Pu-Ju Lin

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package structure and manufacturing method the...
- Patent number 11,955,587
- Issue date Apr 9, 2024
- Unimicron Technology Corp.
- Jeng-Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sounding-interval adaptation using link quality
- Patent number 11,817,974
- Issue date Nov 14, 2023
- Mediatek Inc.
- Hao-Chih Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,764,344
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 11,764,120
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of carrier structure
- Patent number 11,690,180
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of chip package structure
- Patent number 11,637,047
- Issue date Apr 25, 2023
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with interposer substrate surrounded by underfill and...
- Patent number 11,488,900
- Issue date Nov 1, 2022
- Unimicron Technology Corp.
- Yan-Jia Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,476,234
- Issue date Oct 18, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,462,452
- Issue date Oct 4, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber device and manufacturing method thereof
- Patent number 11,460,255
- Issue date Oct 4, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sounding-interval adaptation using link quality
- Patent number 11,463,282
- Issue date Oct 4, 2022
- Mediatek Inc.
- Hao-Chih Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device bonding structure and fabrication method thereof
- Patent number 11,424,216
- Issue date Aug 23, 2022
- Unimicron Technology Corp.
- Chia-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,410,971
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,933
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 11,410,940
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communications method for transmitting pre-coded stream ou...
- Patent number 11,265,049
- Issue date Mar 1, 2022
- Mediatek Inc.
- Hsuan-Yu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 11,166,387
- Issue date Nov 2, 2021
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 10,957,658
- Issue date Mar 23, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,950,535
- Issue date Mar 16, 2021
- Unimicron Technology Corp.
- Chun-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240167163
- Publication date May 23, 2024
- Unimicron Technology Corp.
- YI LING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402391
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- Ying-Chu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING DEVICE AND ETCHING METHOD
- Publication number 20230335419
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PERFORMING BEAMFORMING SOUNDING FEEDBACK IN SYSTEM-PARAM...
- Publication number 20230336230
- Publication date Oct 19, 2023
- MEDIATEK INC.
- Chun-Ting Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240023
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230231087
- Publication date Jul 20, 2023
- Unimicron Technology Corp.
- Hao-Wei TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CARRIER HAVING PROTECTION STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20230215772
- Publication date Jul 6, 2023
- Unimicron Technology Corp.
- WEN YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163074
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230164928
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20230067112
- Publication date Mar 2, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOUNDING-INTERVAL ADAPTATION USING LINK QUALITY
- Publication number 20220400033
- Publication date Dec 15, 2022
- MEDIATEK INC.
- Hao-Chih YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20220367307
- Publication date Nov 17, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336333
- Publication date Oct 20, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220328387
- Publication date Oct 13, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH EMBEDDED INTERPOSER SUBSTRATE AND METHOD OF FABRI...
- Publication number 20220285255
- Publication date Sep 8, 2022
- Unimicron Technology Corp.
- Yan-Jia Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20220271208
- Publication date Aug 25, 2022
- Unimicron Technology Corp.
- Jeng-Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220256717
- Publication date Aug 11, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220246810
- Publication date Aug 4, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220208630
- Publication date Jun 30, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Flexible circuit board and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method of the same

Circuit board structure and manufacturing method thereof

Light emitting diode package structure and manufacturing method the...

Circuit board structure and manufacturing method thereof

Sounding-interval adaptation using link quality

Package structure and manufacturing method thereof

Chip packaging structure and manufacturing method thereof

Package structure and manufacturing method thereof

Manufacturing method of carrier structure

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Manufacturing method of chip package structure

Circuit board structure and manufacturing method thereof

Wiring board with interposer substrate surrounded by underfill and...

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Vapor chamber device and manufacturing method thereof

Sounding-interval adaptation using link quality

Electronic device bonding structure and fabrication method thereof

Chip package structure

Package structure and manufacturing method thereof

Package structure with structure reinforcing element and manufactur...

Mask structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Wireless communications method for transmitting pre-coded stream ou...

Wiring board and manufacturing method thereof

Package structure with structure reinforcing element and manufactur...

Package structure and method of manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

PACKAGE STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ETCHING DEVICE AND ETCHING METHOD

METHOD FOR PERFORMING BEAMFORMING SOUNDING FEEDBACK IN SYSTEM-PARAM...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

GLASS CARRIER HAVING PROTECTION STRUCTURE AND MANUFACTURING METHOD...

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER STRUCTURE

SOUNDING-INTERVAL ADAPTATION USING LINK QUALITY

MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

WIRING BOARD WITH EMBEDDED INTERPOSER SUBSTRATE AND METHOD OF FABRI...

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF