Paul Marlan Harvey

Person

Auatin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging for eight-socket one-hop SMP topology
- Patent number 9,456,506
- Issue date Sep 27, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging for eight-socket one-hop SMP topology
- Patent number 9,445,507
- Issue date Sep 13, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing impedance discontinuity in packages
- Patent number 8,791,372
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module system with removable socketed modules
- Patent number 8,680,670
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise suppressor for semiconductor packages
- Patent number 8,631,706
- Issue date Jan 21, 2014
- International Business Machines Corporation
- Nickolaus J Gruendler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to reduce impedance discontinuity in packages
- Patent number 8,440,917
- Issue date May 14, 2013
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System to improve coreless package connections
- Patent number 8,338,949
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System to improve coreless package connections
- Patent number 8,222,739
- Issue date Jul 17, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of ball grid array package construction with raised solder b...
- Patent number 8,153,516
- Issue date Apr 10, 2012
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically optimized and structurally protected via structure for...
- Patent number 7,911,049
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package construction with raised solder ball pads
- Patent number 7,816,754
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically optimized and structurally protected via structure for...
- Patent number 7,687,391
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for reducing simultaneous switching noise in an...
- Patent number 7,492,570
- Issue date Feb 17, 2009
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with integrated capacitor
- Patent number 7,388,275
- Issue date Jun 17, 2008
- 3M Innovative Properties Company
- John D. Geissinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package construction with raised solder ball pads
- Patent number 7,253,510
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedane measurement of chip, package, and board power supply syste...
- Patent number 7,203,608
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Makoto Aikawa
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package with integrated capacitor
- Patent number 7,064,412
- Issue date Jun 20, 2006
- 3M Innovative Properties Company
- John D. Geissinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex-based IC package construction employing a balanced lamination
- Patent number 6,876,088
- Issue date Apr 5, 2005
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of apparatus for interconnecting a relatively fine pitch cir...
- Patent number 6,867,121
- Issue date Mar 15, 2005
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit having a via matrix interlayer connection and m...
- Patent number 6,153,508
- Issue date Nov 28, 2000
- 3M Innovative Properties Company
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process for flex circuit applications
- Patent number 6,150,071
- Issue date Nov 21, 2000
- 3M Innovative Properties Company
- Paul M. Harvey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated integrated circuit package
- Patent number 6,140,707
- Issue date Oct 31, 2000
- 3M Innovative Properties Co.
- Anthony R. Plepys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit having a via matrix interlayer connection
- Patent number 5,753,976
- Issue date May 19, 1998
- Minnesota Mining and Manufacturing Company
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Floating point numeric data processor
- Patent number 4,777,613
- Issue date Oct 11, 1988
- Motorola Inc.
- Van B. Shahan
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Packaging for Eight-Socket One-Hop SMP Topology
- Publication number 20150271926
- Publication date Sep 24, 2015
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging for Eight-Socket One-Hop SMP Topology
- Publication number 20150177794
- Publication date Jun 25, 2015
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus to Reduce Impedance Discontinuity in Packages
- Publication number 20130075148
- Publication date Mar 28, 2013
- IBM Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING INCLUDING AUXILIARY CIRCUITRY
- Publication number 20120175763
- Publication date Jul 12, 2012
- International Business Machines Corporation
- PAUL M. HARVEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS
- Publication number 20120138349
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
- Publication number 20120098116
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES
- Publication number 20120020042
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Nickolaus J. Gruendler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS
- Publication number 20110147044
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Ball Grid Array Package Construction with Raised Solder B...
- Publication number 20100308460
- Publication date Dec 9, 2010
- Paul Marlan Harvey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
GENERATING WORST CASE BIT PATTERNS FOR SIMULTANEOUS SWITCHING NOISE...
- Publication number 20100017158
- Publication date Jan 21, 2010
- International Business Machines Corporation
- Rohan Mandrekar
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS
- Publication number 20090302874
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Paul M. Harvey
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus to Reduce Impedance Discontinuity in Packages
- Publication number 20090126983
- Publication date May 21, 2009
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Patterned Circuits and Method for Making Same
- Publication number 20090008133
- Publication date Jan 8, 2009
- Jeffrey W. Bullard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Optimized and Structurally Protected Via Structure for...
- Publication number 20080272862
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Optimized and Structurally Protected Via Structure for...
- Publication number 20080073796
- Publication date Mar 27, 2008
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PADS
- Publication number 20070228566
- Publication date Oct 4, 2007
- Paul Marlan Harvey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Systems and methods for reducing simultaneous switching noise in an...
- Publication number 20060231947
- Publication date Oct 19, 2006
- Toshiba America Elec.
- Eiichi Hosomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED CAPACITOR
- Publication number 20060203458
- Publication date Sep 14, 2006
- 3M Innovative Properties Company
- John D. Geissinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip interconnection method and apparatus
- Publication number 20040201970
- Publication date Oct 14, 2004
- International Business Machines Corporation
- Paul Marlan Harvey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for interconnecting a relatively fine pitch ci...
- Publication number 20040140560
- Publication date Jul 22, 2004
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex-based ic package construction employing a balanced lamination
- Publication number 20040140538
- Publication date Jul 22, 2004
- International Business Machines Corporation
- Paul Marlan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array package construction with raised solder ball pads
- Publication number 20040141298
- Publication date Jul 22, 2004
- International Business Machines Corporation
- Paul Marlan Harvey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic package with integrated capacitor
- Publication number 20030015787
- Publication date Jan 23, 2003
- John D. Geissinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated integrated circuit package
- Publication number 20010052647
- Publication date Dec 20, 2001
- 3M Innovative Properties Company
- Anthony R. Plepys
- H01 - BASIC ELECTRIC ELEMENTS

Paul Marlan Harvey

Person

Patents Grantslast 30 patents

Packaging for eight-socket one-hop SMP topology

Packaging for eight-socket one-hop SMP topology

Reducing impedance discontinuity in packages

Multi-chip module system with removable socketed modules

Noise suppressor for semiconductor packages

Method and apparatus to reduce impedance discontinuity in packages

System to improve coreless package connections

System to improve coreless package connections

Method of ball grid array package construction with raised solder b...

Electrically optimized and structurally protected via structure for...

Ball grid array package construction with raised solder ball pads

Electrically optimized and structurally protected via structure for...

Systems and methods for reducing simultaneous switching noise in an...

Electronic package with integrated capacitor

Ball grid array package construction with raised solder ball pads

Impedane measurement of chip, package, and board power supply syste...

Electronic package with integrated capacitor

Flex-based IC package construction employing a balanced lamination

Method of apparatus for interconnecting a relatively fine pitch cir...

Multi-layer circuit having a via matrix interlayer connection and m...

Fabrication process for flex circuit applications

Laminated integrated circuit package

Multi-layer circuit having a via matrix interlayer connection

Floating point numeric data processor

Patents Applicationslast 30 patents

Packaging for Eight-Socket One-Hop SMP Topology

Packaging for Eight-Socket One-Hop SMP Topology

Method and Apparatus to Reduce Impedance Discontinuity in Packages

INTEGRATED CIRCUIT PACKAGING INCLUDING AUXILIARY CIRCUITRY

SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES

SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS

Method of Ball Grid Array Package Construction with Raised Solder B...

GENERATING WORST CASE BIT PATTERNS FOR SIMULTANEOUS SWITCHING NOISE...

METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS

Method and Apparatus to Reduce Impedance Discontinuity in Packages

Patterned Circuits and Method for Making Same

Electrically Optimized and Structurally Protected Via Structure for...

Electrically Optimized and Structurally Protected Via Structure for...

BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PADS

Systems and methods for reducing simultaneous switching noise in an...

ELECTRONIC PACKAGE WITH INTEGRATED CAPACITOR

Chip interconnection method and apparatus

Method and apparatus for interconnecting a relatively fine pitch ci...

Flex-based ic package construction employing a balanced lamination

Ball grid array package construction with raised solder ball pads

Electronic package with integrated capacitor

Laminated integrated circuit package