Peter A. Benson

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level packaged microelectronic imagers having interconnects f...
- Patent number 8,816,463
- Issue date Aug 26, 2014
- Round Rock Research, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Non-chemical, non-optical edge bead removal process
- Patent number 8,641,831
- Issue date Feb 4, 2014
- Micron Technology, Inc.
- Peter A. Benson
- B08 - CLEANING
Information Patent Grant
Non-chemical, non-optical edge bead removal process
- Patent number 8,192,555
- Issue date Jun 5, 2012
- Micron Technology, Inc.
- Peter A. Benson
- B08 - CLEANING
Information Patent Grant
Semiconductor devices and assemblies including back side redistribu...
- Patent number 7,994,547
- Issue date Aug 9, 2011
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for use in thinning semiconductor substrates and...
- Patent number 7,960,829
- Issue date Jun 14, 2011
- Micron Technology, Inc.
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Microelectronics devices, having vias, and packaged microelectronic...
- Patent number 7,759,800
- Issue date Jul 20, 2010
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thinning semiconductor substrates that employ support s...
- Patent number 7,713,841
- Issue date May 11, 2010
- Micron Technology, Inc.
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,709,776
- Issue date May 4, 2010
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating electrically conductive elements for semiconduc...
- Patent number 7,629,250
- Issue date Dec 8, 2009
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for spin coating semiconductor substrates
- Patent number 7,615,119
- Issue date Nov 10, 2009
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for retrieving residual liquid during immersion...
- Patent number 7,583,358
- Issue date Sep 1, 2009
- Micron Technology, Inc.
- Peter A. Benson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods for packing microfeature devices and microfeature devices f...
- Patent number 7,579,684
- Issue date Aug 25, 2009
- Micron Technology, Inc.
- Peter A. Benson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for creating conductive elements for semiconductor device st...
- Patent number 7,575,999
- Issue date Aug 18, 2009
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a microlens including selectively curing flo...
- Patent number 7,521,296
- Issue date Apr 21, 2009
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,504,615
- Issue date Mar 17, 2009
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having plate, stacked dice and conductive vias
- Patent number 7,498,675
- Issue date Mar 3, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer assemblies
- Patent number 7,489,020
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlenses including a plurality of mutually adhered layers of opt...
- Patent number 7,488,618
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor components with thinned substr...
- Patent number 7,459,393
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive elements using organometallic layers...
- Patent number 7,442,643
- Issue date Oct 28, 2008
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature methods of forming back side redistribution layers...
- Patent number 7,435,620
- Issue date Oct 14, 2008
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers and methods of packaging microelectronic im...
- Patent number 7,419,841
- Issue date Sep 2, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature methods of forming back side redistribution layers...
- Patent number 7,419,852
- Issue date Sep 2, 2008
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming vias in microelectronic devices, and methods fo...
- Patent number 7,413,979
- Issue date Aug 19, 2008
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging and testing microelectronic imaging devices
- Patent number 7,341,881
- Issue date Mar 11, 2008
- Micron Technology, Inc.
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,265,330
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optics units and methods of manufacturing integrated opt...
- Patent number 7,253,957
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer edge ring structures and methods of formation
- Patent number 7,244,665
- Issue date Jul 17, 2007
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supports for use with programmable material consolidation...
- Patent number 7,239,933
- Issue date Jul 3, 2007
- Micron Technology, Inc.
- William M. Hiatt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for packaging a plurality of semiconductor dice using a flo...
- Patent number 7,235,431
- Issue date Jun 26, 2007
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR NON-CHEMICAL, NON-OPTICAL EDGE BEAD REMOVAL
- Publication number 20140130981
- Publication date May 15, 2014
- Micron Technology, Inc.
- Peter A. Benson
- B08 - CLEANING
Information Patent Application
Non-Chemical, Non-Optical Edge Bead Removal Process
- Publication number 20120234361
- Publication date Sep 20, 2012
- Peter A. Benson
- B08 - CLEANING
Information Patent Application
WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...
- Publication number 20120104528
- Publication date May 3, 2012
- ROUND ROCK RESEARCH, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...
- Publication number 20090155949
- Publication date Jun 18, 2009
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS...
- Publication number 20080277799
- Publication date Nov 13, 2008
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS...
- Publication number 20070259517
- Publication date Nov 8, 2007
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate supports for use with programmable material consolidation...
- Publication number 20070179654
- Publication date Aug 2, 2007
- William M. Hiatt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20070170350
- Publication date Jul 26, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for supporting substrates during fabrication of one or more...
- Publication number 20070168074
- Publication date Jul 19, 2007
- William M. Hiatt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods for removing and reclaiming unconsolidated material from su...
- Publication number 20070157952
- Publication date Jul 12, 2007
- William M. Hiatt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor component having plate, stacked dice and conductive vias
- Publication number 20070132104
- Publication date Jun 14, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating electrically conductive elements for semiconduc...
- Publication number 20070066048
- Publication date Mar 22, 2007
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for retrieving residual liquid during immersion...
- Publication number 20070019172
- Publication date Jan 25, 2007
- Micron Technology, Inc.
- Peter A. Benson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for fabricating semiconductor components with thinned substr...
- Publication number 20060270108
- Publication date Nov 30, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers and methods of packaging microelectronic im...
- Publication number 20060261340
- Publication date Nov 23, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices, methods for forming vias in microelectroni...
- Publication number 20060264041
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic imaging devices and methods of packaging m...
- Publication number 20060255418
- Publication date Nov 16, 2006
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20060243889
- Publication date Nov 2, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming backside alignment markers useable in semicondu...
- Publication number 20060226118
- Publication date Oct 12, 2006
- Pary Baluswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic devices, methods for forming vias in microelectroni...
- Publication number 20060216862
- Publication date Sep 28, 2006
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging microfeature devices and microfeature devices...
- Publication number 20060205116
- Publication date Sep 14, 2006
- Micron Technology, Inc.
- Peter A. Benson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic devices having conductive complementary structures...
- Publication number 20060202315
- Publication date Sep 14, 2006
- Micron Technology, Inc.
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for spin coating semiconductor substrates
- Publication number 20060191475
- Publication date Aug 31, 2006
- Peter A. Benson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor wafer assemblies
- Publication number 20060192283
- Publication date Aug 31, 2006
- Peter A. Benson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Microlenses including a plurality of mutually adhered layers of opt...
- Publication number 20060134827
- Publication date Jun 22, 2006
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming conductive elements using organometallic layers...
- Publication number 20060115926
- Publication date Jun 1, 2006
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating a microlens including selectively curing flo...
- Publication number 20060115925
- Publication date Jun 1, 2006
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having plate and stacked dice
- Publication number 20060113682
- Publication date Jun 1, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic imaging devices and methods of packaging m...
- Publication number 20060043509
- Publication date Mar 2, 2006
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating electrically conductive elements for semiconduc...
- Publication number 20060046461
- Publication date Mar 2, 2006
- Peter A. Benson
- H01 - BASIC ELECTRIC ELEMENTS

