Paul William Dryer

Person

Lexington, KY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microfluidic cartridge comprising silicone pressure-sensitive adhesive
- Patent number 11,938,477
- Issue date Mar 26, 2024
- The Procter & Gamble Company
- Chisomaga Ugochi Nwachukwu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Sealing tape for organic solvent-based fluidic cartridges
- Patent number 11,433,681
- Issue date Sep 6, 2022
- Funai Electric Co., Ltd.
- Jacob Boyle
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Organic solvent sealing tape
- Patent number 10,987,935
- Issue date Apr 27, 2021
- FUNAI ELECTRIC CO. LTD
- Paul W. Dryer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluidic ejection cartridge for improved protective tape removal
- Patent number 10,814,638
- Issue date Oct 27, 2020
- FUNAI ELECTRIC CO. LTD
- Paul W. Dryer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluidic ejection cartridge for improved protective tape removal
- Patent number 10,384,458
- Issue date Aug 20, 2019
- Funai Electric Co., Ltd.
- James D. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead cartridge with hydrophobic coating
- Patent number 9,844,940
- Issue date Dec 19, 2017
- Funai Electric Co., Ltd.
- Paul W. Dryer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printhead cartridge with hydrophobic coating
- Patent number 9,630,416
- Issue date Apr 25, 2017
- Funai Electric Co., Ltd.
- Paul W. Dryer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printhead cartridge with hydrophobic coating
- Patent number 9,365,044
- Issue date Jun 14, 2016
- Funai Electric Co., Ltd.
- Paul W. Dryer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Label for inkjet printhead
- Patent number 9,132,654
- Issue date Sep 15, 2015
- Funai Electric Co., Ltd.
- Paul W. Dryer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Formulation for silicon-doped ink used to prevent chip etching
- Patent number 8,956,450
- Issue date Feb 17, 2015
- Funai Electric Co., Ltd.
- Paul William Dryer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Modular micro-fluid ejection head assembly
- Patent number 8,882,221
- Issue date Nov 11, 2014
- Funai Electric Co., Ltd.
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for making a substantially planar micro-fluid ejection head
- Patent number 8,826,502
- Issue date Sep 9, 2014
- Funai Electric Co., Ltd.
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Spray coatable adhesive for bonding silicon dies to rigid substrates
- Patent number 8,785,524
- Issue date Jul 22, 2014
- Funai Electric Co., Ltd.
- Xiaoming Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Non-photosensitive siloxane coating for processing hydrophobic phot...
- Patent number 8,728,715
- Issue date May 20, 2014
- Funai Electric Co., Ltd.
- David Bernard
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Fluid ejection device and method for fabricating fluid ejection device
- Patent number 8,491,095
- Issue date Jul 23, 2013
- Funai Electric Co., Ltd.
- Andrew L. McNees
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads and methods for bonding substrates to su...
- Patent number 8,324,076
- Issue date Dec 4, 2012
- Lexmark International, Inc.
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate
- Patent number 8,087,756
- Issue date Jan 3, 2012
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Methods for planarizing unevenness on surface of wafer photoresist...
- Patent number 8,071,275
- Issue date Dec 6, 2011
- Lexmark International, Inc.
- David Laurier Bernard
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate and metho...
- Patent number 7,938,513
- Issue date May 10, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads and methods for bonding substrates to su...
- Patent number 7,815,289
- Issue date Oct 19, 2010
- Lexmark International, Inc.
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of bonding a micro-fluid ejection head to a support substrate
- Patent number 7,735,952
- Issue date Jun 15, 2010
- Lexmark International, Inc.
- David L. Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of removing residue from a substrate after a DRIE process
- Patent number 7,531,047
- Issue date May 12, 2009
- Lexmark International, Inc.
- Paul William Dryer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEALING TAPE FOR ORGANIC SOLVENT-BASED FLUIDIC CARTRIDGES
- Publication number 20210213745
- Publication date Jul 15, 2021
- Funai Electric Co., Ltd.
- Jacob BOYLE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICROFLUIDIC CARTRIDGE COMPRISING SILICONE PRESSURE-SENSITIVE ADHESIVE
- Publication number 20210016279
- Publication date Jan 21, 2021
- The Procter & Gamble Company
- Chisomaga Ugochi NWACHUKWU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
FLUIDIC EJECTION CARTRIDGE FOR IMPROVED PROTECTIVE TAPE REMOVAL
- Publication number 20190344573
- Publication date Nov 14, 2019
- Funai Electric Co., Ltd.
- Paul W. DRYER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING
- Publication number 20170217170
- Publication date Aug 3, 2017
- Funai Electric Co., Ltd.
- Paul W. DRYER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING
- Publication number 20160257125
- Publication date Sep 8, 2016
- Funai Electric Co., Ltd.
- Paul W. DRYER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING
- Publication number 20160167389
- Publication date Jun 16, 2016
- Funai Electronic Co., Ltd.
- Paul W. DRYER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
NON-PHOTOSENSITIVE SILOXANE COATING FOR PROCESSING HYDROPHOBIC PHOT...
- Publication number 20140203114
- Publication date Jul 24, 2014
- Funai Electric Co., Ltd.
- David BERNARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING
- Publication number 20140026783
- Publication date Jan 30, 2014
- Paul William DRYER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NON-PHOTOSENSITIVE SILOXANE COATING FOR PROCESSING HYDROPHOBIC PHOT...
- Publication number 20130183450
- Publication date Jul 18, 2013
- David BERNARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Group...
- Publication number 20130048601
- Publication date Feb 28, 2013
- Paul Dryer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE
- Publication number 20120229569
- Publication date Sep 13, 2012
- Andrew L. McNees
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE...
- Publication number 20110318882
- Publication date Dec 29, 2011
- Xiaoming Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES
- Publication number 20110319513
- Publication date Dec 29, 2011
- Xiaoming Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE
- Publication number 20110205305
- Publication date Aug 25, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...
- Publication number 20100229391
- Publication date Sep 16, 2010
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...
- Publication number 20100230047
- Publication date Sep 16, 2010
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
BONDING A MICRO-FLUID EJECTION HEAD TO A SUPPORT SUBSTRATE
- Publication number 20100206840
- Publication date Aug 19, 2010
- David L. Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MODULAR MICRO-FLUID EJECTION HEAD ASSEMBLY
- Publication number 20100045736
- Publication date Feb 25, 2010
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHODS FOR PLANARIZING UNEVENNESS ON SURFACE OF WAFER PHOTORESIST...
- Publication number 20090258322
- Publication date Oct 15, 2009
- David Laurier Bernard
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...
- Publication number 20090256891
- Publication date Oct 15, 2009
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...
- Publication number 20090058945
- Publication date Mar 5, 2009
- David Laurier Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method Of Bonding A Micro-Fluid Ejection Head To A Support Substrate
- Publication number 20080252692
- Publication date Oct 16, 2008
- David L. Bernard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK TANK HAVING INTEGRATED RFID TAG
- Publication number 20080186367
- Publication date Aug 7, 2008
- Lexmark International, Inc.
- Christopher Alan Adkins
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK TANK HAVING INTEGRATED RFID TAG
- Publication number 20080186187
- Publication date Aug 7, 2008
- Christopher Alan Adkins
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method and Apparatus for Maximizing Cooling for Wafer Processing
- Publication number 20080083700
- Publication date Apr 10, 2008
- Lexmark International, Inc.
- David Laurier Bernard
- H01 - BASIC ELECTRIC ELEMENTS

