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Neil Mclellan
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Hong Kong, HK
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Patents Grants
last 30 patents
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
7,271,032
Issue date
Sep 18, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,995,460
Issue date
Feb 7, 2006
ASAT Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,989,294
Issue date
Jan 24, 2006
Asat, Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package and method of manufacturing the integrat...
Patent number
6,940,154
Issue date
Sep 6, 2005
ASAT Limited
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,933,594
Issue date
Aug 23, 2005
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
Patent number
6,872,661
Issue date
Mar 29, 2005
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Premolded cavity IC package
Patent number
6,841,859
Issue date
Jan 11, 2005
ASAT Ltd.
Labeeb Sadak Thamby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Premolded cavity IC package
Patent number
6,821,817
Issue date
Nov 23, 2004
ASAT Ltd.
Labeeb Sadak Thamby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing an integrated circuit package
Patent number
6,790,710
Issue date
Sep 14, 2004
ASAT Limited
Neil Robert McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
6,737,755
Issue date
May 18, 2004
Asat, Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip scale integrated circuit package
Patent number
6,667,191
Issue date
Dec 23, 2003
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
Patent number
6,635,957
Issue date
Oct 21, 2003
Asat LTD
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with partial etch die attach pad
Patent number
6,585,905
Issue date
Jul 1, 2003
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,498,099
Issue date
Dec 24, 2002
Asat LTD
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal foil laminated IC package
Patent number
6,429,048
Issue date
Aug 6, 2002
Asat LTD
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Exposed die leadless plastic chip carrier
Patent number
6,294,100
Issue date
Sep 25, 2001
Asat LTD
Nelson Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Saw-singulated leadless plastic chip carrier
Patent number
6,242,281
Issue date
Jun 5, 2001
ASAT, Limited
Neil Mclellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Saw-singulated leadless plastic chip carrier
Patent number
6,229,200
Issue date
May 8, 2001
ASAT Limited
Neil Mclellan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
Publication number
20060223237
Publication date
Oct 5, 2006
Edward G. Combs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package
Publication number
20050077613
Publication date
Apr 14, 2005
Neil Robert McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
Publication number
20040046241
Publication date
Mar 11, 2004
Edward G. Combs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package and method of manufacturing the integrat...
Publication number
20030234454
Publication date
Dec 25, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Enhanced thermal dissipation integrated circuit package and method...
Publication number
20030178719
Publication date
Sep 25, 2003
Edward G. Combs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing an encapsulated integrated circuit package
Publication number
20030143776
Publication date
Jul 31, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Encapsulated integrated circuit package and method of manufacturing...
Publication number
20030143781
Publication date
Jul 31, 2003
Neil Robert McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Saw singulated leadless plastic chip carrier
Publication number
20030102537
Publication date
Jun 5, 2003
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FOIL LAMINATED IC PACKAGE
Publication number
20020068378
Publication date
Jun 6, 2002
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Saw singulated leadless plastic chip carrier
Publication number
20020056856
Publication date
May 16, 2002
Neil Mclellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Saw-singulated leadless plastic chip carrier
Publication number
20010030355
Publication date
Oct 18, 2001
Neil Mclellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadless plastic chip carrier with etch back pad singulation and di...
Publication number
20010014538
Publication date
Aug 16, 2001
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS