Roy H. Magnuson

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded thin films
- Patent number 10,064,283
- Issue date Aug 28, 2018
- The Research Foundation for the State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
- Patent number 9,451,693
- Issue date Sep 20, 2016
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded thin films
- Patent number 8,882,983
- Issue date Nov 11, 2014
- The Research Foundation for the State University of New York
- Junghyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conducting paste for device level interconnects
- Patent number 8,685,284
- Issue date Apr 1, 2014
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuitized substrate with internal cooling structure and electrica...
- Patent number 7,738,249
- Issue date Jun 15, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with internal optical pathwa...
- Patent number 7,713,767
- Issue date May 11, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with shielded signal lines and plated-thru-ho...
- Patent number 7,679,005
- Issue date Mar 16, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photoresist composition with antibacterial agent
- Patent number 7,635,552
- Issue date Dec 22, 2009
- Endicott Interconnect Technologies, Inc.
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of silicon micro-mechanical structures
- Patent number 7,566,939
- Issue date Jul 28, 2009
- International Business Machines Corporation
- Michel Despont
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making circuitized substrate with internal optical pathway
- Patent number 7,541,058
- Issue date Jun 2, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with solder-coated microparticle paste connec...
- Patent number 7,442,879
- Issue date Oct 28, 2008
- Endicott Interconect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit card
- Patent number 7,353,590
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method for circuitized substrates
- Patent number 7,169,313
- Issue date Jan 30, 2007
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit card
- Patent number 6,986,198
- Issue date Jan 17, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of silicon micro mechanical structures
- Patent number 6,949,397
- Issue date Sep 27, 2005
- International Business Machines Corporation
- Michel Despont
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Colloidal seed formulation for printed circuit board metallization
- Patent number 6,852,152
- Issue date Feb 8, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,750,405
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,699,350
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated PTH barrels and methods for fabricating
- Patent number 6,630,743
- Issue date Oct 7, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,495,239
- Issue date Dec 17, 2002
- International Business Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a printed circuit board
- Patent number RE37840
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Anilkumar C. Bhatt
- 029 - Metal working
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,436,803
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,268,016
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,204,453
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-voltage plane, multi-signal plane circuit card with photoimag...
- Patent number 6,201,194
- Issue date Mar 13, 2001
- International Business Machines Corporation
- John M. Lauffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biased acid cleaning of a copper-invar-copper laminate
- Patent number 6,179,990
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Raymond Thomas Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preparing a printed circuit board
- Patent number 5,557,844
- Issue date Sep 24, 1996
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making printed circuit boards with selectivity filled pl...
- Patent number 5,487,218
- Issue date Jan 30, 1996
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-subtractive circuitization
- Patent number 5,427,895
- Issue date Jun 27, 1995
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20170013721
- Publication date Jan 12, 2017
- The Research Foundation for The State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20160135303
- Publication date May 12, 2016
- The Research Foundation for The State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
- Publication number 20130033827
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS
- Publication number 20120069531
- Publication date Mar 22, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20090301770
- Publication date Dec 10, 2009
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Circuitized substrate and method of making same
- Publication number 20090241332
- Publication date Oct 1, 2009
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with internal cooling structure and electrica...
- Publication number 20090109624
- Publication date Apr 30, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate with internal optical pathwa...
- Publication number 20090093073
- Publication date Apr 9, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G02 - OPTICS
Information Patent Application
Method of making circuitized substrate with internal optical pathway
- Publication number 20090092353
- Publication date Apr 9, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G02 - OPTICS
Information Patent Application
Adhesive bleed prevention method and product produced from same
- Publication number 20090035455
- Publication date Feb 5, 2009
- Endicott Interconnect Technologies, Inc.
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoresist composition with antibacterial agent
- Publication number 20080026316
- Publication date Jan 31, 2008
- Endicott Interconnect Technologies, Inc.
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with soler-coated microparticle paste connect...
- Publication number 20070007033
- Publication date Jan 11, 2007
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating method for circuitized substrates
- Publication number 20060255009
- Publication date Nov 16, 2006
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with shielded signal lines and plated-thru-ho...
- Publication number 20060214010
- Publication date Sep 28, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of making printed circuit board with varying depth conductiv...
- Publication number 20060121722
- Publication date Jun 8, 2006
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming printed circuit card
- Publication number 20060005383
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication of silicon micro-mechanical structures
- Publication number 20050230839
- Publication date Oct 20, 2005
- Michel Despont
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20050042383
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Two signal one power plane circuit board
- Publication number 20040134685
- Publication date Jul 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication of silicon micro mechanical structures
- Publication number 20040135219
- Publication date Jul 15, 2004
- Michel Despont
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20040058071
- Publication date Mar 25, 2004
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20030209799
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric structure and method of formation
- Publication number 20030010440
- Publication date Jan 16, 2003
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20020195716
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Roy H. Magnuson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing computer systems with fine line circuitized substrates
- Publication number 20010033889
- Publication date Oct 25, 2001
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Roy H. Magnuson

Person

Patents Grantslast 30 patents

Embedded thin films

Electrically conductive adhesive (ECA) for multilayer device interc...

Embedded thin films

Conducting paste for device level interconnects

Circuitized substrate with internal cooling structure and electrica...

Method of making circuitized substrate with internal optical pathwa...

Circuitized substrate with shielded signal lines and plated-thru-ho...

Photoresist composition with antibacterial agent

Fabrication of silicon micro-mechanical structures

Method of making circuitized substrate with internal optical pathway

Circuitized substrate with solder-coated microparticle paste connec...

Method of forming printed circuit card

Plating method for circuitized substrates

Method of forming printed circuit card

Fabrication of silicon micro mechanical structures

Colloidal seed formulation for printed circuit board metallization

Two signal one power plane circuit board

Dielectric structure and method of formation

Copper plated PTH barrels and methods for fabricating

Dielectric structure and method of formation

Method of preparing a printed circuit board

Manufacturing computer systems with fine line circuitized substrates

Manufacturing computer systems with fine line circuitized substrates

Removal of metal skin from a copper-Invar-copper laminate

Two signal one power plane circuit board

Multi-voltage plane, multi-signal plane circuit card with photoimag...

Biased acid cleaning of a copper-invar-copper laminate

Method of preparing a printed circuit board

Method for making printed circuit boards with selectivity filled pl...

Semi-subtractive circuitization

Patents Applicationslast 30 patents

EMBEDDED THIN FILMS

EMBEDDED THIN FILMS

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...

CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS

EMBEDDED THIN FILMS

Circuitized substrate and method of making same

Circuitized substrate with internal cooling structure and electrica...

Method of making circuitized substrate with internal optical pathwa...

Method of making circuitized substrate with internal optical pathway

Adhesive bleed prevention method and product produced from same

Photoresist composition with antibacterial agent

Circuitized substrate with soler-coated microparticle paste connect...

Plating method for circuitized substrates

Circuitized substrate with shielded signal lines and plated-thru-ho...

Method of making printed circuit board with varying depth conductiv...

Method of forming printed circuit card

Fabrication of silicon micro-mechanical structures

Colloidal seed formation for printed circuit board metallization

Two signal one power plane circuit board

Fabrication of silicon micro mechanical structures

Colloidal seed formation for printed circuit board metallization

Copper plated PTH barrels and methods for fabricating

Dielectric structure and method of formation

Copper plated PTH barrels and methods for fabricating

Manufacturing computer systems with fine line circuitized substrates