Rich Fogal

Person

McCall, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 11,398,465
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 10,381,336
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling of interconnect packaging systems and methods
- Patent number 9,595,513
- Issue date Mar 14, 2017
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
- Patent number 8,987,885
- Issue date Mar 24, 2015
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
- Patent number 8,354,301
- Issue date Jan 15, 2013
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonders and methods of wire-bonding
- Patent number 7,977,597
- Issue date Jul 12, 2011
- Micron Technology, Inc.
- Stuart L. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
- Patent number 7,868,440
- Issue date Jan 11, 2011
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonders and methods of wire-bonding
- Patent number 7,227,095
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Stuart L. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for circuit completion through the use of ball...
- Patent number 6,991,970
- Issue date Jan 31, 2006
- Micron Technology, Inc.
- Rich Fogal
- G11 - INFORMATION STORAGE
Information Patent Grant
Device and method for clamping and wire-bonding the leads of a lead...
- Patent number 6,886,734
- Issue date May 3, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angularly offset stacked die multichip device and method of manufac...
- Patent number 6,884,657
- Issue date Apr 26, 2005
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondhead lead clamp apparatus
- Patent number 6,845,898
- Issue date Jan 25, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,837,418
- Issue date Jan 4, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated method of attaching flip-chip devices to a substrate
- Patent number 6,793,749
- Issue date Sep 21, 2004
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for clamping and wire-bonding the leads of a lead frame one...
- Patent number 6,786,387
- Issue date Sep 7, 2004
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated method of attaching flip chip devices to a substrate
- Patent number 6,773,523
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondhead lead clamp apparatus
- Patent number 6,662,993
- Issue date Dec 16, 2003
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Condensed memory matrix
- Patent number 6,620,706
- Issue date Sep 16, 2003
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick change precisor
- Patent number 6,607,121
- Issue date Aug 19, 2003
- Micron Technology, Inc.
- Rich Fogal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,604,671
- Issue date Aug 12, 2003
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angularly offset and recessed stacked die multichip device and meth...
- Patent number 6,563,205
- Issue date May 13, 2003
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated method of attaching flip chip devices to a substrate
- Patent number 6,537,400
- Issue date Mar 25, 2003
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for clamping and wire-bonding the leads of a lead...
- Patent number 6,478,211
- Issue date Nov 12, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for clamping and wire-bonding the leads of a lead frame one...
- Patent number 6,467,672
- Issue date Oct 22, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,464,123
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,435,400
- Issue date Aug 20, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quick change precisor
- Patent number 6,390,350
- Issue date May 21, 2002
- Micron Technology, Inc.
- Rich Fogal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for clamping and wire-bonding the leads of a lead...
- Patent number 6,334,566
- Issue date Jan 1, 2002
- Micron Technology
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,325,275
- Issue date Dec 4, 2001
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding machine
- Patent number 6,321,970
- Issue date Nov 27, 2001
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20190296003
- Publication date Sep 26, 2019
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20180331089
- Publication date Nov 15, 2018
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20170141096
- Publication date May 18, 2017
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20160155729
- Publication date Jun 2, 2016
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
- Publication number 20130193581
- Publication date Aug 1, 2013
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
- Publication number 20110104857
- Publication date May 5, 2011
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDERS AND METHODS OF WIRE-BONDING
- Publication number 20080053964
- Publication date Mar 6, 2008
- Micron Technology, Inc.
- Stuart L. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged microdevices and methods for manufacturing packaged microd...
- Publication number 20080048316
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for circuit completion through the use of ball...
- Publication number 20060121650
- Publication date Jun 8, 2006
- Rich Fogal
- G11 - INFORMATION STORAGE
Information Patent Application
Wire bonders and methods of wire-bonding
- Publication number 20050029329
- Publication date Feb 10, 2005
- Stuart L. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bondhead lead clamp apparatus and method
- Publication number 20040065719
- Publication date Apr 8, 2004
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bondhead lead clamp apparatus
- Publication number 20040026478
- Publication date Feb 12, 2004
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Automated method of attaching flip chip devices to a substrate
- Publication number 20030111154
- Publication date Jun 19, 2003
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for circuit completion through the use of ball...
- Publication number 20030045026
- Publication date Mar 6, 2003
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bondhead lead clamp apparatus
- Publication number 20020185519
- Publication date Dec 12, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for clamping and wire-bonding the leads of a lead...
- Publication number 20020179691
- Publication date Dec 5, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for clamping and wire-bonding the leads of a lead...
- Publication number 20020179675
- Publication date Dec 5, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bondhead lead clamp apparatus and method
- Publication number 20020179687
- Publication date Dec 5, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quick change precisor
- Publication number 20020125296
- Publication date Sep 12, 2002
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automated method of attaching flip chip devices to a substrate
- Publication number 20020092595
- Publication date Jul 18, 2002
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Condensed memory matrix
- Publication number 20020050638
- Publication date May 2, 2002
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for clamping and wire-bonding the leads of a lead...
- Publication number 20020040921
- Publication date Apr 11, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for clamping and wire-bonding the leads of a lead...
- Publication number 20020030088
- Publication date Mar 14, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bondhead lead clamp apparatus and method
- Publication number 20020023944
- Publication date Feb 28, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bondhead lead clamp apparatus and method
- Publication number 20020023940
- Publication date Feb 28, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quick change precisor
- Publication number 20010025872
- Publication date Oct 4, 2001
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Proximity coupling interconnect packaging systems and methods

Proximity coupling interconnect packaging systems and methods

Proximity coupling of interconnect packaging systems and methods

Packaged microdevices and methods for manufacturing packaged microd...

Packaged microdevices and methods for manufacturing packaged microd...

Wire bonders and methods of wire-bonding

Packaged microdevices and methods for manufacturing packaged microd...

Wire bonders and methods of wire-bonding

Method and apparatus for circuit completion through the use of ball...

Device and method for clamping and wire-bonding the leads of a lead...

Angularly offset stacked die multichip device and method of manufac...

Bondhead lead clamp apparatus

Bondhead lead clamp apparatus and method

Automated method of attaching flip-chip devices to a substrate

Method for clamping and wire-bonding the leads of a lead frame one...

Automated method of attaching flip chip devices to a substrate

Bondhead lead clamp apparatus

Condensed memory matrix

Quick change precisor

Bondhead lead clamp apparatus and method

Angularly offset and recessed stacked die multichip device and meth...

Automated method of attaching flip chip devices to a substrate

Device and method for clamping and wire-bonding the leads of a lead...

Methods for clamping and wire-bonding the leads of a lead frame one...

Bondhead lead clamp apparatus and method

Bondhead lead clamp apparatus and method

Quick change precisor

Device and method for clamping and wire-bonding the leads of a lead...

Bondhead lead clamp apparatus and method

Wire bonding machine

Patents Applicationslast 30 patents

PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS

PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS

PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...

PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...

WIRE BONDERS AND METHODS OF WIRE-BONDING

Packaged microdevices and methods for manufacturing packaged microd...

Method and apparatus for circuit completion through the use of ball...

Wire bonders and methods of wire-bonding

Bondhead lead clamp apparatus and method

Bondhead lead clamp apparatus

Automated method of attaching flip chip devices to a substrate

Method and apparatus for circuit completion through the use of ball...

Bondhead lead clamp apparatus

Device and method for clamping and wire-bonding the leads of a lead...

Device and method for clamping and wire-bonding the leads of a lead...

Bondhead lead clamp apparatus and method

Quick change precisor

Automated method of attaching flip chip devices to a substrate

Condensed memory matrix

Device and method for clamping and wire-bonding the leads of a lead...

Device and method for clamping and wire-bonding the leads of a lead...

Bondhead lead clamp apparatus and method

Bondhead lead clamp apparatus and method

Quick change precisor