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Richard P. Volant
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New Fairfield, CT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Protected through semiconductor via (TSV)
Patent number
9,673,095
Issue date
Jun 6, 2017
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protected through semiconductor via (TSV)
Patent number
9,401,323
Issue date
Jul 26, 2016
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Yield enhancement for stacked chips through rotationally-connecting...
Patent number
9,151,781
Issue date
Oct 6, 2015
International Business Machines Corporation
Oleg Gluschenkov
G01 - MEASURING TESTING
Information
Patent Grant
Enhanced capture pads for through semiconductor vias
Patent number
9,040,418
Issue date
May 26, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure of forming backside through silicon via connec...
Patent number
8,970,011
Issue date
Mar 3, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymeric edge seal for bonded substrates
Patent number
8,894,800
Issue date
Nov 25, 2014
International Business Machines Corporation
Mutka G. Farooq
B32 - LAYERED PRODUCTS
Information
Patent Grant
Enhanced capture pads for through semiconductor vias
Patent number
8,772,949
Issue date
Jul 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure of forming backside through silicon via connec...
Patent number
8,709,936
Issue date
Apr 29, 2014
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TSV pillar as an interconnecting structure
Patent number
8,691,691
Issue date
Apr 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-contamination-free through-substrate via structure
Patent number
8,679,971
Issue date
Mar 25, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protecting a mold having a substantially planar surface provided wi...
Patent number
8,668,834
Issue date
Mar 11, 2014
International Business Machines Corporations
Bradley P. Jones
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Optimized annular copper TSV
Patent number
8,658,535
Issue date
Feb 25, 2014
International Business Machines Corporation
Paul S. Andry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated void fill for through silicon via
Patent number
8,633,580
Issue date
Jan 21, 2014
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymeric edge seal for bonded substrates
Patent number
8,613,996
Issue date
Dec 24, 2013
International Business Machines Corporation
Mukta G. Farooq
B32 - LAYERED PRODUCTS
Information
Patent Grant
Integrated void fill for through silicon via
Patent number
8,609,537
Issue date
Dec 17, 2013
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integrated circuit integration using alignment vi...
Patent number
8,563,403
Issue date
Oct 22, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment marks to enable 3D integration
Patent number
8,546,961
Issue date
Oct 1, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-contamination-free through-substrate via structure
Patent number
8,492,878
Issue date
Jul 23, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optimized annular copper TSV
Patent number
8,487,425
Issue date
Jul 16, 2013
International Business Machines Corporation
Paul S Andry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated void fill for through silicon via
Patent number
8,455,356
Issue date
Jun 4, 2013
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating coaxial through-silicon via
Patent number
8,394,715
Issue date
Mar 12, 2013
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit design checking for three dimensional chip technology
Patent number
8,386,977
Issue date
Feb 26, 2013
International Business Machines Corporation
Mukta G. Farooq
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Coaxial through-silicon via
Patent number
8,242,604
Issue date
Aug 14, 2012
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Yield enhancement for stacked chips through rotationally-connecting...
Patent number
8,159,247
Issue date
Apr 17, 2012
International Business Machines Corporation
Oleg Gluschenkov
G01 - MEASURING TESTING
Information
Patent Grant
Method of forming a multi-chip stacked structure including a thin i...
Patent number
8,114,707
Issue date
Feb 14, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a sidewall-protected metallic pillar on a semicond...
Patent number
7,855,137
Issue date
Dec 21, 2010
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming conductive structures
Patent number
7,833,893
Issue date
Nov 16, 2010
International Business Machines Corporation
Stephan Grunow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a high Q factor integrated circuit inductor
Patent number
7,829,427
Issue date
Nov 9, 2010
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder connector structure and method
Patent number
7,816,248
Issue date
Oct 19, 2010
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electromechanical sub-assembly having an on-chip transfer mec...
Patent number
7,735,216
Issue date
Jun 15, 2010
International Business Machines Corporation
Christopher M. Schnabel
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)
Publication number
20160293487
Publication date
Oct 6, 2016
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNEC...
