Richard Willson Arnold

Person

McKinney, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Known good die using existing process infrastructure
- Patent number 7,898,275
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Stud-cone bump for probe tips used in known good die carriers
- Patent number 7,122,895
- Issue date Oct 17, 2006
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Multiple-chip probe and universal tester contact assemblage
- Patent number 7,026,833
- Issue date Apr 11, 2006
- Texas Instruments Incorporated
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Grant
Multiple-chip probe and universal tester contact assemblage
- Patent number 6,970,005
- Issue date Nov 29, 2005
- Texas Instruments Incorporated
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Grant
High density, area array probe card apparatus
- Patent number 6,906,539
- Issue date Jun 14, 2005
- Texas Instruments Incorporated
- Lester Wilson
- G01 - MEASURING TESTING
Information Patent Grant
Method of testing a semiconductor chip
- Patent number 6,720,574
- Issue date Apr 13, 2004
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
High density probe card apparatus and method of manufacture
- Patent number 6,720,780
- Issue date Apr 13, 2004
- Texas Instruments Incorporated
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Grant
Probe card with contact apparatus and method of manufacture
- Patent number 6,636,063
- Issue date Oct 21, 2003
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test structure having a laser defined current carryin...
- Patent number 6,553,661
- Issue date Apr 29, 2003
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Digital signal processor/known good die packaging using rerouted ex...
- Patent number 6,489,673
- Issue date Dec 3, 2002
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Stud-cone bump for probe tips used in known good die carriers
- Patent number 6,376,352
- Issue date Apr 23, 2002
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Digital signal processor/known good die packaging using rerouted ex...
- Patent number 6,335,226
- Issue date Jan 1, 2002
- Texas Instruments Incorporated
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Grant
Soft handling process tooling for low and medium volume known good...
- Patent number 6,209,532
- Issue date Apr 3, 2001
- Texas Instruments Incorporated
- Richard W. Arnold
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Tool and fixture for the removal of tab leads bonded to semiconduct...
- Patent number 5,649,981
- Issue date Jul 22, 1997
- Texas Instruments Incorporated
- Richard W. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of removing a tape automated bonded semiconductor from bond...
- Patent number 5,591,649
- Issue date Jan 7, 1997
- Texas Instruments Incorporated
- Richard W. Arnold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Crack-Deflecting Structure and Method
- Publication number 20090166810
- Publication date Jul 2, 2009
- Daniel Joseph Stillman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...
- Publication number 20090039524
- Publication date Feb 12, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-CHIP PROBE AND UNIVERSAL TESTER CONTACT ASSEMBLAGE
- Publication number 20060033516
- Publication date Feb 16, 2006
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor chip package
- Publication number 20050151273
- Publication date Jul 14, 2005
- Richard Willson Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density, area array probe card apparatus
- Publication number 20050140382
- Publication date Jun 30, 2005
- Lester Wilson
- G01 - MEASURING TESTING
Information Patent Application
High density probe card apparatus and method of manufacture
- Publication number 20040169521
- Publication date Sep 2, 2004
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Application
Stud-cone bump for probe tips used in known good die carriers
- Publication number 20040152232
- Publication date Aug 5, 2004
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Application
Dual plane probe card assembly and method of manufacture
- Publication number 20030094962
- Publication date May 22, 2003
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor test structure having a laser defined current carryin...
- Publication number 20030088975
- Publication date May 15, 2003
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Application
Probe card with contact apparatus and method of manufacture
- Publication number 20030062915
- Publication date Apr 3, 2003
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Application
Known good die using existing process infrastructure
- Publication number 20020084515
- Publication date Jul 4, 2002
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor test structure having a laser defined current carryin...
- Publication number 20020084799
- Publication date Jul 4, 2002
- Richard W. Arnold
- G01 - MEASURING TESTING
Information Patent Application
Multiple-chip probe and universal tester contact assemblage
- Publication number 20020043980
- Publication date Apr 18, 2002
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Application
High density probe card apparatus and method of manufacture
- Publication number 20020027443
- Publication date Mar 7, 2002
- Reynaldo M. Rincon
- G01 - MEASURING TESTING
Information Patent Application
High density, area array probe card apparatus
- Publication number 20020008529
- Publication date Jan 24, 2002
- Lester Wilson
- G01 - MEASURING TESTING
Information Patent Application
Digital signal processor/known good die packaging using rerouted ex...
- Publication number 20010030360
- Publication date Oct 18, 2001
- Richard W. Arnold
- G01 - MEASURING TESTING

Richard Willson Arnold

Person

Patents Grantslast 30 patents

Known good die using existing process infrastructure

Stud-cone bump for probe tips used in known good die carriers

Multiple-chip probe and universal tester contact assemblage

Multiple-chip probe and universal tester contact assemblage

High density, area array probe card apparatus

Method of testing a semiconductor chip

High density probe card apparatus and method of manufacture

Probe card with contact apparatus and method of manufacture

Semiconductor test structure having a laser defined current carryin...

Digital signal processor/known good die packaging using rerouted ex...

Stud-cone bump for probe tips used in known good die carriers

Digital signal processor/known good die packaging using rerouted ex...

Soft handling process tooling for low and medium volume known good...

Tool and fixture for the removal of tab leads bonded to semiconduct...

Process of removing a tape automated bonded semiconductor from bond...

Patents Applicationslast 30 patents

Semiconductor Device Crack-Deflecting Structure and Method

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...

MULTIPLE-CHIP PROBE AND UNIVERSAL TESTER CONTACT ASSEMBLAGE

Semiconductor chip package

High density, area array probe card apparatus

High density probe card apparatus and method of manufacture

Stud-cone bump for probe tips used in known good die carriers

Dual plane probe card assembly and method of manufacture

Semiconductor test structure having a laser defined current carryin...

Probe card with contact apparatus and method of manufacture

Known good die using existing process infrastructure

Semiconductor test structure having a laser defined current carryin...

Multiple-chip probe and universal tester contact assemblage

High density probe card apparatus and method of manufacture

High density, area array probe card apparatus

Digital signal processor/known good die packaging using rerouted ex...