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Nina Yukov
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Orange, CT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Copper foil with low profile bond enhancement
Patent number
6,893,742
Issue date
May 17, 2005
Olin Corporation
Szuchain F. Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper foil composite including a release layer
Patent number
6,689,268
Issue date
Feb 10, 2004
Olin Corporation
Szuchain Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper foil composite including a release layer
Patent number
6,346,335
Issue date
Feb 12, 2002
Olin Corporation
Szuchain Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Nodular copper/nickel alloy treatment for copper foil
Patent number
5,800,930
Issue date
Sep 1, 1998
Olin Corporation
Szuchain Chen
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Protective coating having adhesion improving characteristics
Patent number
5,300,158
Issue date
Apr 5, 1994
Olin Corporation
Szuchain Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chromium-zinc anti-tarnish coating for copper foil
Patent number
5,230,932
Issue date
Jul 27, 1993
Olin Corporation
Szuchain F. Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Copper foil with low profile bond enhancement
Publication number
20050123782
Publication date
Jun 9, 2005
Szuchain F. Chen
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper foil with low profile bond enhancement
Publication number
20020192486
Publication date
Dec 19, 2002
Olin Corporation, a corporation of the State of Virginia
Szuchain F. Chen
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper foil composite including a release layer
Publication number
20010027922
Publication date
Oct 11, 2001
Szuchain Chen
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC