Claims
- 1. A wire bonding method for a wire bonding apparatus, said wire bonding method for holding at least portions of a plurality of leads of a lead frame comprising clamping a plurality of at least three sets of the plurality of leads of the lead frame, one set of leads at a time, with each set of the plurality of sets of the plurality of leads of the lead frame including fewer than all the leads of the plurality of leads of the lead frame, at least one set of leads of the plurality of sets of the plurality of leads of the lead frame including more than one of the leads, and at least one set of leads of the plurality of sets of the plurality of leads being clamped on a different plane than at least one other set of leads of the plurality of leads.
- 2. The wire bonding method of claim 1, wherein the clamping the one set of leads at a time comprises holding the one set of leads at a time against a heat block.
- 3. A wire bonding method for a wire bonding apparatus, said wire bonding method for wire-bonding a plurality of leads of each lead frame of a plurality of lead frames in a lead frame strip to bond pads on integrated circuit dice connected to the plurality of lead frames, the method comprising:
moving each lead frame of the plurality of lead frames in the lead frame strip to a position; clamping a plurality of at least three sets of the plurality of leads for the lead frame at the position, one set at a time, having each set of the leads of the plurality of at least three sets including fewer than all of the leads of the lead frame, at least one set including more than one lead of the plurality of leads of the lead frame and at least one set of the plurality of leads being clamped on a different plane than at least one other set of the plurality of leads; and forming wire-bonds between portions of the at least one set of the plurality of leads to portions of the bond pads on the integrated circuit dice connected to the lead frame of the leads.
- 4. The wire bonding method of claim 3, further comprising:
testing wire-bonds of the plurality of leads of each of the lead frames at the position.
- 5. The wire bonding method of claim 4, wherein the testing wire-bonds comprises at least one of pull testing and shear testing the wire-bonds.
- 6. The wire bonding method of claim 3, wherein the forming wire-bonds comprises wire-bonding each set of the leads at the position using a bonding method selected from a group comprising ultrasonic bonding, thermosonic bonding, and thermo-compression bonding.
- 7. A method for clamping a plurality of leads of a lead frame, each lead having a wire bonding region thereof, the method comprising:
determining the distance between the wire bonding region of at least two leads of said plurality of leads and a center portion of the lead frame; subdividing a plurality of leads into at least two sets of leads based on a distance between their respective bonding regions and a center portion of the lead frame; and clamping each set of leads, one set of leads at a time.
- 8. The method of claim 7, wherein the lead frame includes bus bars and one set of leads includes solely bus bars.
- 9. The method of claim 8, wherein the one set of leads including only the bus bars is clamped first.
- 10. The method of claim 7, wherein the clamping the set of leads, one set of leads at a time, further comprises clamping the set of leads, one set at a time, in an order according to which of the set of leads has a shortest distance between the bonding region and the center portion of the lead frame.
- 11. A method of clamping at least two leads of a plurality of leads of a lead frame, at least one lead lying in a different plane than at least one other lead, the method comprising:
determining the plane in which at least two sets of leads of said plurality of leads in which at least one lead of the at least two leads lies; subdividing a plurality of leads into at least two sets of leads with respect to a plane in which at least one lead of the at least two sets of leads lies; and clamping each set of leads, one set of leads at a time.
- 12. The method of claim 11, wherein the plurality of leads includes leads-over-chip type leads and wherein the subdividing a plurality of leads includes creating a set of leads including only the lead-over-chip type leads.
- 13. The method of claim 12, wherein the clamping each set of leads, one set of leads at a time, further includes clamping the set of lead-over-chip type leads first.
- 14. The method of claim 11, wherein the plurality of leads includes tape-under-frame type leads and wherein the subdividing a plurality of leads includes creating a set of leads including only the tape-under-frame type leads.
- 15. The method of claim 14, wherein the clamping each set of leads, one set of leads at a time, further includes clamping the set of tape-under-frame type leads first.
- 16. A method for connecting a plurality of leads of lead frames in a lead frame strip to at least one bond pad of a plurality of bond pads on integrated circuit dice attached to the lead frames, the method comprising:
positioning each lead frame in the lead frame strip at a position; clamping a plurality of at least two sets of leads of a plurality of sets of leads of each of the lead frames indexed to the clamping position, one set at a time, with each set of leads including fewer than all of the leads of the lead frame and at least one set of leads including more than one of the leads; forming wire-bonds between at least one lead of each of the sets of clamped leads to at least one bond pad of the plurality of bond pads on the integrated circuit dice attached to the lead frame of the clamped leads; and testing at least one wire-bond between at least one lead of each of the lead frames at the clamping position and the bond pads of the integrated circuit dice while other leads of the lead frame are clamped.
- 17. The method of claim 16, wherein the testing at least one wire-bond comprises at least one of pull testing and shear testing wire-bonds.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 09/944,470, filed Aug. 30, 2001, pending, which is a continuation of application Ser. No. 09/366,817, filed Aug. 4, 1999, now U.S. Pat. No. 6,299,049 B1, issued Oct. 9, 2001, which is a continuation of application Ser. No. 08/763,366, filed Dec. 13, 1996, now U.S. Pat. No. 6,068,174, issued May 30, 2000.
Continuations (3)
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Number |
Date |
Country |
Parent |
09944470 |
Aug 2001 |
US |
Child |
10206291 |
Jul 2002 |
US |
Parent |
09366817 |
Aug 1999 |
US |
Child |
09944470 |
Aug 2001 |
US |
Parent |
08763366 |
Dec 1996 |
US |
Child |
09366817 |
Aug 1999 |
US |