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Quang X. Mai
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Sugar Land, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE48420
Issue date
Feb 2, 2021
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE46618
Issue date
Nov 28, 2017
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE46466
Issue date
Jul 4, 2017
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Integrated high voltage capacitor having a top-level dielectric lay...
Patent number
7,413,947
Issue date
Aug 19, 2008
Texas Instruments Incorporated
David L. Larkin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
7,335,536
Issue date
Feb 26, 2008
Texas Instruments Incorporated
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with bonding layer over active circuitry
Patent number
6,683,380
Issue date
Jan 27, 2004
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with bonding layer over active circuitry
Patent number
6,144,100
Issue date
Nov 7, 2000
Texas Instruments Incorporated
Chi-Cheong Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic encapsulation for integrated circuits having plated copper...
Patent number
6,140,702
Issue date
Oct 31, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic encapsulation for integrated circuits having plated copper...
Patent number
6,140,150
Issue date
Oct 31, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming improved thick plated copper interconnect and ass...
Patent number
6,025,275
Issue date
Feb 15, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thick plated interconnect and associated auxillary interconnect
Patent number
6,020,640
Issue date
Feb 1, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for fabricating low resistance, low inductance interconnecti...
Publication number
20070048996
Publication date
Mar 1, 2007
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated high voltage capacitor having a top-level dielectric lay...
Publication number
20060189068
Publication date
Aug 24, 2006
Texas Instruments Inc.
David L. Larkin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-level assembly method for chip-size devices having flipped chips
Publication number
20050151268
Publication date
Jul 14, 2005
William D. Boyd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit with bonding layer over active circuitry
Publication number
20030036256
Publication date
Feb 20, 2003
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS