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Raj N. Master
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Graphic formation via material ablation
Patent number
9,661,770
Issue date
May 23, 2017
Microsoft Technology Licensing, LLC
Mark Thomas McCormack
B44 - DECORATIVE ARTS
Information
Patent Grant
Electronic device with plated electrical contact
Patent number
9,563,233
Issue date
Feb 7, 2017
Microsoft Technology Licensing, LLC
Mark Thomas McCormack
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Metal alloy injection molding
Patent number
9,205,486
Issue date
Dec 8, 2015
Microsoft Technology Licensing, LLC
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Metal alloy injection molding overflows
Patent number
9,027,631
Issue date
May 12, 2015
Microsoft Technology Licensing, LLC
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Metal alloy injection molding protrusions
Patent number
8,991,473
Issue date
Mar 31, 2015
Microsoft Technology Holding, LLC
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Metal alloy injection molding protrusions
Patent number
8,733,423
Issue date
May 27, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Integrated circuit socket
Patent number
8,297,986
Issue date
Oct 30, 2012
GLOBALFOUNDRIES Inc.
Seah Sun Too
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Void reduction in indium thermal interface material
Patent number
7,999,394
Issue date
Aug 16, 2011
Advanced Micro Devices, Inc.
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with solder joint protection ring
Patent number
7,923,850
Issue date
Apr 12, 2011
Advanced Micro Devices, Inc.
Mohammad Khan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for decreasing surface delamination of gel-type thermal inte...
Patent number
7,833,839
Issue date
Nov 16, 2010
GLOBALFOUNDRIES Inc.
Maxat Touzelbaev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with gel-type thermal interface material
Patent number
7,678,615
Issue date
Mar 16, 2010
Advanced Micro Devices, Inc.
Maxat Touzelbaev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Void reduction in indium thermal interface material
Patent number
7,651,938
Issue date
Jan 26, 2010
Advanced Micro Devices, Inc.
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming solder joints for a flip chip assembly
Patent number
7,601,612
Issue date
Oct 13, 2009
GLOBALFOUNDRIES Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reduction of damage to thermal interface material due to asymmetric...
Patent number
7,544,542
Issue date
Jun 9, 2009
Advanced Micro Devices, Inc.
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead-free semiconductor package
Patent number
7,215,030
Issue date
May 8, 2007
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Organic packages having low tin solder connections
Patent number
6,812,570
Issue date
Nov 2, 2004
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Controlled and programmed deposition of flux on a flip-chip die by...
Patent number
6,722,553
Issue date
Apr 20, 2004
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for jet printing a flux pattern selectively on...
Patent number
6,709,963
Issue date
Mar 23, 2004
Advanced Micro Devices, Inc.
Jonathan D. Halderman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metallurgical inspection and/or analysis of flip-chip pads and inte...
Patent number
6,657,707
Issue date
Dec 2, 2003
Advanced Micro Devices, Inc.
David Bruce Morken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating reliable laminate flip-chip assembly
Patent number
6,632,690
Issue date
Oct 14, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of reflowing organic packages using no-clean flux
Patent number
6,617,195
Issue date
Sep 9, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Boat for cleaning ball grid array packages
Patent number
6,591,992
Issue date
Jul 15, 2003
Advanced Micro Devices, Inc.
Ajit M. Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of preventing residue contamination of semiconductor devices...
Patent number
6,536,649
Issue date
Mar 25, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Boat for organic and ceramic flip chip package assembly
Patent number
6,488,158
Issue date
Dec 3, 2002
Advanced Micro Devices, Inc.
Mohammad Khan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Boat for cleaning ball grid array packages
Patent number
6,446,818
Issue date
Sep 10, 2002
Advanced Micro Devices, Inc.
Ajit M. Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Minimizing flux residue by controlling amount of moisture during re...
Patent number
6,409,070
Issue date
Jun 25, 2002
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder reflow furnace with flux effluent collector and method of pr...
Patent number
6,382,500
Issue date
May 7, 2002
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method to reduce occurrences of fillet cracking in flip-chip underfill
Patent number
6,372,544
Issue date
Apr 16, 2002
Advanced Micro Devices, Inc.
Jonathan D. Halderman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Boat for land grid array packages
Patent number
6,371,310
Issue date
Apr 16, 2002
Advanced Micro Devices, Inc.
Raj N. Master
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Detection of flux residue
Patent number
6,367,679
Issue date
Apr 9, 2002
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Graphic Formation via Material Ablation
Publication number
20160143170
Publication date
May 19, 2016
Microsoft Technology Licensing, LLC
Mark Thomas McCormack
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
ELECTRONIC DEVICE WITH PLATED ELECTRICAL CONTACT
Publication number
20160048159
Publication date
Feb 18, 2016
Microsoft Corporation
Mark Thomas McCormack
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Metal Alloy Injection Molding
Publication number
20150202682
Publication date
Jul 23, 2015
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Graphic Formation via Material Ablation
Publication number
20140248506
Publication date
Sep 4, 2014
Microsoft Corporation
Mark Thomas McCormack
B44 - DECORATIVE ARTS
Information
Patent Application
Metal Alloy Injection Molding Overflows
Publication number
20140166227
Publication date
Jun 19, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Metal Alloy Injection Molding
Publication number
20140158317
Publication date
Jun 12, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Metal Alloy Injection Molding Protrusions
Publication number
20140154523
Publication date
Jun 5, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Metal Alloy Injection Techniques
Publication number
20140150982
Publication date
Jun 5, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Metal Alloy Injection Molding Protrusions
Publication number
20140131000
Publication date
May 15, 2014
Microsoft Corporation
Paul C. Bornemann
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Void Reduction in Indium Thermal Interface Material
Publication number
20100117222
Publication date
May 13, 2010
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip with Solder Joint Protection Ring
Publication number
20100052188
Publication date
Mar 4, 2010
Mohammad Khan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Gel-Type Thermal Interface Material
Publication number
20090057877
Publication date
Mar 5, 2009
Maxat Touzelbaev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Socket
Publication number
20080227310
Publication date
Sep 18, 2008
Seah Sun Too
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Reduction of Damage to Thermal Interface Material Due to Asymmetric...
Publication number
20080124841
Publication date
May 29, 2008
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Void Reduction in Indium Thermal Interface Material
Publication number
20070284737
Publication date
Dec 13, 2007
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lead-free semiconductor package
Publication number
20060289977
Publication date
Dec 28, 2006
Advanced Micro Devices, Inc.
Raj N. Master
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of fabricating reliable laminate flip-chip assembly
Publication number
20030077852
Publication date
Apr 24, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Universal ball attach manufacturing process
Publication number
20030052155
Publication date
Mar 20, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Boat for ball attach manufacturing process
Publication number
20030047527
Publication date
Mar 13, 2003
Advanced Micro Devices, Inc.
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Organic packages having low tin solder connections
Publication number
20030037959
Publication date
Feb 27, 2003
Raj N. Master
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS
Publication number
20020170746
Publication date
Nov 21, 2002
RAJ N MASTER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Controlled and programmed deposition of flux on a flip-chip die by...
Publication number
20020031861
Publication date
Mar 14, 2002
Raj N. Master
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR