Nicholas A. Polomoff

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bragg reflector for photonic chip security structure
- Patent number 12,204,144
- Issue date Jan 21, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Crackstop with embedded passive radio frequency noise suppressor an...
- Patent number 11,855,005
- Issue date Dec 26, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photonics chips including cavities with non-right-angle internal co...
- Patent number 11,828,983
- Issue date Nov 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Grant
Photonic chip security structure
- Patent number 11,815,717
- Issue date Nov 14, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pic structure having barrier surrounding opening for optical elemen...
- Patent number 11,804,452
- Issue date Oct 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics chips and semiconductor products having angled optical fi...
- Patent number 11,774,689
- Issue date Oct 3, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Bartlomiej Jan Pawlak
- G02 - OPTICS
Information Patent Grant
Barrier structure with passage for waveguide in photonic integrated...
- Patent number 11,740,418
- Issue date Aug 29, 2023
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-size converters with angled facets
- Patent number 11,719,895
- Issue date Aug 8, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Grant
Cascaded sensing circuits for detecting and monitoring cracks in an...
- Patent number 11,693,048
- Issue date Jul 4, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G01 - MEASURING TESTING
Information Patent Grant
PIC die and package with cover for multiple level and multiple dept...
- Patent number 11,650,381
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Corner structures for an optical fiber groove and manufacturing met...
- Patent number 11,569,180
- Issue date Jan 31, 2023
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics chips with an edge coupler and a continuous crackstop
- Patent number 11,543,606
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Cascaded sensing circuits for detecting and monitoring cracks in an...
- Patent number 11,215,661
- Issue date Jan 4, 2022
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- G01 - MEASURING TESTING
Information Patent Grant
Corner structures for an optical fiber groove
- Patent number 11,145,606
- Issue date Oct 12, 2021
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack detecting and monitoring system for an integrated circuit
- Patent number 11,105,846
- Issue date Aug 31, 2021
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- G01 - MEASURING TESTING
Information Patent Grant
Hermetic barrier for semiconductor device
- Patent number 11,037,873
- Issue date Jun 15, 2021
- MARVELL GOVERNMENT SOLUTIONS, LLC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring for photonic integrated circuit die
- Patent number 10,770,412
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with interdigitated conductive elements between metal...
- Patent number 10,770,407
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected integrated circuit (IC) chip structure and packaging...
- Patent number 10,714,411
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure of integrated circuit and method of forming same
- Patent number 10,546,822
- Issue date Jan 28, 2020
- GLOBALFOUNDRIES Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arc-resistant crackstop
- Patent number 10,438,902
- Issue date Oct 8, 2019
- GLOBALFOUNDRIES Inc.
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stop with overlapping vias
- Patent number 10,153,232
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crackstop structures
- Patent number 10,109,600
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack-stop structure for an IC product and methods of making such a...
- Patent number 10,090,258
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Kevin Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack trapping in semiconductor device structures
- Patent number 10,068,859
- Issue date Sep 4, 2018
- GLOBALFOUNDRIES Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip alignment mark exposing method enabling wafer level under...
- Patent number 9,824,925
- Issue date Nov 21, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,754,823
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,748,135
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal solder joints for 3D packaging
- Patent number 9,343,420
- Issue date May 17, 2016
- GLOBALFOUNDRIES Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backside Contact With Self-Aligned Gate Isolation
- Publication number 20250031448
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC OPTICAL FIBER PACKAGING
- Publication number 20250004208
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- G02 - OPTICS
Information Patent Application
Three Dimensional Crackstop Interweave Architectural Design Using S...
- Publication number 20250006658
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK
- Publication number 20240363617
- Publication date Oct 31, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS
- Publication number 20240203816
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT
- Publication number 20240194691
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED SOURCE/DRAIN CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR
- Publication number 20240170532
- Publication date May 23, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...
- Publication number 20240105612
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BACKSIDE CONTACT WITH REPLACEMENT BACKSIDE DIELECTRIC
- Publication number 20240105613
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE T...
- Publication number 20240088037
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...
- Publication number 20240030160
- Publication date Jan 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPOT-SIZE CONVERTERS WITH ANGLED FACETS
- Publication number 20230266544
- Publication date Aug 24, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...
- Publication number 20230228940
- Publication date Jul 20, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP SECURITY STRUCTURE
- Publication number 20230152518
- Publication date May 18, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor JAIN
- G02 - OPTICS
Information Patent Application
BRAGG REFLECTOR FOR PHOTONIC CHIP SECURITY STRUCTURE
- Publication number 20230152501
- Publication date May 18, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G01 - MEASURING TESTING
Information Patent Application
PHOTONICS CHIPS AND SEMICONDUCTOR PRODUCTS HAVING ANGLED OPTICAL FI...
- Publication number 20230127056
- Publication date Apr 27, 2023
- GLOBALFOUNDRIES U.S. Inc.
- BARTLOMIEJ JAN PAWLAK
- G02 - OPTICS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20230130467
- Publication date Apr 27, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...
- Publication number 20230030723
- Publication date Feb 2, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...
- Publication number 20220406732
- Publication date Dec 22, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BARRIER STRUCTURE WITH PASSAGE FOR WAVEGUIDE IN PHOTONIC INTEGRATED...
- Publication number 20220308297
- Publication date Sep 29, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIPS WITH AN EDGE COUPLER AND A CONTINUOUS CRACKSTOP
- Publication number 20220291464
- Publication date Sep 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS

Nicholas A. Polomoff

Person

Patents Grantslast 30 patents

Bragg reflector for photonic chip security structure

PIC die and package with multiple level and multiple depth connecti...

Crackstop with embedded passive radio frequency noise suppressor an...

Photonics chips including cavities with non-right-angle internal co...

Photonic chip security structure

Pic structure having barrier surrounding opening for optical elemen...

Photonics chips and semiconductor products having angled optical fi...

Barrier structure with passage for waveguide in photonic integrated...

Spot-size converters with angled facets

Cascaded sensing circuits for detecting and monitoring cracks in an...

PIC die and package with cover for multiple level and multiple dept...

Corner structures for an optical fiber groove and manufacturing met...

Photonics chips with an edge coupler and a continuous crackstop

Cascaded sensing circuits for detecting and monitoring cracks in an...

Corner structures for an optical fiber groove

Crack detecting and monitoring system for an integrated circuit

Hermetic barrier for semiconductor device

Guard ring for photonic integrated circuit die

IC structure with interdigitated conductive elements between metal...

Interconnected integrated circuit (IC) chip structure and packaging...

Seal ring structure of integrated circuit and method of forming same

Arc-resistant crackstop

Crack stop with overlapping vias

Crackstop structures

Crack-stop structure for an IC product and methods of making such a...

Crack trapping in semiconductor device structures

Flip chip alignment mark exposing method enabling wafer level under...

Substrate including selectively formed barrier layer

Substrate including selectively formed barrier layer

Universal solder joints for 3D packaging

Patents Applicationslast 30 patents

Backside Contact With Self-Aligned Gate Isolation

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

PHOTONIC OPTICAL FIBER PACKAGING

Three Dimensional Crackstop Interweave Architectural Design Using S...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT

SHARED SOURCE/DRAIN CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...

DIRECT BACKSIDE CONTACT WITH REPLACEMENT BACKSIDE DIELECTRIC

INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE T...

CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...

SPOT-SIZE CONVERTERS WITH ANGLED FACETS

PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...

PHOTONIC CHIP SECURITY STRUCTURE

BRAGG REFLECTOR FOR PHOTONIC CHIP SECURITY STRUCTURE

PHOTONICS CHIPS AND SEMICONDUCTOR PRODUCTS HAVING ANGLED OPTICAL FI...

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...

CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...

BARRIER STRUCTURE WITH PASSAGE FOR WAVEGUIDE IN PHOTONIC INTEGRATED...

PHOTONICS CHIPS WITH AN EDGE COUPLER AND A CONTINUOUS CRACKSTOP