Claims
- 1. A leadless plastic chip carrier comprising:a plurality of die attach pads; a semiconductor die mounted to said plurality of die attach pads; at least one row of contact pads circumscribing said plurality of die attach pads; a power/ground ring intermediate said at least one row of contact pads and said ground plane; a plurality of wire bonds connecting various ones of said semiconductor die, said contact pads and said power/ground ring; and an overmold covering said semiconductor die, said plurality of die attach pads, said power/ground ring and said contact pads such that each of said die attach pads and said contact pads has one exposed surface.
- 2. The leadless plastic chip carrier according to claim 1, wherein said plurality of die attach pads and said at least one row of contact pads comprise a plurality of metal layers.
- 3. The leadless plastic chip carrier according to claim 2, wherein each of said plurality of die attach pads are separated by a photo-imageable mask.
- 4. The leadless plastic chip carrier according to claim 2, wherein said plurality of metal layers comprises successive layers of Au, Ni, Cu, Ni and Au.
- 5. The leadless plastic chip carrier according to claim 2, wherein said plurality of metal lagers comprises successive layers of Au, Ni, Cu and Ag.
- 6. The leadless plastic chip carrier according to claim 2, wherein said plurality of metal layers comprises successive layers of Sn, Cu, Ni and Au.
- 7. The leadless plastic chip carrier according to claim 2, wherein said plurality of metal layers comprises successive layers of Sn, Cu, and Ag.
- 8. The leadless plastic chip carrier according to claim 1, wherein said plurality of die attach pads comprises an array of similarly sized pads.
- 9. The leadless plastic chip carrier according to claim 1, wherein said plurality of die attach pads, said at least one row of contact pads, and said power/ground ring comprises an array of similarly sized pads.
- 10. The leadless plastic chip carrier according to claim 9, wherein said array of similarly sized pads comprises an array of rectangular pads.
- 11. The leadless plastic chip carrier according to claim 10, wherein said array of similarly sized pads comprises an array of round pads.
- 12. The leadless plastic chip carrier according to claim 2, wherein said at least one row of contact pads is recessed from said photo-imageable mask in a plurality of etch-down cavities.
- 13. The leadless plastic chip carrier according to claim 12, further comprising a plurality of solder balls disposed in said each of said etch-down cavities.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation-in-part of U.S. patent application Ser. No. 09/288,352, now U.S. Pat. No. 6,498,099 filed Apr. 8, 1999, which is a continuation-in-part of U.S. patent application Ser. No. 09/095,803, filed Jun. 10, 1998 now U.S. Pat. No. 6,229,200.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
SHO 59-208756 |
Nov 1984 |
JP |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
09/288352 |
Apr 1999 |
US |
Child |
09/802679 |
|
US |
Parent |
09/095803 |
Jun 1998 |
US |
Child |
09/288352 |
|
US |