Roy C. Iggulden

Person

Stoughton, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Post chemical mechanical polishing etch for improved time dependent...
- Patent number 8,465,657
- Issue date Jun 18, 2013
- International Business Machines Corporation
- Kaushik Chanda
- B24 - GRINDING POLISHING
Information Patent Grant
Gas dielectric structure forming methods
- Patent number 7,560,375
- Issue date Jul 14, 2009
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve time dependent dielectric breakdown
- Patent number 7,473,636
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of residual liner materials after polishing in damascene...
- Patent number 7,361,584
- Issue date Apr 22, 2008
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure or interconnect and via st...
- Patent number 7,287,325
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Kaushik Chanda
- B24 - GRINDING POLISHING
Information Patent Grant
Capacitive monitors for detecting metal extrusion during electromig...
- Patent number 7,119,545
- Issue date Oct 10, 2006
- International Business Machines Corporation
- Ishtiaq Ahsan
- G01 - MEASURING TESTING
Information Patent Grant
Low Cu percentages for reducing shorts in AlCu lines
- Patent number 6,960,306
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching openings of different depths using a single mask layer meth...
- Patent number 6,887,785
- Issue date May 3, 2005
- International Business Machines Corporation
- David M. Dobuzinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device interconnection
- Patent number 6,870,263
- Issue date Mar 22, 2005
- Infineon Technologies AG
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner with poor step coverage to improve contact resistance in W co...
- Patent number 6,734,097
- Issue date May 11, 2004
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabrication including forming...
- Patent number 6,635,564
- Issue date Oct 21, 2003
- Infineon Technologies AG
- Stefan Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-based metallization exhibiting reduced electromigration an...
- Patent number 6,448,173
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Lawrence Alfred Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-rie structure for via/line interconnections
- Patent number 6,444,565
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Christopher Adam Feild
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-RIE structure for via/line interconnections
- Patent number 6,433,436
- Issue date Aug 13, 2002
- International Business Machines Corporation
- Christopher Adam Feild
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solute-enriched layer in a substrate surface an...
- Patent number 6,413,866
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Horatio S. Wildman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of enclosing via for improved reliability in dual damascene...
- Patent number 6,383,920
- Issue date May 7, 2002
- International Business Machines Corporation
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD/PVD/CVD/PVD fill process
- Patent number 6,361,880
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Larry Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical electrical cavity-fuse
- Patent number 6,252,292
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Axel C. Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical fuse and method of fabrication
- Patent number 6,242,789
- Issue date Jun 5, 2001
- Infineon Technologies North America Corp.
- Stefan J. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical fuse and method of fabrication
- Patent number 6,218,279
- Issue date Apr 17, 2001
- Infineon Technologies North America Corp.
- Stefan J. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line deposition process
- Patent number 6,136,709
- Issue date Oct 24, 2000
- Infineon Technologies North America Corp.
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD/PVD method of filling structures using discontinuous CVD AL liner
- Patent number 6,057,236
- Issue date May 2, 2000
- International Business Machines Corporation
- Larry Clevenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POST CHEMICAL MECHANICAL POLISHING ETCH FOR IMPROVED TIME DEPENDENT...
- Publication number 20070267386
- Publication date Nov 22, 2007
- Kaushik Chanda
- B24 - GRINDING POLISHING
Information Patent Application
Method to Improve Time Dependent Dielectric Breakdown
- Publication number 20070158851
- Publication date Jul 12, 2007
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION OF RESIDUAL LINER MATERIALS AFTER POLISHING IN DAMASCENE...
- Publication number 20070120259
- Publication date May 31, 2007
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST CHEMICAL MECHANICAL POLISHING ETCH FOR IMPROVED TIME DEPENDENT...
- Publication number 20060254053
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Kaushik Chanda
- B24 - GRINDING POLISHING
Information Patent Application
DETECTION OF RESIDUAL LINER MATERIALS AFTER POLISHING IN DAMASCENE...
- Publication number 20060097394
- Publication date May 11, 2006
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DIELECTRIC STRUCTURE FORMING METHODS
- Publication number 20060073695
- Publication date Apr 6, 2006
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE MONITORS FOR DETECTING METAL EXTRUSION DURING ELECTROMIG...
- Publication number 20060066314
- Publication date Mar 30, 2006
- International Business Machines Corporation
- Ishtiaq Ahsan
- G01 - MEASURING TESTING
Information Patent Application
Nitride and polysilicon interface with titanium layer
- Publication number 20060001162
- Publication date Jan 5, 2006
- Ronald J. Schutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device interconnection
- Publication number 20050116342
- Publication date Jun 2, 2005
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving the electrical resistance of con...
- Publication number 20040155268
- Publication date Aug 12, 2004
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cu percentages for reducing shorts in AlCu lines
- Publication number 20040020891
- Publication date Feb 5, 2004
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner with poor step coverage to improve contact resistance in W co...
- Publication number 20030068894
- Publication date Apr 10, 2003
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-UP TIME REDUCTION BEFORE METAL DEPOSITION
- Publication number 20020016050
- Publication date Feb 7, 2002
- STEFAN J. WEBER
- H01 - BASIC ELECTRIC ELEMENTS

Roy C. Iggulden

Person

Patents Grantslast 30 patents

Post chemical mechanical polishing etch for improved time dependent...

Gas dielectric structure forming methods

Method to improve time dependent dielectric breakdown

Detection of residual liner materials after polishing in damascene...

Method of forming interconnect structure or interconnect and via st...

Capacitive monitors for detecting metal extrusion during electromig...

Low Cu percentages for reducing shorts in AlCu lines

Etching openings of different depths using a single mask layer meth...

Device interconnection

Liner with poor step coverage to improve contact resistance in W co...

Semiconductor structure and method of fabrication including forming...

Aluminum-based metallization exhibiting reduced electromigration an...

Dual-rie structure for via/line interconnections

Dual-RIE structure for via/line interconnections

Method of forming a solute-enriched layer in a substrate surface an...

Process of enclosing via for improved reliability in dual damascene...

CVD/PVD/CVD/PVD fill process

Vertical electrical cavity-fuse

Vertical fuse and method of fabrication

Vertical fuse and method of fabrication

Metal line deposition process

CVD/PVD method of filling structures using discontinuous CVD AL liner

Patents Applicationslast 30 patents

POST CHEMICAL MECHANICAL POLISHING ETCH FOR IMPROVED TIME DEPENDENT...

Method to Improve Time Dependent Dielectric Breakdown

DETECTION OF RESIDUAL LINER MATERIALS AFTER POLISHING IN DAMASCENE...

POST CHEMICAL MECHANICAL POLISHING ETCH FOR IMPROVED TIME DEPENDENT...

DETECTION OF RESIDUAL LINER MATERIALS AFTER POLISHING IN DAMASCENE...

GAS DIELECTRIC STRUCTURE FORMING METHODS

CAPACITIVE MONITORS FOR DETECTING METAL EXTRUSION DURING ELECTROMIG...

Nitride and polysilicon interface with titanium layer

Device interconnection

Method and apparatus for improving the electrical resistance of con...

Low Cu percentages for reducing shorts in AlCu lines

Liner with poor step coverage to improve contact resistance in W co...

HEAT-UP TIME REDUCTION BEFORE METAL DEPOSITION