Membership
Tour
Register
Log in
Shingo Ohsaka
Follow
Person
Hakodate-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor package including forming a r...
Patent number
6,887,739
Issue date
May 3, 2005
Renesas Technology Corp.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a resin encapsulated semiconductor device t...
Patent number
6,764,878
Issue date
Jul 20, 2004
Renesas Technology Corp.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device having resin sealing body
Patent number
6,759,279
Issue date
Jul 6, 2004
Renesas Technology Corp.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array type semiconductor package having a flexible substrate
Patent number
6,590,275
Issue date
Jul 8, 2003
Hitachi, Ltd.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array type semiconductor package having a flexible substrate
Patent number
6,476,466
Issue date
Nov 5, 2002
Hitachi Hokkai Semiconductor, Ltd.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
6,448,111
Issue date
Sep 10, 2002
Hitachi Hokkai Semiconductor, Ltd.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array type semiconductor package having a flexible substrate
Patent number
6,437,428
Issue date
Aug 20, 2002
Hitachi Hokkai Semiconductor, Ltd.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a chip mounted on a flexible substrate...
Patent number
6,232,650
Issue date
May 15, 2001
Hitachi, Ltd.
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of manufacturing semiconductor device
Publication number
20040005733
Publication date
Jan 8, 2004
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor device
Publication number
20020192872
Publication date
Dec 19, 2002
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a resin encapsulated semiconductor device t...
Publication number
20020182776
Publication date
Dec 5, 2002
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array type semiconductor package having a flexible substrate
Publication number
20020079579
Publication date
Jun 27, 2002
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array type semiconductor package having a flexible substrate
Publication number
20020070462
Publication date
Jun 13, 2002
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and its manufacturing method
Publication number
20010015489
Publication date
Aug 23, 2001
Atsushi Fujisawa
H01 - BASIC ELECTRIC ELEMENTS