Shunsuke SAKAI

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,477,682
- Issue date Nov 12, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with conductor post having multiple surface ro...
- Patent number 10,070,523
- Issue date Sep 4, 2018
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with built-in electronic component
- Patent number 9,859,221
- Issue date Jan 2, 2018
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and semiconductor package
- Patent number 9,564,392
- Issue date Feb 7, 2017
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,320,148
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with built-in electronic component and meth...
- Patent number 9,282,635
- Issue date Mar 8, 2016
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,119,322
- Issue date Aug 25, 2015
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,957,320
- Issue date Feb 17, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,908,387
- Issue date Dec 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,829,357
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,642,897
- Issue date Feb 4, 2014
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 8,466,372
- Issue date Jun 18, 2013
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,299,366
- Issue date Oct 30, 2012
- Ibiden Co., Ltd.
- Kenji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240206057
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230380076
- Publication date Nov 23, 2023
- IBIDEN CO., LTD.
- Masataka KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230380055
- Publication date Nov 23, 2023
- IBIDEN CO., LTD.
- Masataka KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20220192018
- Publication date Jun 16, 2022
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190215958
- Publication date Jul 11, 2019
- IBIDEN CO., LTD.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160336261
- Publication date Nov 17, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160316558
- Publication date Oct 27, 2016
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20160255717
- Publication date Sep 1, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...
- Publication number 20160044783
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160043024
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20150282305
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20150245492
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150022982
- Publication date Jan 22, 2015
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20140247571
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130194764
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130192883
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20120250277
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186866
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120188734
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20120142147
- Publication date Jun 7, 2012
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120085572
- Publication date Apr 12, 2012
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20110240354
- Publication date Oct 6, 2011
- IBIDEN CO., LTD.
- Naoki FURUHATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100300737
- Publication date Dec 2, 2010
- IBIDEN, CO., LTD.
- Kenji SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20100078205
- Publication date Apr 1, 2010
- IBIDEN, CO., LTD.
- Shunsuke SAKAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Shunsuke SAKAI

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing the same

Printed wiring board with conductor post having multiple surface ro...

Multilayer wiring board with built-in electronic component

Printed wiring board and semiconductor package

Printed wiring board

Multilayer wiring board with built-in electronic component and meth...

Wiring board and method for manufacturing the same

Printed wiring board

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER WIRING BOARD

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...