Shrikar Bhagath

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power reallocation for memory device
- Patent number 12,068,041
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enclosure fitting for electronic device
- Patent number 11,985,782
- Issue date May 14, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 11,830,849
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Saurabh Nilkanth Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process, DAF replacement
- Patent number 11,552,040
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Siqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having cover portion with curved surfa...
- Patent number 11,551,991
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,094,674
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,011,500
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial memory die
- Patent number 10,290,354
- Issue date May 14, 2019
- SanDisk Technologies LLC
- Daniel Linnen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrinsic gettering on semiconductor devices
- Patent number 9,064,836
- Issue date Jun 23, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-a-package based flash memory card
- Patent number 8,852,999
- Issue date Oct 7, 2014
- SanDisk Technologies Inc.
- Hem Takiar
- G11 - INFORMATION STORAGE
Information Patent Grant
System-in-a-package based flash memory card
- Patent number 8,637,978
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Hem Takiar
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having under-filled die in a die stack
- Patent number 8,575,724
- Issue date Nov 5, 2013
- SanDisk Technologies Inc.
- Shrikar Bhagath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stacked semiconductor package with localized...
- Patent number 8,470,640
- Issue date Jun 25, 2013
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked wire bonded semiconductor package with low profile bond line
- Patent number 8,432,043
- Issue date Apr 30, 2013
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with localized cavities for wire bonding
- Patent number 8,294,251
- Issue date Oct 23, 2012
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stacked wire bonded semiconductor package wit...
- Patent number 8,241,953
- Issue date Aug 14, 2012
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-a-package based flash memory card
- Patent number 8,022,519
- Issue date Sep 20, 2011
- SanDisk Technologies Inc.
- Hem Takiar
- G11 - INFORMATION STORAGE
Information Patent Grant
Padless substrate for surface mounted components
- Patent number 7,967,184
- Issue date Jun 28, 2011
- SanDisk Corporation
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of under-filling semiconductor die in a die stack and semico...
- Patent number 7,816,181
- Issue date Oct 19, 2010
- SanDisk Corporation
- Shrikar Bhagath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe based flash memory cards
- Patent number 7,795,715
- Issue date Sep 14, 2010
- SanDisk Corporation
- Hem Takiar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having multiple die redistribution layer
- Patent number 7,791,191
- Issue date Sep 7, 2010
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having multiple die redistr...
- Patent number 7,560,304
- Issue date Jul 14, 2009
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pads on flash memory cards
- Patent number 7,495,255
- Issue date Feb 24, 2009
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating leadframe based flash memory cards including...
- Patent number 7,488,620
- Issue date Feb 10, 2009
- SanDisk Corporation
- Hem Takiar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing flash memory cards
- Patent number 7,485,501
- Issue date Feb 3, 2009
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pads on flash memory cards
- Patent number 7,259,028
- Issue date Aug 21, 2007
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SIP based flash memory card
- Patent number D548740
- Issue date Aug 14, 2007
- SanDisk Corporation
- Hem Takiar
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Heat sink grounded to a grounded package lid
- Patent number 6,512,675
- Issue date Jan 28, 2003
- Advanced Micro Devices, Inc.
- Thomas S. Tarter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package compatible with multiple die footprints and metho...
- Patent number 6,229,219
- Issue date May 8, 2001
- Advanced Micro Devices, Inc.
- Shrikar Bhagath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER REALLOCATION FOR MEMORY DEVICE
- Publication number 20240371447
- Publication date Nov 7, 2024
- SANDISK TECHNOLOGIES, INC.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enclosure fitting for electronic device
- Publication number 20230328910
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device With Unbalanced Die Stackup
- Publication number 20230133965
- Publication date May 4, 2023
- Western Digital Technologies, Inc.
- Saurabh Nilkanth Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SSD SEMICONDUCTOR DEVICE
- Publication number 20230137512
- Publication date May 4, 2023
- Western Digital Technologies, Inc.
- Hui Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER REALLOCATION FOR MEMORY DEVICE
- Publication number 20220293195
- Publication date Sep 15, 2022
- Western Digital Technologies, Inc.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE PROCESS, DAF REPLACEMENT
- Publication number 20220028819
- Publication date Jan 27, 2022
- Western Digital Technologies, Inc.
- Siqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...
- Publication number 20210384099
- Publication date Dec 9, 2021
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210104495
- Publication date Apr 8, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210104494
- Publication date Apr 8, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIAL MEMORY DIE
- Publication number 20190130978
- Publication date May 2, 2019
- SanDisk Technologies LLC
- Daniel Linnen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20150214184
- Publication date Jul 30, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20120279651
- Publication date Nov 8, 2012
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD
- Publication number 20120009732
- Publication date Jan 12, 2012
- Hem Takiar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD
- Publication number 20120007226
- Publication date Jan 12, 2012
- Hem Takiar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-FILLED DIE IN A DIE STACK
- Publication number 20110024881
- Publication date Feb 3, 2011
- Shrikar Bhagath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WIRE BONDED SEMICONDUCTOR PACKAGE WITH LOW PROFILE BOND LINE
- Publication number 20090321951
- Publication date Dec 31, 2009
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING STACKED WIRE BONDED SEMICONDUCTOR PACKAGE WIT...
- Publication number 20090325344
- Publication date Dec 31, 2009
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE WITH LOCALIZED CAVITIES FOR WIRE BONDING
- Publication number 20090321950
- Publication date Dec 31, 2009
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING STACKED SEMICONDUCTOR PACKAGE WITH LOCALIZED...
- Publication number 20090325342
- Publication date Dec 31, 2009
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSOP LEADFRAME STRIP OF MULTIPLY ENCAPSULATED PACKAGES
- Publication number 20090166820
- Publication date Jul 2, 2009
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME BASED FLASH MEMORY CARDS
- Publication number 20090134502
- Publication date May 28, 2009
- SANDISK CORPORATION
- Hem Takiar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND
- Publication number 20080237887
- Publication date Oct 2, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...
- Publication number 20080242076
- Publication date Oct 2, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTRIBUTION LAYER
- Publication number 20080157355
- Publication date Jul 3, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTR...
- Publication number 20080160674
- Publication date Jul 3, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING USING INSULATED WIRE BONDS
- Publication number 20080128880
- Publication date Jun 5, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a film-on-wire bond semiconductor device
- Publication number 20080131998
- Publication date Jun 5, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIE STACKING USING INSULATED WIRE BONDS
- Publication number 20080131999
- Publication date Jun 5, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS

