Po-Hsu LIN

Person

Changhua County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,825,794
- Issue date Nov 3, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure having elastic bump
- Patent number 10,580,665
- Issue date Mar 3, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,566,294
- Issue date Feb 18, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor package
- Patent number 10,535,621
- Issue date Jan 14, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and multi-chip package using thereof and method...
- Patent number 10,438,887
- Issue date Oct 8, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure
- Patent number 10,431,559
- Issue date Oct 1, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for estimating state-of-health of battery
- Patent number 10,422,836
- Issue date Sep 24, 2019
- Automotive Research and Testing Center
- Chung-Che Huang
- G01 - MEASURING TESTING
Information Patent Grant
Power distribution system using multiple rechargeable power sources...
- Patent number 10,389,167
- Issue date Aug 20, 2019
- Automotive Research & Testing Center
- Po-Hsu Lin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Stacked semiconductor structure
- Patent number 10,373,932
- Issue date Aug 6, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure and manufacturing method thereof
- Patent number 10,361,171
- Issue date Jul 23, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,256,179
- Issue date Apr 9, 2019
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and multi-chip package using thereof
- Patent number 10,229,877
- Issue date Mar 12, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,192,853
- Issue date Jan 29, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for preparing the same
- Patent number 10,192,841
- Issue date Jan 29, 2019
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,170,340
- Issue date Jan 1, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,170,432
- Issue date Jan 1, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a manufacturing method thereof
- Patent number 10,170,339
- Issue date Jan 1, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure
- Patent number 10,141,275
- Issue date Nov 27, 2018
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay valve module of a pneumatic brake system
- Patent number 10,131,337
- Issue date Nov 20, 2018
- Automotive Research and Testing Center
- Ping-Yan Li
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,103,114
- Issue date Oct 16, 2018
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structure
- Patent number 10,076,034
- Issue date Sep 11, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming the same
- Patent number 10,068,822
- Issue date Sep 4, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die device, semiconductor device and method for making the same
- Patent number 10,050,021
- Issue date Aug 14, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package
- Patent number 10,037,937
- Issue date Jul 31, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with through substrate via and manufacturin...
- Patent number 9,991,215
- Issue date Jun 5, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACUPUNCTURE POINT SIMULATION DEVICE AND METHOD OF USING THE SAME IN...
- Publication number 20240428707
- Publication date Dec 26, 2024
- Changhua Christian Medical Foundation Changhua Christian Hospital
- Sung Yen HUANG
- G01 - MEASURING TESTING
Information Patent Application
HYDROGEN TEMPERATURE CONTROLLING SYSTEM, REFRIGERATED CONTAINING DE...
- Publication number 20240359904
- Publication date Oct 31, 2024
- Automotive Research & Testing Center
- Po-Hsu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION SYSTEM USING MULTIPLE RECHARGEABLE POWER SOURCES...
- Publication number 20190199121
- Publication date Jun 27, 2019
- Automotive Research & Testing Center
- Po-Hsu Lin
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190122996
- Publication date Apr 25, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME
- Publication number 20190109113
- Publication date Apr 11, 2019
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
- Publication number 20190096837
- Publication date Mar 28, 2019
- NANYA TECHNOLOGY CORPORATION
- PO CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190096850
- Publication date Mar 28, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190096797
- Publication date Mar 28, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE
- Publication number 20190081018
- Publication date Mar 14, 2019
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR APPARATUS
- Publication number 20180374818
- Publication date Dec 27, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING BUMP ON TILTING UPPER CORNER SURFACE
- Publication number 20180337116
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING BUMP WITH PROTECTIVE ANTI-OXIDATION COATING
- Publication number 20180315725
- Publication date Nov 1, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20180308803
- Publication date Oct 25, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180308823
- Publication date Oct 25, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE
- Publication number 20180247919
- Publication date Aug 30, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20180233486
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME
- Publication number 20180233479
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME
- Publication number 20180233480
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180233485
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180233484
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226372
- Publication date Aug 9, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226332
- Publication date Aug 9, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR APPARATUS
- Publication number 20180226380
- Publication date Aug 9, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE
- Publication number 20180204814
- Publication date Jul 19, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ESTIMATING STATE-OF-HEALTH OF BATTERY
- Publication number 20180188329
- Publication date Jul 5, 2018
- AUTOMOTIVE RESEARCH & TESTING CENTER
- Chung-Che HUANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PREPARING THE SAME
- Publication number 20180190607
- Publication date Jul 5, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELAY VALVE MODULE OF A PNEUMATIC BRAKE SYSTEM
- Publication number 20180186356
- Publication date Jul 5, 2018
- AUTOMOTIVE RESEARCH & TESTING CENTER
- Ping-Yan LI
- B60 - VEHICLES IN GENERAL
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFAC...
- Publication number 20180175004
- Publication date Jun 21, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor apparatus and method for preparing the same

Method for preparing a semiconductor apparatus

Semiconductor method for forming semiconductor structure having bum...

Method for manufacturing package structure having elastic bump

Semiconductor structure

Method for preparing a semiconductor package

Combing bump structure and manufacturing method thereof

Semiconductor chip and multi-chip package using thereof and method...

Method for manufacturing a semiconductor structure

Device and method for estimating state-of-health of battery

Power distribution system using multiple rechargeable power sources...

Stacked semiconductor structure

Stacked package structure and manufacturing method thereof

Semiconductor structure having bump on tilting upper corner surface

Package structure and manufacturing method thereof

Semiconductor chip and multi-chip package using thereof

Method for preparing a semiconductor apparatus

Semiconductor package and method for preparing the same

Semiconductor structure

Semiconductor structure

Semiconductor structure and a manufacturing method thereof

Method for manufacturing a semiconductor structure

Relay valve module of a pneumatic brake system

Semiconductor structure and manufacturing method thereof

Electronic structure

Combing bump structure and manufacturing method thereof

Semiconductor package and method for forming the same

Die device, semiconductor device and method for making the same

Method for forming semiconductor package

Semiconductor structure with through substrate via and manufacturin...

Patents Applicationslast 30 patents

ACUPUNCTURE POINT SIMULATION DEVICE AND METHOD OF USING THE SAME IN...

HYDROGEN TEMPERATURE CONTROLLING SYSTEM, REFRIGERATED CONTAINING DE...

POWER DISTRIBUTION SYSTEM USING MULTIPLE RECHARGEABLE POWER SOURCES...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME

METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

METHOD FOR PREPARING A SEMICONDUCTOR APPARATUS

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE HAVING BUMP ON TILTING UPPER CORNER SURFACE

PACKAGE STRUCTURE HAVING BUMP WITH PROTECTIVE ANTI-OXIDATION COATING

SEMICONDUCTOR STRUCTURE

STACKED SEMICONDUCTOR STRUCTURE

METHOD FOR MANUFACTURING THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE

DIE DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PREPARING A SEMICONDUCTOR APPARATUS

METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE

DEVICE AND METHOD FOR ESTIMATING STATE-OF-HEALTH OF BATTERY

SEMICONDUCTOR PACKAGE AND METHOD FOR PREPARING THE SAME

RELAY VALVE MODULE OF A PNEUMATIC BRAKE SYSTEM

THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFAC...