Ron Iwata

Follow

Person

Hukou Shiang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging method to save interposer
- Patent number 7,927,919
- Issue date Apr 19, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package-on-package (POP) device avoiding crack at sol...
- Patent number 7,619,305
- Issue date Nov 17, 2009
- Powertech Technology Inc.
- Wen-Jeng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR CHIP DEVICE HAVING THROUGH-S...
- Publication number 20100167534
- Publication date Jul 1, 2010
- Ronald Takao IWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip device having through-silicon-via (TSV) and its...
- Publication number 20090127667
- Publication date May 21, 2009
- Powertech Technology Inc.
- Ronald Takao Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package-on-package (POP) device avoiding crack at sol...
- Publication number 20090045523
- Publication date Feb 19, 2009
- Powertech Technology Inc.
- Wen-Jeng Fan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Micro BGA package having multi-chip stack
- Publication number 20080087999
- Publication date Apr 17, 2008
- Powertech Technology Inc.
- Ronald Takao Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP package with small dimension
- Publication number 20080088005
- Publication date Apr 17, 2008
- Powertech Technology Inc.
- Ronald Takao Iwata
- H01 - BASIC ELECTRIC ELEMENTS