Mohammad Hafijur Rahman

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
- Patent number 11,721,650
- Issue date Aug 8, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS SRAM/ROM unified bit cell
- Patent number 7,710,761
- Issue date May 4, 2010
- VNS Portfolio LLC
- Dennis Ray Miller
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS
- Publication number 20240363995
- Publication date Oct 31, 2024
- Intel Corporation
- Bai Nie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312853
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312888
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES
- Publication number 20240222286
- Publication date Jul 4, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED CO...
- Publication number 20240213111
- Publication date Jun 27, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED MEMORY FOR GLASS CORE PACKAGES
- Publication number 20240203805
- Publication date Jun 20, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL ANOMALY IDENTIFICATION DEVICE AND METHOD FOR IDENTIFYING TOOL...
- Publication number 20240184274
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- Publication number 20240178119
- Publication date May 30, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS EMBEDDED TRUE AIR CORE INDUCTORS
- Publication number 20240177918
- Publication date May 30, 2024
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS
- Publication number 20240162191
- Publication date May 16, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
- Publication number 20240120305
- Publication date Apr 11, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR GLASS CORE INDUCTOR
- Publication number 20240088199
- Publication date Mar 14, 2024
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES
- Publication number 20240063100
- Publication date Feb 22, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP
- Publication number 20230108843
- Publication date Apr 6, 2023
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED, CONFIGURABLE MICRO HEAT PUMP AND MICROCHANNELS
- Publication number 20230091720
- Publication date Mar 23, 2023
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL ELEMENTS FOR APPLICATION SPECIFIC ELECTRONIC DEVICE PACK...
- Publication number 20210296225
- Publication date Sep 23, 2021
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MULTIPLEXED HOLLOW WAVEGUIDES OF VARIABLE TY...
- Publication number 20200395317
- Publication date Dec 17, 2020
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS SRAM/ROM UNIFIED BIT CELL
- Publication number 20080170430
- Publication date Jul 17, 2008
- TECHNOLOGY PROPERTIES LIMITED
- Dennis Ray Miller
- G11 - INFORMATION STORAGE

Mohammad Hafijur Rahman

Person

Patents Grantslast 30 patents

Structural elements for application specific electronic device pack...

Method for fabricating multiplexed hollow waveguides of variable ty...

CMOS SRAM/ROM unified bit cell

Patents Applicationslast 30 patents

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS

MEMS DIES EMBEDDED IN GLASS CORES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES

CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED CO...

EMBEDDED MEMORY FOR GLASS CORE PACKAGES

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

TOOL ANOMALY IDENTIFICATION DEVICE AND METHOD FOR IDENTIFYING TOOL...

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

GLASS EMBEDDED TRUE AIR CORE INDUCTORS

PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS

PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS

TECHNOLOGIES FOR GLASS CORE INDUCTOR

SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES

INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP

INTEGRATED, CONFIGURABLE MICRO HEAT PUMP AND MICROCHANNELS

STRUCTURAL ELEMENTS FOR APPLICATION SPECIFIC ELECTRONIC DEVICE PACK...

METHOD FOR FABRICATING MULTIPLEXED HOLLOW WAVEGUIDES OF VARIABLE TY...

CMOS SRAM/ROM UNIFIED BIT CELL