Raymond R. Horton

Person

Plains, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming thin die stack assemblies
- Patent number 11,587,860
- Issue date Feb 21, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned die stack
- Patent number 10,903,153
- Issue date Jan 26, 2021
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for mapping formic acid distribution
- Patent number 8,342,385
- Issue date Jan 1, 2013
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser release process for very thin Si-carrier build
- Patent number 8,187,923
- Issue date May 29, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Techniques for providing decoupling capacitance
- Patent number 7,791,168
- Issue date Sep 7, 2010
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for providing decoupling capacitance
- Patent number 7,741,231
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for providing decoupling capacitance
- Patent number 7,691,669
- Issue date Apr 6, 2010
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for precision assembly of integrated circuit chip packages
- Patent number 7,615,405
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for providing decoupling capacitance
- Patent number 7,488,624
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling vias
- Patent number 7,449,067
- Issue date Nov 11, 2008
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for providing decoupling capacitance
- Patent number 7,435,627
- Issue date Oct 14, 2008
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for precision assembly of integrated circuit chip packages
- Patent number 7,282,391
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and method to seal vias in silicon substrates
- Patent number 7,199,450
- Issue date Apr 3, 2007
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight electronic equipment conductor with coolant permeable s...
- Patent number 6,734,363
- Issue date May 11, 2004
- International Business Machines Corporation
- Raymond Robert Horton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TFT LCD active data line repair
- Patent number 6,697,037
- Issue date Feb 24, 2004
- International Business Machines Corporation
- Paul Matthew Alt
- G11 - INFORMATION STORAGE
Information Patent Grant
Common ball-limiting metallurgy for I/O sites
- Patent number 6,534,863
- Issue date Mar 18, 2003
- International Business Machines Corporation
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interconnected chips
- Patent number 6,326,696
- Issue date Dec 4, 2001
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an electronic package with interconnected chips
- Patent number 6,306,686
- Issue date Oct 23, 2001
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical alignment of superpositioned objects
- Patent number 6,295,128
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Raymond Robert Horton
- G02 - OPTICS
Information Patent Grant
Micro-scale part positioning by surface interlocking
- Patent number 6,029,881
- Issue date Feb 29, 2000
- International Business Machines Corporation
- Pedro A. Chalco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion bonding of lead interconnections using precise laser-ther...
- Patent number 5,948,286
- Issue date Sep 7, 1999
- International Business Machines Corporation
- Pedro A. Chalco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,915,462
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight packaging
- Patent number 5,847,926
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,768,770
- Issue date Jun 23, 1998
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,734,196
- Issue date Mar 31, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bonding
- Patent number 5,687,078
- Issue date Nov 11, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for multilayer conductor chip packaging
- Patent number 5,675,884
- Issue date Oct 14, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated nozzle and method of use thereof
- Patent number 5,676,301
- Issue date Oct 14, 1997
- International Business Machines Corporation
- Bernie Hernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,669,437
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THINNED DIE STACK
- Publication number 20200211947
- Publication date Jul 2, 2020
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED DIE STACK
- Publication number 20200161230
- Publication date May 21, 2020
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAPPING FORMIC ACID DISTRIBUTION
- Publication number 20120261458
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20120091585
- Publication date Apr 19, 2012
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20090032920
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE
- Publication number 20080182361
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE
- Publication number 20080182359
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES
- Publication number 20080182362
- Publication date Jul 31, 2008
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE
- Publication number 20080176411
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE
- Publication number 20080067628
- Publication date Mar 20, 2008
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser release process for very thin Si-carrier build
- Publication number 20080036084
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES
- Publication number 20070222065
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for providing decoupling capacitance
- Publication number 20070035030
- Publication date Feb 15, 2007
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES
- Publication number 20060255480
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20050121768
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for filling vias
- Publication number 20050106834
- Publication date May 19, 2005
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common ball-limiting metallurgy for I/O sites
- Publication number 20030092254
- Publication date May 15, 2003
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common ball-limiting metallurgy for I/O sites
- Publication number 20020111010
- Publication date Aug 15, 2002
- International Business Machines Corporation
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS

Raymond R. Horton

Person

Patents Grantslast 30 patents

Method of forming thin die stack assemblies

Thinned die stack

Process for mapping formic acid distribution

Laser release process for very thin Si-carrier build

Techniques for providing decoupling capacitance

Techniques for providing decoupling capacitance

Techniques for providing decoupling capacitance

Method for precision assembly of integrated circuit chip packages

Techniques for providing decoupling capacitance

Method and apparatus for filling vias

Techniques for providing decoupling capacitance

Method for precision assembly of integrated circuit chip packages

Silicon chip carrier with conductive through-vias and method for fa...

Materials and method to seal vias in silicon substrates

Lightweight electronic equipment conductor with coolant permeable s...

TFT LCD active data line repair

Common ball-limiting metallurgy for I/O sites

Electronic package with interconnected chips

Method of fabricating an electronic package with interconnected chips

Optical alignment of superpositioned objects

Micro-scale part positioning by surface interlocking

Diffusion bonding of lead interconnections using precise laser-ther...

High efficiency thermal interposer

Lightweight packaging

Electronic packaging shaped beam lead fabrication

Electronic packaging shaped beam lead fabrication

Fine pitch bonding

Apparatus for multilayer conductor chip packaging

Castellated nozzle and method of use thereof

High efficiency thermal interposer

Patents Applicationslast 30 patents

THINNED DIE STACK

THINNED DIE STACK

PROCESS FOR MAPPING FORMIC ACID DISTRIBUTION

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE

TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE

METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES

TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE

TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE

Laser release process for very thin Si-carrier build

METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES

Techniques for providing decoupling capacitance

MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES

Silicon chip carrier with conductive through-vias and method for fa...

Silicon chip carrier with conductive through-vias and method for fa...

Method and apparatus for filling vias

Common ball-limiting metallurgy for I/O sites

Common ball-limiting metallurgy for I/O sites