Sankara J. Subramanian

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill device and method
- Patent number 9,516,752
- Issue date Dec 6, 2016
- Intel Corporation
- Patricia A Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill device and method
- Patent number 8,399,291
- Issue date Mar 19, 2013
- Intel Corporation
- Patricia A Brusso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded capacitors for reducing package cracking
- Patent number 7,719,109
- Issue date May 18, 2010
- Intel Corporation
- Mitul Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant structure for an electronic device, method of manufacturi...
- Patent number 7,692,307
- Issue date Apr 6, 2010
- Intel Corporation
- Sudarshan Rangaraj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible core for enhancement of package interconnect reliability
- Patent number 7,633,142
- Issue date Dec 15, 2009
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible core for enhancement of package interconnect reliability
- Patent number 7,352,061
- Issue date Apr 1, 2008
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNDERFILL DEVICE AND METHOD
- Publication number 20130208411
- Publication date Aug 15, 2013
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Compliant structure for an electronic device, method of manufacturi...
- Publication number 20080137318
- Publication date Jun 12, 2008
- Sudarshan Rangaraj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded capacitors for reducing package cracking
- Publication number 20080096310
- Publication date Apr 24, 2008
- Mitul Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible core for enhancement of package interconnect reliablity
- Publication number 20080057630
- Publication date Mar 6, 2008
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible core for enhancement of package interconnect reliability
- Publication number 20080054446
- Publication date Mar 6, 2008
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic assembly having a periphery seal around a thermal i...
- Publication number 20080001282
- Publication date Jan 3, 2008
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No flow underfill device and method
- Publication number 20070026575
- Publication date Feb 1, 2007
- Sankara J. Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill device and method
- Publication number 20070004085
- Publication date Jan 4, 2007
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flexible core for enhancement of package interconnect reliability
- Publication number 20060261464
- Publication date Nov 23, 2006
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package integral heat spreader
- Publication number 20060170094
- Publication date Aug 3, 2006
- Intel Corporation
- Sankara J. Subramanian
- H01 - BASIC ELECTRIC ELEMENTS

Sankara J. Subramanian

Person

Patents Grantslast 30 patents

Underfill device and method

Underfill device and method

Embedded capacitors for reducing package cracking

Compliant structure for an electronic device, method of manufacturi...

Flexible core for enhancement of package interconnect reliability

Flexible core for enhancement of package interconnect reliability

Patents Applicationslast 30 patents

UNDERFILL DEVICE AND METHOD

Compliant structure for an electronic device, method of manufacturi...

Embedded capacitors for reducing package cracking

Flexible core for enhancement of package interconnect reliablity

Flexible core for enhancement of package interconnect reliability

Microelectronic assembly having a periphery seal around a thermal i...

No flow underfill device and method

Underfill device and method

Flexible core for enhancement of package interconnect reliability

Semiconductor package integral heat spreader