Rachel L. Abinan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Chip scale module package in BGA semiconductor package
- Patent number 9,281,300
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with bonding in via
- Patent number 9,000,579
- Issue date Apr 7, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnects and method o...
- Patent number 8,802,555
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with heatspreader
- Patent number 8,395,254
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming quad flat package
- Patent number 8,097,496
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 8,097,935
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits package system with passive components
- Patent number 8,026,129
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,911,046
- Issue date Mar 22, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 7,687,892
- Issue date Mar 30, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,518,226
- Issue date Apr 14, 2009
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241931
- Publication date Sep 27, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Module Package in BGA Semiconductor Package
- Publication number 20110001240
- Publication date Jan 6, 2011
- STATS ChipPAC, Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Flat Package
- Publication number 20100140761
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Quad Flat Package
- Publication number 20100144100
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20090152704
- Publication date Jun 18, 2009
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA
- Publication number 20080237873
- Publication date Oct 2, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20080185719
- Publication date Aug 7, 2008
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE
- Publication number 20080042265
- Publication date Feb 21, 2008
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT PACKAGE
- Publication number 20080036051
- Publication date Feb 14, 2008
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER
- Publication number 20070235859
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
- Publication number 20070210432
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210436
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS

Rachel L. Abinan

Person

Patents Grantslast 30 patents

Chip scale module package in BGA semiconductor package

Integrated circuit package system with bonding in via

Integrated circuit packaging system with interconnects and method o...

Integrated circuit package system with heatspreader

Integrated circuit package system having interconnect stack and ext...

Method of forming quad flat package

Quad flat package

Stacked integrated circuits package system with passive components

Integrated circuit packaging system with interposer

Quad flat package

Integrated circuit packaging system with interposer

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

Chip Scale Module Package in BGA Semiconductor Package

Quad Flat Package

Method of Forming Quad Flat Package

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

QUAD FLAT PACKAGE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS

INTEGRATED CIRCUIT PACKAGE SYSTEM