Paul William Dryer

Person

Patents Grantslast 30 patents

Microfluidic cartridge comprising silicone pressure-sensitive adhesive

Sealing tape for organic solvent-based fluidic cartridges

Organic solvent sealing tape

Fluidic ejection cartridge for improved protective tape removal

Fluidic ejection cartridge for improved protective tape removal

Printhead cartridge with hydrophobic coating

Printhead cartridge with hydrophobic coating

Printhead cartridge with hydrophobic coating

Label for inkjet printhead

Formulation for silicon-doped ink used to prevent chip etching

Modular micro-fluid ejection head assembly

Method for making a substantially planar micro-fluid ejection head

Spray coatable adhesive for bonding silicon dies to rigid substrates

Non-photosensitive siloxane coating for processing hydrophobic phot...

Fluid ejection device and method for fabricating fluid ejection device

Micro-fluid ejection heads and methods for bonding substrates to su...

Heater chips with silicon die bonded on silicon substrate

Methods for planarizing unevenness on surface of wafer photoresist...

Heater chips with silicon die bonded on silicon substrate and metho...

Micro-fluid ejection heads and methods for bonding substrates to su...

Method of bonding a micro-fluid ejection head to a support substrate

Method of removing residue from a substrate after a DRIE process

Patents Applicationslast 30 patents

SEALING TAPE FOR ORGANIC SOLVENT-BASED FLUIDIC CARTRIDGES

MICROFLUIDIC CARTRIDGE COMPRISING SILICONE PRESSURE-SENSITIVE ADHESIVE

FLUIDIC EJECTION CARTRIDGE FOR IMPROVED PROTECTIVE TAPE REMOVAL

PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING

PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING

PRINTHEAD CARTRIDGE WITH HYDROPHOBIC COATING

NON-PHOTOSENSITIVE SILOXANE COATING FOR PROCESSING HYDROPHOBIC PHOT...

FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

NON-PHOTOSENSITIVE SILOXANE COATING FOR PROCESSING HYDROPHOBIC PHOT...

Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Group...

FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE

METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE...

SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE

MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...

MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...

BONDING A MICRO-FLUID EJECTION HEAD TO A SUPPORT SUBSTRATE

MODULAR MICRO-FLUID EJECTION HEAD ASSEMBLY

METHODS FOR PLANARIZING UNEVENNESS ON SURFACE OF WAFER PHOTORESIST...

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...

MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SU...

Method Of Bonding A Micro-Fluid Ejection Head To A Support Substrate

INK TANK HAVING INTEGRATED RFID TAG

INK TANK HAVING INTEGRATED RFID TAG

Method and Apparatus for Maximizing Cooling for Wafer Processing