and res...

Connection pad layouts

Fluid ejection head assembly

Methods and systems for forming a die package

Method of forming an electrical connection between electrical leads...

Edge-sealed substrates and methods for effecting the same

Methods for forming and protecting electrical interconnects and res...

Electrical circuit for printhead assembly

Substrate for fluid ejection devices

Methods and systems for forming a die package

Joining of different materials of carrier for fluid ejection devices

Electrical circuit for wide-array inkjet printhead assembly

Inkjet printhead assembly having planarized mounting layer for prin...

Method for predicting and avoiding a bad bond when utilizing fiber...

Printhead die alignment for wide-array inkjet printhead assembly

Hybrid carrier for wide-array inkjet printhead assembly

Reference datums for inkjet printhead assembly

Coplanar mounting of printhead dies for wide-array inkjet printhead...

Connection of electrical contacts utilizing a combination laser and...

Carrier positioning for wide-array inkjet printhead assembly

Method for predicting and avoiding a bad bond when utilizing fiber...

Patents Applicationslast 30 patents

CONNECTION PAD LAYOUTS

Fluid ejection head assembly

Methods for forming and protecting electrical interconnects and res...

Fluid ejection head assembly

Connection pad layouts

Methods for forming and protecting electrical interconnects and res...

Methods and systems for forming a die package

Electrical circuit for printhead assembly

Methods and systems for forming a die package

Joining of different materials of carrier for printhead dies

Connection of electrical contacts utilizing a combination laser and...

ELECTRICAL CIRCUIT FOR WIDE-ARRAY INKJET PRINTHEAD ASSEMBLY

Method for predicting and avoiding a bad bond when utilizing fiber...