Shiqun Gu

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary ring oscillators to monitor in-situ stress within int...
- Patent number 11,719,584
- Issue date Aug 8, 2023
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,688,704
- Issue date Jun 27, 2023
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die to IC die interconnect using error correcting code and data...
- Patent number 11,545,467
- Issue date Jan 3, 2023
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,233,025
- Issue date Jan 25, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrapped signal shielding in a wafer fanout package
- Patent number 11,101,224
- Issue date Aug 24, 2021
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package with metal post interconnections
- Patent number 10,971,476
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid passive-on-glass (POG) acoustic filter
- Patent number 10,944,379
- Issue date Mar 9, 2021
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,903,240
- Issue date Jan 26, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced internal power pad pitch
- Patent number 10,672,730
- Issue date Jun 2, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous 3D chip stack for a mobile processor
- Patent number 10,658,335
- Issue date May 19, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,523,253
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device comprising a capacitor and inductor structure com...
- Patent number 10,498,307
- Issue date Dec 3, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,332,911
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising switches and filters
- Patent number 10,312,193
- Issue date Jun 4, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced internal power pad pitch
- Patent number 10,304,792
- Issue date May 28, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of backside silicidation to form dual side contacted ca...
- Patent number 10,290,579
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Sinan Goktepeli
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monolithic integrated emitter-detector array in a flexible substrat...
- Patent number 10,271,745
- Issue date Apr 30, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Monolithic integration of antenna switch and diplexer
- Patent number 10,256,863
- Issue date Apr 9, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-sensor device and method of using multi-sensor device for det...
- Patent number 10,182,728
- Issue date Jan 22, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interposer device including at least one transistor and at least on...
- Patent number 10,163,771
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density fan out package structure
- Patent number 10,157,823
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS and bipolar device integration including a tunable capacitor
- Patent number 10,158,030
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-density MIM capacitor for improved passive on glass (POG) mul...
- Patent number 10,141,908
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside ground plane for integrated circuit
- Patent number 10,103,135
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,044,390
- Issue date Aug 7, 2018
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Single-chip multi-frequency film bulk acoustic-wave resonators
- Patent number 10,038,422
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods to reduce parasitic capacitance
- Patent number 9,941,156
- Issue date Apr 10, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system (MEMS) bond release structure and met...
- Patent number 9,922,956
- Issue date Mar 20, 2018
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate block for PoP package
- Patent number 9,881,859
- Issue date Jan 30, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SIDE POWER DELIVERY IN STACKED MEMORY PACKAGING
- Publication number 20220189901
- Publication date Jun 16, 2022
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20220148988
- Publication date May 12, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Tier Processor/Memory Package
- Publication number 20210358894
- Publication date Nov 18, 2021
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Die to IC Die Interconnect Using Error Correcting Code and Data...
- Publication number 20210202447
- Publication date Jul 1, 2021
- Huawei Technologies Co., Ltd
- Shiqun Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH
- Publication number 20190273060
- Publication date Sep 5, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20190259780
- Publication date Aug 22, 2019
- Qualcomm Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH
- Publication number 20190148323
- Publication date May 16, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...
- Publication number 20190081607
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS 3D CHIP STACK FOR A MOBILE PROCESSOR
- Publication number 20180366442
- Publication date Dec 20, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAPPED SIGNAL SHIELDING IN A WAFER FANOUT PACKAGE
- Publication number 20180358303
- Publication date Dec 13, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20180350762
- Publication date Dec 6, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180316374
- Publication date Nov 1, 2018
- Qualcomm Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS AND BIPOLAR DEVICE INTEGRATION INCLUDING A TUNABLE CAPACITOR
- Publication number 20180233604
- Publication date Aug 16, 2018
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER
- Publication number 20180167054
- Publication date Jun 14, 2018
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT
- Publication number 20180090475
- Publication date Mar 29, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE WRAP-AROUND CAPACITORS FOR RADIO FREQUENCY (RF) APPLICATIONS
- Publication number 20180083588
- Publication date Mar 22, 2018
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZATION OF BACKSIDE SILICIDATION TO FORM DUAL SIDE CONTACTED CA...
- Publication number 20180076137
- Publication date Mar 15, 2018
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES IN THIN FILM
- Publication number 20180077803
- Publication date Mar 15, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE
- Publication number 20180061775
- Publication date Mar 1, 2018
- QUALCOMM Incorporated
- Mario Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-CHIP MULTI-FREQUENCY FILM BULK ACOUSTIC-WAVE RESONATORS
- Publication number 20180062617
- Publication date Mar 1, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DENSITY MIM CAPACITOR FOR IMPROVED PASSIVE ON GLASS (POG) MUL...
- Publication number 20180054177
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER DEVICE INCLUDING AT LEAST ONE TRANSISTOR AND AT LEAST ON...
- Publication number 20180040547
- Publication date Feb 8, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180026666
- Publication date Jan 25, 2018
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Sensor Device And Method Of Using Multi-Sensor Device For Det...
- Publication number 20170367594
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Shiqun GU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...
- Publication number 20170373175
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC INTEGRATED EMITTER-DETECTOR ARRAY IN A FLEXIBLE SUBSTRAT...
- Publication number 20170360316
- Publication date Dec 21, 2017
- QUALCOMM Incorporated
- Shiqun GU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MONOLITHIC INTEGRATION OF ANTENNA SWITCH AND DIPLEXER
- Publication number 20170201291
- Publication date Jul 13, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20170098663
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20170084531
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...
- Publication number 20170063079
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Person