Peter A. Benson

Person

Patents Grantslast 30 patents

Wafer-level packaged microelectronic imagers having interconnects f...

Non-chemical, non-optical edge bead removal process

Non-chemical, non-optical edge bead removal process

Semiconductor devices and assemblies including back side redistribu...

Support structure for use in thinning semiconductor substrates and...

Microelectronics devices, having vias, and packaged microelectronic...

Methods for thinning semiconductor substrates that employ support s...

Microelectronic imagers with optical devices and methods of manufac...

Method for creating electrically conductive elements for semiconduc...

Apparatus for spin coating semiconductor substrates

Systems and methods for retrieving residual liquid during immersion...

Methods for packing microfeature devices and microfeature devices f...

Method for creating conductive elements for semiconductor device st...

Methods of fabricating a microlens including selectively curing flo...

Microelectronic imagers with optical devices and methods of manufac...

Semiconductor component having plate, stacked dice and conductive vias

Semiconductor wafer assemblies

Microlenses including a plurality of mutually adhered layers of opt...

Method for fabricating semiconductor components with thinned substr...

Methods of forming conductive elements using organometallic layers...

Low temperature methods of forming back side redistribution layers...

Microelectronic imagers and methods of packaging microelectronic im...

Low temperature methods of forming back side redistribution layers...

Methods for forming vias in microelectronic devices, and methods fo...

Methods of packaging and testing microelectronic imaging devices

Microelectronic imagers with optical devices and methods of manufac...

Integrated optics units and methods of manufacturing integrated opt...

Wafer edge ring structures and methods of formation

Substrate supports for use with programmable material consolidation...

Methods for packaging a plurality of semiconductor dice using a flo...

Patents Applicationslast 30 patents

APPARATUS FOR NON-CHEMICAL, NON-OPTICAL EDGE BEAD REMOVAL

Non-Chemical, Non-Optical Edge Bead Removal Process

WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...

MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...

LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS...

LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS...

Substrate supports for use with programmable material consolidation...

Microelectronic imagers with optical devices and methods of manufac...

Methods for supporting substrates during fabrication of one or more...

Methods for removing and reclaiming unconsolidated material from su...

Semiconductor component having plate, stacked dice and conductive vias

Method for creating electrically conductive elements for semiconduc...

Systems and methods for retrieving residual liquid during immersion...

Method for fabricating semiconductor components with thinned substr...

Microelectronic imagers and methods of packaging microelectronic im...

Microelectronic devices, methods for forming vias in microelectroni...

Packaged microelectronic imaging devices and methods of packaging m...

Microelectronic imagers with optical devices and methods of manufac...

Methods for forming backside alignment markers useable in semicondu...

Microelectronic devices, methods for forming vias in microelectroni...

Methods for packaging microfeature devices and microfeature devices...

Microelectronic devices having conductive complementary structures...

Apparatus for spin coating semiconductor substrates

Semiconductor wafer assemblies

Microlenses including a plurality of mutually adhered layers of opt...

Methods of forming conductive elements using organometallic layers...

Methods of fabricating a microlens including selectively curing flo...

Semiconductor component having plate and stacked dice

Packaged microelectronic imaging devices and methods of packaging m...

Method for creating electrically conductive elements for semiconduc...