Shrikar Bhagath

Person

Patents Grantslast 30 patents

Power reallocation for memory device

Enclosure fitting for electronic device

Semiconductor device with unbalanced die stackup

Package process, DAF replacement

Semiconductor device package having cover portion with curved surfa...

Memory scaling semiconductor device

Memory scaling semiconductor device

Partial memory die

Semiconductor device including die bond pads at a die edge

Extrinsic gettering on semiconductor devices

System-in-a-package based flash memory card

System-in-a-package based flash memory card

Semiconductor device having under-filled die in a die stack

Method of fabricating stacked semiconductor package with localized...

Stacked wire bonded semiconductor package with low profile bond line

Stacked semiconductor package with localized cavities for wire bonding

Method of fabricating stacked wire bonded semiconductor package wit...

System-in-a-package based flash memory card

Padless substrate for surface mounted components

Method of under-filling semiconductor die in a die stack and semico...

Leadframe based flash memory cards

Semiconductor device having multiple die redistribution layer

Method of making a semiconductor device having multiple die redistr...

Test pads on flash memory cards

Method of fabricating leadframe based flash memory cards including...

Method of manufacturing flash memory cards

Test pads on flash memory cards

SIP based flash memory card

Heat sink grounded to a grounded package lid

Flip chip package compatible with multiple die footprints and metho...

Patents Applicationslast 30 patents

POWER REALLOCATION FOR MEMORY DEVICE

Semiconductor Device Package with Die Stackup and Interposer

Enclosure fitting for electronic device

Semiconductor Device With Unbalanced Die Stackup

STACKED SSD SEMICONDUCTOR DEVICE

POWER REALLOCATION FOR MEMORY DEVICE

PACKAGE PROCESS, DAF REPLACEMENT

SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...

MEMORY SCALING SEMICONDUCTOR DEVICE

MEMORY SCALING SEMICONDUCTOR DEVICE

PARTIAL MEMORY DIE

SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD

SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD

SEMICONDUCTOR DEVICE HAVING UNDER-FILLED DIE IN A DIE STACK

STACKED WIRE BONDED SEMICONDUCTOR PACKAGE WITH LOW PROFILE BOND LINE

METHOD OF FABRICATING STACKED WIRE BONDED SEMICONDUCTOR PACKAGE WIT...

STACKED SEMICONDUCTOR PACKAGE WITH LOCALIZED CAVITIES FOR WIRE BONDING

METHOD OF FABRICATING STACKED SEMICONDUCTOR PACKAGE WITH LOCALIZED...

TSOP LEADFRAME STRIP OF MULTIPLY ENCAPSULATED PACKAGES

LEADFRAME BASED FLASH MEMORY CARDS

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...

SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTRIBUTION LAYER

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTR...

DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

METHOD OF DIE STACKING USING INSULATED WIRE BONDS