Ricardo A. Donaton

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave-to-optical quantum transducers
- Patent number 11,657,314
- Issue date May 23, 2023
- International Business Machines Corporation
- Chi Xiong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 10,707,217
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Ricardo A. Donaton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 10,037,998
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Ricardo A. Donaton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 9,679,917
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Ricardo A. Donaton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DT capacitor with silicide outer electrode and/or compressive stres...
- Patent number 9,653,535
- Issue date May 16, 2017
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DT capacitor with silicide outer electrode and/or compressive stres...
- Patent number 9,496,329
- Issue date Nov 15, 2016
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DT capacitor with silicide outer electrode and/or compressive stres...
- Patent number 9,299,766
- Issue date Mar 29, 2016
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
- Patent number 8,349,729
- Issue date Jan 8, 2013
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing threshold voltage adjusting layer with external...
- Patent number 8,227,307
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Kuang-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for gate height scaling with high-k/metal gate...
- Patent number 8,227,870
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
- Patent number 8,159,060
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for gate height scaling with high-k/metal gate...
- Patent number 8,138,037
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics structures using a sacrificial multi-layer hardmask scheme
- Patent number 7,947,907
- Issue date May 24, 2011
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS structure including differential channel stressing layer compo...
- Patent number 7,875,511
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Liu Yaocheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact between high-κ/metal gate and wiring process flow
- Patent number 7,863,123
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Huiming Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance stress-enhance MOSFET and method of manufacture
- Patent number 7,791,144
- Issue date Sep 7, 2010
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for low parasitic gate capacitance
- Patent number 7,709,910
- Issue date May 4, 2010
- International Business Machines Corporation
- William K. Henson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures incorporating voids and methods of...
- Patent number 7,691,712
- Issue date Apr 6, 2010
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance stress-enhance MOSFET and method of manufacture
- Patent number 7,615,418
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance stress-enhance MOSFET and method of manufacture
- Patent number 7,608,489
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon/silcion germaninum/silicon body device with embedded carbon...
- Patent number 7,560,326
- Issue date Jul 14, 2009
- International Business Machines Corporation
- Anda C. Mocuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen based plasma process for metal gate MOS device
- Patent number 7,498,271
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Ricardo A. Donaton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing electronics structures using a sacrificial mu...
- Patent number 7,371,684
- Issue date May 13, 2008
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic etching of organic-containing insulating layers
- Patent number 6,844,266
- Issue date Jan 18, 2005
- Interuniversitair Microelektronica Centrum
- Karen Maex
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROWAVE-TO-OPTICAL QUANTUM TRANSDUCERS
- Publication number 20230145368
- Publication date May 11, 2023
- International Business Machines Corporation
- Chi Xiong
- G02 - OPTICS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...
- Publication number 20180337185
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Ricardo A. DONATON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...
- Publication number 20170213835
- Publication date Jul 27, 2017
- International Business Machines Corporation
- Ricardo A. DONATON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...
- Publication number 20160181249
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Guillaume D. BRIEND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...
- Publication number 20160181253
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Ricardo A. DONATON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...
- Publication number 20150357403
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...
- Publication number 20150357402
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...
- Publication number 20150279925
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
- Publication number 20120171818
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR GATE HEIGHT SCALING WITH HIGH-K/METAL GATE...
- Publication number 20120126335
- Publication date May 24, 2012
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
- Publication number 20110101537
- Publication date May 5, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING THRESHOLD VOLTAGE ADJUSTING LAYER WITH EXTERNAL...
- Publication number 20100330810
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Kuang-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR GATE HEIGHT SCALING WITH HIGH-K/METAL GATE...
- Publication number 20100237435
- Publication date Sep 23, 2010
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT CONTACT BETWEEN HIGH-K/METAL GATE AND WIRING PROCESS FLOW
- Publication number 20100181630
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Huiming Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE
- Publication number 20100013024
- Publication date Jan 21, 2010
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR LOW PARASITIC GATE CAPACITANCE
- Publication number 20080258234
- Publication date Oct 23, 2008
- International Business Machines Corporation
- William K. Henson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme
- Publication number 20080251284
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS STRUCTURE INCLUDING DIFFERENTIAL CHANNEL STRESSING LAYER COMPO...
- Publication number 20080224218
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Yaocheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Structure Incorporating Semiconductor Device Structures with...
- Publication number 20080040697
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structures Incorporating Voids and Methods of...
- Publication number 20070296039
- Publication date Dec 27, 2007
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON/SILCION GERMANINUM/SILICON BODY DEVICE WITH EMBEDDED CARBON...
- Publication number 20070257249
- Publication date Nov 8, 2007
- International Business Machines Corporation
- Anda C. Mocuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE
- Publication number 20070254423
- Publication date Nov 1, 2007
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE
- Publication number 20070254422
- Publication date Nov 1, 2007
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damascene interconnection having a SiCOH low k layer
- Publication number 20070232048
- Publication date Oct 4, 2007
- Koji Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for preparing electronics structures using a sacrificial mu...
- Publication number 20060258159
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic etching of organic-containing insulating layers
- Publication number 20030162407
- Publication date Aug 28, 2003
- Karen Maex
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Anisotropic etching of organic-containing insulating layers
- Publication number 20020076935
- Publication date Jun 20, 2002
- Karen Maex
- H01 - BASIC ELECTRIC ELEMENTS

Ricardo A. Donaton

Person

Patents Grantslast 30 patents

Microwave-to-optical quantum transducers

Semiconductor structures with deep trench capacitor and methods of...

Semiconductor structures with deep trench capacitor and methods of...

Semiconductor structures with deep trench capacitor and methods of...

DT capacitor with silicide outer electrode and/or compressive stres...

DT capacitor with silicide outer electrode and/or compressive stres...

DT capacitor with silicide outer electrode and/or compressive stres...

Hybrid bonding interface for 3-dimensional chip integration

Method for removing threshold voltage adjusting layer with external...

Method and structure for gate height scaling with high-k/metal gate...

Hybrid bonding interface for 3-dimensional chip integration

Method and structure for gate height scaling with high-k/metal gate...

Electronics structures using a sacrificial multi-layer hardmask scheme

CMOS structure including differential channel stressing layer compo...

Direct contact between high-κ/metal gate and wiring process flow

High performance stress-enhance MOSFET and method of manufacture

Semiconductor structure for low parasitic gate capacitance

Semiconductor device structures incorporating voids and methods of...

High performance stress-enhance MOSFET and method of manufacture

High performance stress-enhance MOSFET and method of manufacture

Silicon/silcion germaninum/silicon body device with embedded carbon...

Nitrogen based plasma process for metal gate MOS device

Process for preparing electronics structures using a sacrificial mu...

Anisotropic etching of organic-containing insulating layers

Patents Applicationslast 30 patents

MICROWAVE-TO-OPTICAL QUANTUM TRANSDUCERS

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...

SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...

SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...

SEMICONDUCTOR STRUCTURES WITH DEEP TRENCH CAPACITOR AND METHODS OF...

DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...

DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...

DT CAPACITOR WITH SILICIDE OUTER ELECTRODE AND/OR COMPRESSIVE STRES...

HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

METHOD AND STRUCTURE FOR GATE HEIGHT SCALING WITH HIGH-K/METAL GATE...

HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

METHOD FOR REMOVING THRESHOLD VOLTAGE ADJUSTING LAYER WITH EXTERNAL...

METHOD AND STRUCTURE FOR GATE HEIGHT SCALING WITH HIGH-K/METAL GATE...

DIRECT CONTACT BETWEEN HIGH-K/METAL GATE AND WIRING PROCESS FLOW

HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE FOR LOW PARASITIC GATE CAPACITANCE

Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme

CMOS STRUCTURE INCLUDING DIFFERENTIAL CHANNEL STRESSING LAYER COMPO...

Design Structure Incorporating Semiconductor Device Structures with...

Semiconductor Device Structures Incorporating Voids and Methods of...

SILICON/SILCION GERMANINUM/SILICON BODY DEVICE WITH EMBEDDED CARBON...

HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE

HIGH PERFORMANCE STRESS-ENHANCE MOSFET AND METHOD OF MANUFACTURE

Damascene interconnection having a SiCOH low k layer

Process for preparing electronics structures using a sacrificial mu...

Anisotropic etching of organic-containing insulating layers

Anisotropic etching of organic-containing insulating layers