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Phillip C. Celaya
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor devices and methods of making the same
Patent number
11,557,530
Issue date
Jan 17, 2023
Semiconductor Components Industries, LLC
Swee Har Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
11,049,843
Issue date
Jun 29, 2021
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of making the same
Patent number
10,727,170
Issue date
Jul 28, 2020
Semiconductor Components Industries, LLC
Swee Har Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with leadframes and related methods
Patent number
10,304,798
Issue date
May 28, 2019
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and related methods
Patent number
9,899,349
Issue date
Feb 20, 2018
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Half-bridge HEMT circuit and an electronic package including the ci...
Patent number
9,773,895
Issue date
Sep 26, 2017
Semiconductor Components Industries, LLC
Balaji Padmanabhan
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
9,620,443
Issue date
Apr 11, 2017
Semiconductor Components Industries, LLC
Balaji Padmanabhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-flag stacked die package
Patent number
9,379,048
Issue date
Jun 28, 2016
Semiconductor Components Industries, LLC
Frank Tim Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor device and leadframe therefor
Patent number
8,581,416
Issue date
Nov 12, 2013
Semiconductor Components Industries, LLC
Harold L. Massie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
8,461,670
Issue date
Jun 11, 2013
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor component
Patent number
8,324,026
Issue date
Dec 4, 2012
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector
Patent number
8,253,239
Issue date
Aug 28, 2012
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor component and structure th...
Patent number
8,071,427
Issue date
Dec 6, 2011
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector and method
Patent number
7,875,964
Issue date
Jan 25, 2011
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method therefor
Patent number
7,825,505
Issue date
Nov 2, 2010
Semiconductor Components Industries, LLC
Phillip Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and method therefor
Patent number
7,638,863
Issue date
Dec 29, 2009
Semiconductor Components Industries, LLC
Phillip Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-chip semiconductor connector assemblies
Patent number
7,508,060
Issue date
Mar 24, 2009
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assembly method
Patent number
7,498,195
Issue date
Mar 3, 2009
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having multiple heat dissipation pa...
Patent number
7,495,323
Issue date
Feb 24, 2009
Semiconductor Components Industries, LLC
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assemblies
Patent number
7,298,034
Issue date
Nov 20, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assembly method
Patent number
7,202,105
Issue date
Apr 10, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector and method
Patent number
7,202,106
Issue date
Apr 10, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead-free integrated circuit package structure
Patent number
7,180,170
Issue date
Feb 20, 2007
Semiconductor Components Industries, LLC
Phillip C. Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device package
Patent number
D510728
Issue date
Oct 18, 2005
Semiconductor Components Industries LLC
Phillip Celaya
D13 - Equipment for production, distribution, or transformation of energy
Information
Patent Grant
Semiconductor device package
Patent number
D504874
Issue date
May 10, 2005
Semiconductor Components Industries, LLC
Phillip Celaya
D13 - Equipment for production, distribution, or transformation of energy
Information
Patent Grant
Method of making a lead-free integrated circuit package
Patent number
6,889,429
Issue date
May 10, 2005
Semiconductor Components Industries, LLC
Phillip C. Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic package including a polymer encapsulated die
Patent number
6,093,972
Issue date
Jul 25, 2000
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
Patent number
5,895,229
Issue date
Apr 20, 1999
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component assembly having an encapsulation material and...
Patent number
5,808,873
Issue date
Sep 15, 1998
Motorola, Inc.
Phillip C. Celaya
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
Publication number
20200312749
Publication date
Oct 1, 2020
Semiconductor Components Industries, LLC
Swee Har KHOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20190244928
Publication date
Aug 8, 2019
Semiconductor Components Industries, LLC
Phillip CELAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20180138144
Publication date
May 17, 2018
Semiconductor Components Industries, LLC
Phillip CELAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LONG-LASTING WETTABLE FLANKS
Publication number
20180090421
Publication date
Mar 29, 2018
Semiconductor Components Industries, LLC
Nam Khong THEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
Publication number
20170062310
Publication date
Mar 2, 2017
Semiconductor Components Industries, LLC
Swee Har KHOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20170025340
Publication date
Jan 26, 2017
Semiconductor Components Industries, LLC
Balaji Padmanabhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HALF-BRIDGE HEMT CIRCUIT AND AN ELECTRONIC PACKAGE INCLUDING THE CI...
Publication number
20160322969
Publication date
Nov 3, 2016
Semiconductor Components Industries, LLC
Balaji PADMANABHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20160190095
Publication date
Jun 30, 2016
Semiconductor Components Industries, LLC
Phillip CELAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
Publication number
20150035166
Publication date
Feb 5, 2015
Semiconductor Components Industries, LLC
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL-FLAG STACKED DIE PACKAGE
Publication number
20140239472
Publication date
Aug 28, 2014
Frank Tim Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
Publication number
20140151883
Publication date
Jun 5, 2014
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND LEADFRAME THEREFOR
Publication number
20130154073
Publication date
Jun 20, 2013
Harold L. Massie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20110298115
Publication date
Dec 8, 2011
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
Publication number
20110281397
Publication date
Nov 17, 2011
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR
Publication number
20110068451
Publication date
Mar 24, 2011
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
Publication number
20100187663
Publication date
Jul 29, 2010
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
Publication number
20100052145
Publication date
Mar 4, 2010
Phillip Celaya
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
Publication number
20080054424
Publication date
Mar 6, 2008
Semiconductor Components Industries, LLC.
Phillip Celaya
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING MULTIPLE HEAT DISSIPATION PA...
Publication number
20080054438
Publication date
Mar 6, 2008
Semiconductor Components Industries, LLC.
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES
Publication number
20080006920
Publication date
Jan 10, 2008
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD
Publication number
20070126106
Publication date
Jun 7, 2007
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD
Publication number
20070126107
Publication date
Jun 7, 2007
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assemblies
Publication number
20050285249
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assembly method
Publication number
20050287703
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector and method
Publication number
20050285235
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package and method
Publication number
20050121767
Publication date
Jun 9, 2005
Phillip C. Celaya
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Integrated circuit package and method
Publication number
20020134582
Publication date
Sep 26, 2002
Semiconductor Components Industries, LLC.
Phillip C. Celaya
H01 - BASIC ELECTRIC ELEMENTS