Shaw Wei LEE

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe packages having enhanced ground-bond reliability
- Patent number 8,093,707
- Issue date Jan 10, 2012
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal lead frame for micro-array packages
- Patent number 7,846,775
- Issue date Dec 7, 2010
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical die contact structure and fabrication method
- Patent number 7,795,126
- Issue date Sep 14, 2010
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,419,855
- Issue date Sep 2, 2008
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical die contact structure and fabrication method
- Patent number 7,340,181
- Issue date Mar 4, 2008
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging image sensing semiconductor chips
- Patent number 7,205,095
- Issue date Apr 17, 2007
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,161,232
- Issue date Jan 9, 2007
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pad configuration for use in a micro-array integrated circui...
- Patent number 7,087,986
- Issue date Aug 8, 2006
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for dicing semiconductor wafers
- Patent number 6,933,212
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer level packaging of optical imaging s...
- Patent number 6,873,024
- Issue date Mar 29, 2005
- Eastman Kodak Company
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package
- Patent number 6,723,585
- Issue date Apr 20, 2004
- National Semiconductor Corporation
- Nghia Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale and land grid array semiconductor packages
- Patent number 6,551,859
- Issue date Apr 22, 2003
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for use in semiconductor packaging
- Patent number 6,396,135
- Issue date May 28, 2002
- National Semiconductor Corporation
- Glenn C. Narvaez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods and construction for integrated circuit packages
- Patent number 6,362,530
- Issue date Mar 26, 2002
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and method for manufacture thereof
- Patent number 6,284,566
- Issue date Sep 4, 2001
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strips for use in integrated circuit packaging
- Patent number 6,278,618
- Issue date Aug 21, 2001
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a panel of packaged integrated circuits
- Patent number 6,173,490
- Issue date Jan 16, 2001
- National Semiconductor Corporation
- Shaw Wei Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip scale package and method for manufacture thereof
- Patent number 6,140,708
- Issue date Oct 31, 2000
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost ball grid array device and method of manufacture thereof
- Patent number 6,054,338
- Issue date Apr 25, 2000
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate board having an anti-adhesive solder mask
- Patent number 5,796,586
- Issue date Aug 18, 1998
- National Semiconductor, Inc.
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost ball grid array device and method of manufacture thereof
- Patent number 5,783,866
- Issue date Jul 21, 1998
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximized substrate design for grid array based assemblies
- Patent number 5,652,185
- Issue date Jul 29, 1997
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball attachment machine for semiconductor packages
- Patent number 5,620,927
- Issue date Apr 15, 1997
- National Semiconductor Corporation
- Shaw W. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin ball grid array using a flex tape or printed wiring boar...
- Patent number 5,620,928
- Issue date Apr 15, 1997
- National Semiconductor Corporation
- Shaw W. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAP GROUND BOND ENHANCEMENT
- Publication number 20110140253
- Publication date Jun 16, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY
- Publication number 20110089556
- Publication date Apr 21, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN MET...
- Publication number 20100015329
- Publication date Jan 21, 2010
- National Semiconductor Corporation
- Luu T. NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DIE CONTACT STRUCTURE AND FABRICATION METHOD
- Publication number 20080102604
- Publication date May 1, 2008
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS

Shaw Wei LEE

Person

Patents Grantslast 30 patents

Leadframe packages having enhanced ground-bond reliability

Universal lead frame for micro-array packages

Electrical die contact structure and fabrication method

Apparatus and method for miniature semiconductor packages

Electrical die contact structure and fabrication method

Apparatus and method for packaging image sensing semiconductor chips

Apparatus and method for miniature semiconductor packages

Solder pad configuration for use in a micro-array integrated circui...

Apparatus and method for dicing semiconductor wafers

Apparatus and method for wafer level packaging of optical imaging s...

Leadless package

Chip scale and land grid array semiconductor packages

Substrate for use in semiconductor packaging

Manufacturing methods and construction for integrated circuit packages

Chip scale package and method for manufacture thereof

Substrate strips for use in integrated circuit packaging

Method for forming a panel of packaged integrated circuits

Chip scale package and method for manufacture thereof

Low cost ball grid array device and method of manufacture thereof

Substrate board having an anti-adhesive solder mask

Low cost ball grid array device and method of manufacture thereof

Maximized substrate design for grid array based assemblies

Solder ball attachment machine for semiconductor packages

Ultra thin ball grid array using a flex tape or printed wiring boar...

Patents Applicationslast 30 patents

DAP GROUND BOND ENHANCEMENT

LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN MET...

ELECTRICAL DIE CONTACT STRUCTURE AND FABRICATION METHOD