Roland Irsigler

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus having stacked semiconductor components
- Patent number 8,598,716
- Issue date Dec 3, 2013
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical through contact
- Patent number 8,124,521
- Issue date Feb 28, 2012
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-stress through-chip feature and method of making the same
- Patent number 8,106,511
- Issue date Jan 31, 2012
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, circuit system, and method of manufacturing
- Patent number 8,072,084
- Issue date Dec 6, 2011
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for placing material onto a target board by means of a trans...
- Patent number 8,048,479
- Issue date Nov 1, 2011
- Qimonda AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with an interconnect element and method for ma...
- Patent number 8,049,310
- Issue date Nov 1, 2011
- Qimonda AG
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method of manufacturing a chip arrangement
- Patent number 7,960,843
- Issue date Jun 14, 2011
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multichip module assembly
- Patent number 7,847,415
- Issue date Dec 7, 2010
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device, stack of electric devices, and method of manufactu...
- Patent number 7,834,462
- Issue date Nov 16, 2010
- Qimonda AG
- Stephan Dobritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder pillar bumping and a method of making the same
- Patent number 7,829,380
- Issue date Nov 9, 2010
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for making electrical contact with a connectio...
- Patent number 7,646,090
- Issue date Jan 12, 2010
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,638,869
- Issue date Dec 29, 2009
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, especially a memory chip
- Patent number 7,338,843
- Issue date Mar 4, 2008
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and method for producing a semiconductor
- Patent number 7,265,451
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the semiconductor d...
- Patent number 7,247,948
- Issue date Jul 24, 2007
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a component module
- Patent number 7,211,451
- Issue date May 1, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a multichip module and multichip module
- Patent number 7,211,472
- Issue date May 1, 2007
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating connection regions of an integrated circuit,...
- Patent number 7,087,512
- Issue date Aug 8, 2006
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible contact-connection device
- Patent number 7,080,988
- Issue date Jul 25, 2006
- Infineon Technologies AG
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing an integrated circuit with a rewiring device a...
- Patent number 7,074,649
- Issue date Jul 11, 2006
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting an integrated circuit to a substrate and corr...
- Patent number 7,022,549
- Issue date Apr 4, 2006
- Infineon Technologies, AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection of integrated circuits
- Patent number 6,979,591
- Issue date Dec 27, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor chip
- Patent number 6,919,232
- Issue date Jul 19, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting circuit devices
- Patent number 6,897,088
- Issue date May 24, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method producing a contact connection between a semiconductor chip...
- Patent number 6,861,291
- Issue date Mar 1, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connection of circuit units
- Patent number 6,845,554
- Issue date Jan 25, 2005
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component having a plurality of...
- Patent number 6,714,418
- Issue date Mar 30, 2004
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser programming of integrated circuits
- Patent number 6,630,723
- Issue date Oct 7, 2003
- Infineon Technologies, AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN I...
- Publication number 20110217812
- Publication date Sep 8, 2011
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Chips with Through Substrate Vias
- Publication number 20100065949
- Publication date Mar 18, 2010
- Andreas Thies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Multichip Module Assembly
- Publication number 20100013101
- Publication date Jan 21, 2010
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Arrangement and Method of Manufacturing a Chip Arrangement
- Publication number 20090321959
- Publication date Dec 31, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With an Interconnect Element and Method for Ma...
- Publication number 20090243047
- Publication date Oct 1, 2009
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced-Stress Through-Chip Feature and Method of Making the Same
- Publication number 20090218690
- Publication date Sep 3, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME
- Publication number 20090212420
- Publication date Aug 27, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, CIRCUIT SYSTEM, AND METHOD OF MANUFACTURING
- Publication number 20090072398
- Publication date Mar 19, 2009
- QIMONDA AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device, Stack of Electric Devices, and Method of Manufactu...
- Publication number 20090072374
- Publication date Mar 19, 2009
- Stephan Dobritz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080237891
- Publication date Oct 2, 2008
- QIMONDA AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN INTEGRATED CIRCUIT HAVING A VIA HOLE
- Publication number 20080164611
- Publication date Jul 10, 2008
- QIMONDA AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CIRCUIT
- Publication number 20080150154
- Publication date Jun 26, 2008
- QIMONDA AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder pillar bumping and a method of making the same
- Publication number 20080099925
- Publication date May 1, 2008
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for placing material onto a target board by means of a trans...
- Publication number 20080029849
- Publication date Feb 7, 2008
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNEC...
- Publication number 20070273011
- Publication date Nov 29, 2007
- QIMONDA AG
- Laurence Edward Singleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate connection for flip chip in packages
- Publication number 20070120268
- Publication date May 31, 2007
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for aligning a device and for stacking two devices in an al...
- Publication number 20070084944
- Publication date Apr 19, 2007
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor structure having a wafer th...
- Publication number 20070032059
- Publication date Feb 8, 2007
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A M...
- Publication number 20070023886
- Publication date Feb 1, 2007
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating connection regions of an integrated circuit,...
- Publication number 20060244109
- Publication date Nov 2, 2006
- Infineon Technologies AG, a German corporation
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method for producing a semiconductor module
- Publication number 20060177964
- Publication date Aug 10, 2006
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component comprising external surface contacts and a met...
- Publication number 20060091561
- Publication date May 4, 2006
- Jochen Dangelmaier
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor and method for producing a semiconductor
- Publication number 20060043573
- Publication date Mar 2, 2006
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus having stacked semiconductor components
- Publication number 20060043561
- Publication date Mar 2, 2006
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible contact-connection device
- Publication number 20050282410
- Publication date Dec 22, 2005
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating connection regions of an integrated circuit,...
- Publication number 20050250304
- Publication date Nov 10, 2005
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a multichip module and multichip module
- Publication number 20050077632
- Publication date Apr 14, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method for producing a semiconductor module
- Publication number 20050067689
- Publication date Mar 31, 2005
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electronic component, especially a memory chip
- Publication number 20050048676
- Publication date Mar 3, 2005
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact-connection device for electronic circuit units and producti...
- Publication number 20050014394
- Publication date Jan 20, 2005
- INFINEON TECHNOLOGIES
- Harry Hedler
- G01 - MEASURING TESTING

