Robert W. Hitzfeld

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cathode current control system for a wafer electroplating apparatus
- Patent number 6,843,894
- Issue date Jan 18, 2005
- Semitool, Inc.
- Robert W. Berner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cathode current control system for a wafer electroplating apparatus
- Patent number 6,627,051
- Issue date Sep 30, 2003
- Semitool, Inc.
- Robert W. Berner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for rotary cathode electroplating with wireless power tra...
- Patent number 6,500,316
- Issue date Dec 31, 2002
- International Business Machines Corporation
- Joseph J. Fatula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for wireless transfer of power to a rotating element
- Patent number 6,437,472
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Joseph J. Fatula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cathode current control system for a wafer electroplating apparatus
- Patent number 6,322,674
- Issue date Nov 27, 2001
- Semitool, Inc.
- Robert W. Berner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rotary element apparatus with wireless power transfer
- Patent number 6,278,210
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Joseph J. Fatula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-compartment eletroplating system
- Patent number 5,312,532
- Issue date May 17, 1994
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Methods and systems for electroplating wafers
- Publication number 20060191784
- Publication date Aug 31, 2006
- HITACHI GLOBAL STORAGE TECHNOLOGIES
- Robert William Hitzfeld
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cathode current control system for a wafer electroplating apparatus
- Publication number 20040055879
- Publication date Mar 25, 2004
- Robert W. Berner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cathode current control system for a wafer electroplating apparatus
- Publication number 20020003084
- Publication date Jan 10, 2002
- Robert W. Berner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Robert W. Hitzfeld

Person

Patents Grantslast 30 patents

Cathode current control system for a wafer electroplating apparatus

Cathode current control system for a wafer electroplating apparatus

Apparatus for rotary cathode electroplating with wireless power tra...

Apparatus for wireless transfer of power to a rotating element

Cathode current control system for a wafer electroplating apparatus

Rotary element apparatus with wireless power transfer

Multi-compartment eletroplating system

Patents Applicationslast 30 patents

Methods and systems for electroplating wafers

Cathode current control system for a wafer electroplating apparatus

Cathode current control system for a wafer electroplating apparatus