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Scott McGrath
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Scotts Valley, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Methods and structures to repair device warpage
Patent number
9,859,234
Issue date
Jan 2, 2018
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flipped die stack
Patent number
9,825,002
Issue date
Nov 21, 2017
Invensas Corporation
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die mount by conformal die coating
Patent number
9,824,999
Issue date
Nov 21, 2017
Invensas Corporation
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stiffened wires for offset BVA
Patent number
9,659,848
Issue date
May 23, 2017
Invensas Corporation
Grant Villavicencio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
Patent number
9,508,689
Issue date
Nov 29, 2016
Invensas Corporation
Reynaldo Co
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die mount by conformal die coating
Patent number
9,252,116
Issue date
Feb 2, 2016
Invensas Corporation
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
Patent number
9,153,517
Issue date
Oct 6, 2015
Invensas Corporation
Reynaldo Co
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die assembly having reduced stress electrical interconnects
Patent number
8,912,661
Issue date
Dec 16, 2014
Invensas Corporation
Scott McGrath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical electrical interconnect formed on support prior to die mount
Patent number
8,742,602
Issue date
Jun 3, 2014
Invensas Corporation
Terrence Caskey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrically interconnected stacked die assemblies
Patent number
8,723,332
Issue date
May 13, 2014
Invensas Corporation
Simon J. S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die mount by conformal die coating
Patent number
8,704,379
Issue date
Apr 22, 2014
Invensas Corporation
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrically interconnected stacked die assemblies
Patent number
8,629,543
Issue date
Jan 14, 2014
Invensas Corporation
Simon J. S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
Patent number
8,324,081
Issue date
Dec 4, 2012
Simon J. S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
Patent number
7,923,349
Issue date
Apr 12, 2011
Vertical Circuits, Inc.
Simon J. S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STIFFENED WIRES FOR OFFSET BVA
Publication number
20170141020
Publication date
May 18, 2017
Invensas Corporation
Grant Villavicencio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES TO REPAIR DEVICE WARPAGE
Publication number
20170040270
Publication date
Feb 9, 2017
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIPPED DIE STACK
Publication number
20170018529
Publication date
Jan 19, 2017
Invensas Corporation
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
Publication number
20160104689
Publication date
Apr 14, 2016
Invensas Corporation
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED...
Publication number
20160027761
Publication date
Jan 28, 2016
Invensas Corporation
Reynaldo Co
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
Publication number
20140213020
Publication date
Jul 31, 2014
Invensas Corporation
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WEDGE
Publication number
20130119117
Publication date
May 16, 2013
Invensas Corporation
Scott McGrath
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
Publication number
20120119385
Publication date
May 17, 2012
Vertical Circuits, Inc.
Reynaldo Co
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS
Publication number
20110272825
Publication date
Nov 10, 2011
Vertical Circuits, Inc.
Scott McGrath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
Publication number
20110147943
Publication date
Jun 23, 2011
Vertical Circuits, Inc.
Simon J.S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrically Interconnected Stacked Die Assemblies
Publication number
20110037159
Publication date
Feb 17, 2011
Vertical Circuits, Inc.
Simon J.S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELE...
Publication number
20100140811
Publication date
Jun 10, 2010
Vertical Circuits, Inc.
Jeffrey S. Leal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE STACKED DIE PACKAGE
Publication number
20090102038
Publication date
Apr 23, 2009
Vertical Circuits, Inc.
SIMON J.S. MCELREA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical Interconnect Formed by Pulsed Dispense
Publication number
20090068790
Publication date
Mar 12, 2009
Vertical Circuits, Inc.
Terrence Caskey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
Publication number
20090065916
Publication date
Mar 12, 2009
VERTICAL CIRCUITS, INC.
Scott Jay Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USI...
Publication number
20080315407
Publication date
Dec 25, 2008
Vertical Circuits, Inc.
Lawrence Douglas Andrews, JR.
G01 - MEASURING TESTING
Information
Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
Publication number
20080315434
Publication date
Dec 25, 2008
Vertical Circuits, Inc.
Simon J.S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
Publication number
20080303131
Publication date
Dec 11, 2008
Vertical Circuits, Inc.
Simon J.S. McElrea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL ELECTRICAL INTERCONNECT FORMED ON SUPPORT PRIOR TO DIE MOUNT
Publication number
20080224279
Publication date
Sep 18, 2008
Vertical Circuits, Inc.
Terrence Caskey
H01 - BASIC ELECTRIC ELEMENTS