Roland Irsigler

Person

Patents Grantslast 30 patents

Semiconductor apparatus having stacked semiconductor components

Electrical through contact

Reduced-stress through-chip feature and method of making the same

Integrated circuit, circuit system, and method of manufacturing

Method for placing material onto a target board by means of a trans...

Semiconductor device with an interconnect element and method for ma...

Chip arrangement and method of manufacturing a chip arrangement

Method for manufacturing a multichip module assembly

Electric device, stack of electric devices, and method of manufactu...

Solder pillar bumping and a method of making the same

Semiconductor module for making electrical contact with a connectio...

Semiconductor device

Method for producing an electronic component, especially a memory chip

Semiconductor and method for producing a semiconductor

Semiconductor device and method for fabricating the semiconductor d...

Process for producing a component module

Method for producing a multichip module and multichip module

Method for fabricating connection regions of an integrated circuit,...

Flexible contact-connection device

Method for producing an integrated circuit with a rewiring device a...

Method for connecting an integrated circuit to a substrate and corr...

Connection of integrated circuits

Process for producing a semiconductor chip

Method for connecting circuit devices

Method producing a contact connection between a semiconductor chip...

Method for connection of circuit units

Method for producing an electronic component having a plurality of...

Laser programming of integrated circuits

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN I...

Stacked Semiconductor Chips with Through Substrate Vias

Method for Manufacturing a Multichip Module Assembly

Chip Arrangement and Method of Manufacturing a Chip Arrangement

Semiconductor Device With an Interconnect Element and Method for Ma...

Reduced-Stress Through-Chip Feature and Method of Making the Same

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME

INTEGRATED CIRCUIT, CIRCUIT SYSTEM, AND METHOD OF MANUFACTURING

Electric Device, Stack of Electric Devices, and Method of Manufactu...

SEMICONDUCTOR DEVICE

METHOD FOR MAKING AN INTEGRATED CIRCUIT HAVING A VIA HOLE

METHOD FOR FABRICATING A CIRCUIT

Solder pillar bumping and a method of making the same

Method for placing material onto a target board by means of a trans...

METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNEC...

Intermediate connection for flip chip in packages

Methods for aligning a device and for stacking two devices in an al...

Method of manufacturing a semiconductor structure having a wafer th...

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A M...

Method for fabricating connection regions of an integrated circuit,...

Semiconductor module and method for producing a semiconductor module

Electronic component comprising external surface contacts and a met...

Semiconductor and method for producing a semiconductor

Semiconductor apparatus having stacked semiconductor components

Flexible contact-connection device

Method for fabricating connection regions of an integrated circuit,...

Method for producing a multichip module and multichip module

Semiconductor module and method for producing a semiconductor module

Method for producing an electronic component, especially a memory chip

Contact-connection device for electronic circuit units and producti...