Patents Grantslast 30 patents

Multi-tier IC package including processor and high bandwidth memory

Complementary ring oscillators to monitor in-situ stress within int...

Merged power pad for improving integrated circuit power delivery

IC die to IC die interconnect using error correcting code and data...

Merged power pad for improving integrated circuit power delivery

Wrapped signal shielding in a wafer fanout package

Bottom package with metal post interconnections

Hybrid passive-on-glass (POG) acoustic filter

Integrated circuits (ICs) on a glass substrate

Semiconductor package having reduced internal power pad pitch

Heterogenous 3D chip stack for a mobile processor

Glass substrate including passive-on-glass device and semiconductor...

Integrated device comprising a capacitor and inductor structure com...

Integrated circuits (ICs) on a glass substrate

Package comprising switches and filters

Semiconductor package having reduced internal power pad pitch

Utilization of backside silicidation to form dual side contacted ca...

Monolithic integrated emitter-detector array in a flexible substrat...

Monolithic integration of antenna switch and diplexer

Multi-sensor device and method of using multi-sensor device for det...

Interposer device including at least one transistor and at least on...

High density fan out package structure

CMOS and bipolar device integration including a tunable capacitor

Multi-density MIM capacitor for improved passive on glass (POG) mul...

Backside ground plane for integrated circuit

Glass substrate including passive-on-glass device and semiconductor...

Single-chip multi-frequency film bulk acoustic-wave resonators

Systems and methods to reduce parasitic capacitance

Microelectromechanical system (MEMS) bond release structure and met...

Substrate block for PoP package

Patents Applicationslast 30 patents

MULTI-SIDE POWER DELIVERY IN STACKED MEMORY PACKAGING

MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY

Multi-Tier Processor/Memory Package

IC Die to IC Die Interconnect Using Error Correcting Code and Data...

SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH

INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...

HETEROGENOUS 3D CHIP STACK FOR A MOBILE PROCESSOR

WRAPPED SIGNAL SHIELDING IN A WAFER FANOUT PACKAGE

MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

CMOS AND BIPOLAR DEVICE INTEGRATION INCLUDING A TUNABLE CAPACITOR

HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER

BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT

ELECTRODE WRAP-AROUND CAPACITORS FOR RADIO FREQUENCY (RF) APPLICATIONS

UTILIZATION OF BACKSIDE SILICIDATION TO FORM DUAL SIDE CONTACTED CA...

PASSIVES IN THIN FILM

LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE

SINGLE-CHIP MULTI-FREQUENCY FILM BULK ACOUSTIC-WAVE RESONATORS

MULTI-DENSITY MIM CAPACITOR FOR IMPROVED PASSIVE ON GLASS (POG) MUL...

INTERPOSER DEVICE INCLUDING AT LEAST ONE TRANSISTOR AND AT LEAST ON...

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

Multi-Sensor Device And Method Of Using Multi-Sensor Device For Det...

SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...

MONOLITHIC INTEGRATED EMITTER-DETECTOR ARRAY IN A FLEXIBLE SUBSTRAT...

MONOLITHIC INTEGRATION OF ANTENNA SWITCH AND DIPLEXER

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...