Claims
- 1. A composite foil, comprising:
- a wrought copper or copper based alloy substrate; and
- a nodular coating layer having a dark brown to black color adjacent to at least one surface of said copper or copper based alloy substrate, said nodular coating layer being an alloy of copper and nickel containing, by weight, from 55% to 95% of copper and the balance nickel, and nodules forming said nodular coating layer having an average cross-sectional width of from about 0.05 micron to about 5 microns and an average height of from about 0.5 micron to about 3 microns whereby said nodular coating layer has an etch rate in excess of that of a non-nodular copper/nickel alloy coating having substantially the same ratio of copper to nickel in the deposited coating layer when etched in an alkaline ammonia solution.
- 2. The composite foil of claim 1 wherein said nodular coating layer contains from 70% to 95% by weight of copper and the balance nickel.
- 3. The composite foil of claim 2 wherein said nodules have an average cross-sectional width of from about 0.1 micron to about 1 micron and an average height of from about 0.7 micron to about 1.5 microns.
CROSS REFERENCE TO RELATED APPLICATION
This patent application is a continuation of U.S. patent application Ser. No. 08/522,797 by Szuchain Chen et al. that was filed on Sep. 5, 1995 and is now abandoned, which in turn is a continuation of U.S. patent application Ser. No. 08/184,534 by Szuchain Chen et al. that was filed on Jan. 21, 1994 and is now abandoned.
US Referenced Citations (31)
Foreign Referenced Citations (11)
Number |
Date |
Country |
0 396 056 |
Nov 1990 |
EPX |
52-24133 |
Feb 1977 |
JPX |
52-145769 |
Dec 1977 |
JPX |
54-013971 |
Jan 1979 |
JPX |
2-084326 |
Mar 1990 |
JPX |
4-284690 |
Oct 1992 |
JPX |
5-029740 |
Feb 1993 |
JPX |
957808 |
May 1964 |
GBX |
1 558 919 |
Jan 1980 |
GBX |
WPI 80-85631C |
Nov 1980 |
WOX |
WPI 94-23162 |
Dec 1993 |
WOX |
Non-Patent Literature Citations (2)
Entry |
Anonymous, Electroplated Copper Foil, Research Disclosure, No. 199, Nov. 1980, Article No. 19901, pp. 435-436. |
Abner Brenner, Electrodeposition of Alloys, Principles and Practice, vol. I, Academic Press, New York, 1963, month of publication not available pp. 558-562. |
Continuations (2)
|
Number |
Date |
Country |
Parent |
522797 |
Sep 1995 |
|
Parent |
184534 |
Jan 1994 |
|