Namhoon Kim

Person

Mt. View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backside interconnection interface die for integrated circuits package
- Patent number 12,051,679
- Issue date Jul 30, 2024
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integrated voltage regulator for integrated circuits
- Patent number 11,830,855
- Issue date Nov 28, 2023
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 11,488,944
- Issue date Nov 1, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,264,358
- Issue date Mar 1, 2022
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Individual radio frequency configuration for user devices
- Patent number 10,419,959
- Issue date Sep 17, 2019
- Amazon Technologies, Inc.
- Anuj Dron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-polarization antenna system on a single circuit board
- Patent number 10,347,977
- Issue date Jul 9, 2019
- Amazon Technologies, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate core spiral inductor
- Patent number 10,128,037
- Issue date Nov 13, 2018
- Avago Technologies International Sales Pte. Limited
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Individual radio frequency configuration for user devices
- Patent number 10,051,499
- Issue date Aug 14, 2018
- Amazon Technologies, Inc.
- Anuj Dron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded multi-band antenna in a band of a wearable electronic device
- Patent number 10,027,023
- Issue date Jul 17, 2018
- Amazon Technologies, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna carriers with magneto-dielectric material and beam-shaping...
- Patent number 9,912,041
- Issue date Mar 6, 2018
- Amazon Technologies, Inc.
- Eswarappa Channabasappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive antenna tuning based on a sensed characteristic
- Patent number 9,774,362
- Issue date Sep 26, 2017
- Amazon Technologies, Inc.
- Rohit Sammeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reconfigurable antenna system
- Patent number 9,756,544
- Issue date Sep 5, 2017
- Amazon Technologies, Inc.
- Peruvemba Ranganathan Sai Ananthanarayanan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mobile antenna array
- Patent number 9,415,869
- Issue date Aug 16, 2016
- Amazon Technologies, Inc.
- Danny Chan
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Slot antenna and NFC antenna in an electronic device
- Patent number 9,397,727
- Issue date Jul 19, 2016
- Amazon Technologies, Inc.
- Ulf Jan-Ove Mattsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit structure with inductor in silicon interposer
- Patent number 9,330,823
- Issue date May 3, 2016
- Xilinx, Inc.
- Arifur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with adjustable electrical path length
- Patent number 9,196,953
- Issue date Nov 24, 2015
- Amazon Technologies, Inc.
- Namhoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate-less interposer technology for a stacked silicon intercon...
- Patent number 8,946,884
- Issue date Feb 3, 2015
- Xilinx, Inc.
- Woon-Seong Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air through-silicon via structure
- Patent number 8,519,542
- Issue date Aug 27, 2013
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20230402430
- Publication date Dec 14, 2023
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost Package Structure For High Performance ML Memory Interface...
- Publication number 20220238504
- Publication date Jul 28, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnection Interface Die For Integrated Circuits Package
- Publication number 20220189934
- Publication date Jun 16, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20220157787
- Publication date May 19, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20220139876
- Publication date May 5, 2022
- Google LLC
- Woon-Seong Kwon
- G02 - OPTICS
Information Patent Application
ASIC PACKAGE WITH PHOTONICS AND VERTICAL POWER DELIVERY
- Publication number 20210074677
- Publication date Mar 11, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Substrate Core Spiral Inductor
- Publication number 20160300661
- Publication date Oct 13, 2016
- BROADCOM CORPORATION
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE ANTENNA SYSTEM
- Publication number 20160127972
- Publication date May 5, 2016
- AMAZON TECHNOLOGIES, INC.
- Peruvemba Ranganathan Sai Ananthanarayanan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
- Publication number 20140262440
- Publication date Sep 18, 2014
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCON...
- Publication number 20140252599
- Publication date Sep 11, 2014
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTIVITY USING FLEXIBLE CIRCUITRY
- Publication number 20130181360
- Publication date Jul 18, 2013
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR THROUGH-SILICON VIA STRUCTURE
- Publication number 20120032326
- Publication date Feb 9, 2012
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS WITH LOW PARASITIC CAPACITANCE
- Publication number 20110291287
- Publication date Dec 1, 2011
- Xilinx, Inc.
- Paul Y. Wu
- H01 - BASIC ELECTRIC ELEMENTS

Namhoon Kim

Person

Patents Grantslast 30 patents

Backside interconnection interface die for integrated circuits package

ASIC package with photonics and vertical power delivery

Backside integrated voltage regulator for integrated circuits

Integrated circuit package for high bandwidth memory

ASIC package with photonics and vertical power delivery

Individual radio frequency configuration for user devices

Multi-polarization antenna system on a single circuit board

Embedded substrate core spiral inductor

Individual radio frequency configuration for user devices

Embedded multi-band antenna in a band of a wearable electronic device

Antenna carriers with magneto-dielectric material and beam-shaping...

Adaptive antenna tuning based on a sensed characteristic

Reconfigurable antenna system

Mobile antenna array

Slot antenna and NFC antenna in an electronic device

Integrated circuit structure with inductor in silicon interposer

Antenna with adjustable electrical path length

Substrate-less interposer technology for a stacked silicon intercon...

Air through-silicon via structure

Patents Applicationslast 30 patents

Backside Integrated Voltage Regulator For Integrated Circuits

Low Cost Package Structure For High Performance ML Memory Interface...

Backside Interconnection Interface Die For Integrated Circuits Package

Backside Integrated Voltage Regulator For Integrated Circuits

Asic Package With Photonics And Vertical Power Delivery

ASIC PACKAGE WITH PHOTONICS AND VERTICAL POWER DELIVERY

Embedded Substrate Core Spiral Inductor

RECONFIGURABLE ANTENNA SYSTEM

MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE

SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCON...

INTEGRATED CIRCUIT CONNECTIVITY USING FLEXIBLE CIRCUITRY

AIR THROUGH-SILICON VIA STRUCTURE

THROUGH-SILICON VIAS WITH LOW PARASITIC CAPACITANCE