Publication number
20150097273
Publication date
Apr 9, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
Publication number
20140124946
Publication date
May 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
Publication number
20140127904
Publication date
May 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNEC...
Publication number
20140124954
Publication date
May 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTION OF THRU-SUBSTRATE VIA PISTONING USING HIGHLY DOPED COPPE...
Publication number
20140061915
Publication date
Mar 6, 2014
International Business Machines Corporation
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNEC...
Publication number
20140035109
Publication date
Feb 6, 2014
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTIMIZED ANNULAR COPPER TSV
Publication number
20130244420
Publication date
Sep 19, 2013
International Business Machines Corporation
Paul S. Andry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
Publication number
20130168015
Publication date
Jul 4, 2013
International Business Machines Corporation
Mutka G. Farooq
B32 - LAYERED PRODUCTS
Information
Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
Publication number
20130143400
Publication date
Jun 6, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED VOID FILL FOR THROUGH SILICON VIA
Publication number
20130122702
Publication date
May 16, 2013
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
Publication number
20130026606
Publication date
Jan 31, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTIMIZED ANNULAR COPPER TSV
Publication number
20120326309
Publication date
Dec 27, 2012
International Business Machines Corporation
PAUL S ANDRY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY
Publication number
20120304138
Publication date
Nov 29, 2012
International Business Machines Corporation
Mukta G. Farooq
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED VOID FILL FOR THROUGH SILICON VIA
Publication number
20120292786
Publication date
Nov 22, 2012
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING COAXIAL THROUGH-SILICON VIA
Publication number
20120258589
Publication date
Oct 11, 2012
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTING A MOLD HAVING A SUBSTANTIALLY PLANAR SURFACE PROVIDED WI...
Publication number
20120207920
Publication date
Aug 16, 2012
International Business Machines Corporation
Bradley P. Jones
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ALIGNMENT MARKS TO ENABLE 3D INTEGRATION
Publication number
20120175789
Publication date
Jul 12, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
YIELD ENHANCEMENT FOR STACKED CHIPS THROUGH ROTATIONALLY-CONNECTING...
Publication number
20120146682
Publication date
Jun 14, 2012
International Business Machines Corporation
Oleg Gluschenkov
G01 - MEASURING TESTING
Information
Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
Publication number
20120018851
Publication date
Jan 26, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A MULTI-CHIP STACKED STRUCTURE INCLUDING A THIN I...
Publication number
20110237026
Publication date
Sep 29, 2011
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED VOID FILL FOR THROUGH SILICON VIA
Publication number
20110175216
Publication date
Jul 21, 2011
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COAXIAL THROUGH-SILICON VIA
Publication number
20110095435
Publication date
Apr 28, 2011
International Business Machines Corporation
Richard P. Volant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
Publication number
20110091685
Publication date
Apr 21, 2011
International Business Machines Corporation
Mukta G. Farooq
B32 - LAYERED PRODUCTS
Information
Patent Application
FORMING A PROTECTIVE LAYER ON A MOLD AND MOLD HAVING A PROTECTIVE L...
Publication number
20110079702
Publication date
Apr 7, 2011
International Business Machines Corporation
Bradley P. Jones
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
YIELD ENHANCEMENT FOR STACKED CHIPS THROUGH ROTATIONALLY-CONNECTING...
Publication number
20110080189
Publication date
Apr 7, 2011
International Business Machines Corporation
Oleg Gluschenkov
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR
Publication number
20100047990
Publication date
Feb 25, 2010
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING A SIDEWALL-PROTECTED METALLIC PILLAR ON A SEMICOND...
Publication number
20100038777
Publication date
Feb 18, 2010
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH
Publication number
20090181532
Publication date
Jul 16, 2009
International Business Machines Corporation
David P. Colon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-ELECTROMECHANICAL SUB-ASSEMBLY HAVING AN ON-CHIP TRANSFER MEC...
Publication number
20090019691
Publication date
Jan 22, 2009
International Business Machines Corporation
Christopher M. Schnabel
B81 - MICRO-STRUCTURAL TECHNOLOGY